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    Packaging For Micro Electro-Mechanical Systems And Methods Of Fabricating Thereof
    12.
    发明申请
    Packaging For Micro Electro-Mechanical Systems And Methods Of Fabricating Thereof 有权
    微机电系统的包装及其制造方法

    公开(公告)号：US20100307786A1

    公开(公告)日：2010-12-09

    申请号：US12797649

    申请日：2010-06-10

    Applicant: Paul A. Kohl ,  Farrokh Ayazi ,  Paul J. Joseph

    Inventor： Paul A. Kohl ,  Farrokh Ayazi ,  Paul J. Joseph

    IPC: H05K5/06

    CPC classification number: B81C1/00333 ,  B81C2201/0108 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: Embodiments of the present disclosure provide systems and methods for producing micro electro-mechanical device packages. Briefly described, in architecture, one embodiment of the system, among others, includes a micro electro-mechanical device formed on a substrate layer; and a thermally decomposable sacrificial structure protecting at least a portion of the micro electro-mechanical device, where the sacrificial structure is formed on the substrate layer and surrounds a gas cavity enclosing an active surface of the micro electro-mechanical device. Other systems and methods are also provided.

    Abstract translation: 本公开的实施例提供了用于生产微机电装置包装的系统和方法。 简要描述，在架构中，系统的一个实施例包括形成在基底层上的微电子机械装置; 以及可热分解的牺牲结构，其保护所述微机电装置的至少一部分，其中所述牺牲结构形成在所述基底层上并且围绕包围所述微机电装置的有效表面的气体腔。 还提供了其他系统和方法。

    Method of creating MEMS device cavities by a non-etching process
    14.
    发明授权
    Method of creating MEMS device cavities by a non-etching process 有权
    通过非蚀刻工艺制造MEMS器件腔的方法

    公开(公告)号：US07795061B2

    公开(公告)日：2010-09-14

    申请号：US11321134

    申请日：2005-12-29

    Applicant: Chun-Ming Wang ,  Jeffrey Lan ,  Teruo Sasagawa

    Inventor： Chun-Ming Wang ,  Jeffrey Lan ,  Teruo Sasagawa

    IPC: H01L21/00

    CPC classification number: B81C1/00047 ,  B81B2201/047 ,  B81C2201/0108 ,  B81C2201/0111 ,  G02B26/001

    Abstract: MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One embodiment provides a method of making a MEMS device that includes depositing a polymer layer over a substrate, forming an electrically conductive layer over the polymer layer, and vaporizing at least a portion of the polymer layer to form a cavity between the substrate and the electrically conductive layer. Another embodiment provides a method for making an interferometric modulator that includes providing a substrate, depositing a first electrically conductive material over at least a portion of the substrate, depositing a sacrificial material over at least a portion of the first electrically conductive material, depositing an insulator over the substrate and adjacent to the sacrificial material to form a support structure, and depositing a second electrically conductive material over at least a portion of the sacrificial material, the sacrificial material being removable by heat-vaporization to thereby form a cavity between the first electrically conductive layer and the second electrically conductive layer.

    Abstract translation: 可以使用包含热可汽化聚合物以在可移动层和基底之间形成间隙的牺牲层来制造MEMS器件（例如干涉式调制器）。 一个实施例提供了一种制造MEMS器件的方法，该MEMS器件包括在衬底上沉积聚合物层，在聚合物层上形成导电层，并蒸发聚合物层的至少一部分以在衬底和电 导电层。 另一个实施例提供了制造干涉式调制器的方法，该方法包括提供衬底，在衬底的至少一部分上沉积第一导电材料，在第一导电材料的至少一部分上沉积牺牲材料，沉积绝缘体 在所述衬底上并且邻近所述牺牲材料以形成支撑结构，以及在所述牺牲材料的至少一部分上沉积第二导电材料，所述牺牲材料可通过热蒸发而被去除，从而在所述第一电 导电层和第二导电层。

    FABRICATION METHOD FOR HOLLOW MICRONEEDLES FOR DRUG DELIVERY
    15.
    发明申请
    FABRICATION METHOD FOR HOLLOW MICRONEEDLES FOR DRUG DELIVERY 有权
    用于药物输送的中空麦芽糖的制造方法

    公开(公告)号：US20100062142A1

    公开(公告)日：2010-03-11

    申请号：US12348589

    申请日：2009-01-05

    Applicant: Mingwei Zhu ,  Yanfeng Chen ,  Zhenlin Wang ,  Yanqing Lu ,  Haixiong Ge ,  Yuefeng Tang

    Inventor： Mingwei Zhu ,  Yanfeng Chen ,  Zhenlin Wang ,  Yanqing Lu ,  Haixiong Ge ,  Yuefeng Tang

    IPC: B05D3/00

    CPC classification number: B81C1/00476 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0053 ,  B81B2201/055 ,  B81B2203/0338 ,  B81B2203/0361 ,  B81C2201/0108

    Abstract: A novel method suitable for commercially mass production of hollow microneedle with high quality for delivery of drugs across or into biological tissue is provided. It typically includes the following processes: (1) coating an elongated template of a first material with a second material to form a cover; (2) removing tips of the template and cover to form an opening in the cover; and (3) removing the template of the first material to obtain hollow microneedles of the second material. This simple, efficient and cost-effective fabrication method can mass produce hollow microneedle arrays involving no complicated and expensive equipments or techniques, which can be used in commercial fabrication of hollow needles for delivering drugs or genes across or into skin or other tissue barriers with advantages of minimal damage, painless, long-term and continuous usages.

    Abstract translation: 提供了一种适用于商业上大规模生产用于将药物跨越或进入生物组织的高品质的中空微针的新方法。 它通常包括以下过程：（1）用第二材料涂覆第一材料的细长模板以形成盖子; （2）去除模板和盖子的尖端以在盖子上形成开口; 和（3）去除第一材料的模板以获得第二材料的中空微针。 这种简单，高效和成本有效的制造方法可以大规模生产中空微针阵列，其不涉及复杂而昂贵的设备或技术，其可用于商业制造用于将药物或基因跨越或进入皮肤或其它组织屏障的中空针 最小的伤害，无痛，长期和持续的使用。

    Adjustable solubility in sacrificial layers for microfabrication
    16.
    发明申请
    Adjustable solubility in sacrificial layers for microfabrication 有权
    用于微细加工的牺牲层中可调节的溶解度

    公开(公告)号：US20090236310A1

    公开(公告)日：2009-09-24

    申请号：US11918269

    申请日：2006-04-14

    Applicant: Vincent Linder ,  Byron Gates ,  Declan Ryan ,  Babak Amirparviz ,  George M. Whitesides

    Inventor： Vincent Linder ,  Byron Gates ,  Declan Ryan ,  Babak Amirparviz ,  George M. Whitesides

    IPC: B44C1/22

    CPC classification number: B81C1/00246 ,  B81C2201/0108 ,  B81C2203/0735 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

    Abstract: The present invention provides fabrication methods using sacrificial materials comprising polymers. In some embodiments, the polymer may be treated to alter its solubility with respect to at least one solvent (e.g., aqueous solution) used in the fabrication process. The preparation of the sacrificial materials is rapid and simple, and dissolution of the sacrificial material can be carried out in mild environments. Sacrificial materials of the present invention may be useful for surface micromachining, bulk micromachining, and other microfabrication processes in which a sacrificial layer is employed for producing a selected and corresponding physical structure.

    Abstract translation: 本发明提供了使用包含聚合物的牺牲材料的制造方法。 在一些实施方案中，可以处理聚合物以改变其相对于在制造过程中使用的至少一种溶剂（例如水溶液）的溶解度。 牺牲材料的制备是快速和简单的，牺牲材料的溶解可以在温和的环境中进行。 本发明的牺牲材料可用于表面微加工，体微加工和其它微加工工艺，其中牺牲层用于产生选定的和相应的物理结构。

    Method of fabricating microstructures
    17.
    发明申请
    Method of fabricating microstructures 审中-公开
    制造微结构的方法

    公开(公告)号：US20080200029A1

    公开(公告)日：2008-08-21

    申请号：US12001330

    申请日：2007-12-10

    Applicant: Joontae Song ,  Hyunsuk Hwang

    Inventor： Joontae Song ,  Hyunsuk Hwang

    IPC: H01L21/44 ,  H01L21/311

    CPC classification number: B81C1/00944 ,  B81C2201/0108

    Abstract: Provided is a method of fabricating a microstructure, and more specifically, a method of fabricating a structure of a Micro Electro Mechanical System (MEMS), which includes the step of applying and patterning a material for the sacrificial layer on a silicon substrate, and forming a post with the same material as the sacrificial layer material, so that a stiction problem can be prevented in advance at the time of fabricating the microstructure, only one process needs to be added to simplify fabrication of a post, and the sacrificial layer can be formed in a desired shape because a photoresist is used as the sacrificial layer material.

    Abstract translation: 提供一种制造微结构的方法，更具体地说，一种制造微机电系统（MEMS）的结构的方法，其包括在硅衬底上施加和图案化用于牺牲层的材料的步骤，并且形成 具有与牺牲层材料相同的材料的柱，使得在制造微结构时可以预先防止静电问题，仅需要添加一个工艺以简化柱的制造，并且牺牲层可以是 形成为期望的形状，因为光致抗蚀剂被用作牺牲层材料。

    Systems and methods for three-dimensional lithography and nano-indentation
    20.
    发明申请
    Systems and methods for three-dimensional lithography and nano-indentation 审中-公开
    三维光刻和纳米压痕的系统和方法

    公开(公告)号：US20050257709A1

    公开(公告)日：2005-11-24

    申请号：US10699287

    申请日：2003-10-31

    Applicant: Tony Mule ,  Paul Kohl ,  Muhannad Bakir ,  Kevin Martin ,  James Meindl ,  Hiren Thacker

    Inventor： Tony Mule ,  Paul Kohl ,  Muhannad Bakir ,  Kevin Martin ,  James Meindl ,  Hiren Thacker

    IPC: B41F1/00 ,  B81C1/00 ,  G03F7/00

    CPC classification number: G03F7/00 ,  B81B2201/042 ,  B81B2201/047 ,  B81B2201/058 ,  B81B2203/0384 ,  B81C1/00119 ,  B81C2201/0108 ,  B81C2201/0152 ,  B81C2201/0159 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/0015

    Abstract: Systems and methods for three dimensional lithography, nano-indentation, and combinations thereof are disclosed. One exemplary three dimensional lithography method, among others, includes: providing a substrate having at least one optical element, wherein the optical element is selected from a refractive element and a diffractive element; disposing a polymer layer on the substrate and the at least one optical element, wherein the polymer layer includes a polymer material selected from a positive-tone polymer material and a negative-tone polymer material; positioning a mask adjacent the polymer layer, wherein the mask does not cover at least one directly exposed portion of the polymer material directly overlaying the at least one element; and exposing the at least one directly exposed portion of the polymer material to optical energy, wherein the optical energy passes through the at least one directly exposed portion of the polymer material and interacts with the element, and the element redirects the optical energy through the polymer material forming at least one area of indirectly exposed polymer material.

    Abstract translation: 公开了用于三维光刻，纳米压痕及其组合的系统和方法。 一种示例性的三维光刻方法，其中包括：提供具有至少一个光学元件的衬底，其中所述光学元件选自折射元件和衍射元件; 在所述基板和所述至少一个光学元件上设置聚合物层，其中所述聚合物层包括选自正性聚合物材料和负性聚合物材料的聚合物材料; 将掩模定位在所述聚合物层附近，其中所述掩模不覆盖直接覆盖所述至少一个元件的聚合物材料的至少一个直接暴露部分; 并且将所述聚合物材料的至少一个直接暴露部分暴露于光能，其中所述光能通过所述聚合物材料的所述至少一个直接暴露部分并且与所述元件相互作用，并且所述元件将所述光能重定向通过所述聚合物 形成间接暴露的聚合物材料的至少一个区域的材料。

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