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公开(公告)号：US20170153445A1
公开(公告)日：2017-06-01
申请号：US14955060
申请日：2015-12-01
Applicant: APPLE INC.
Inventor： Yuval Gerson , Alexander Shpunt
CPC classification number: G02B26/101 , B81B3/00 , B81B3/007 , B81B2201/033 , B81B2201/034 , B81B2201/047 , B81B2203/0136 , B81B2203/058 , B81B2207/015 , B81C1/00515 , B81C2201/0111 , G01S7/4817 , G01S7/497 , G01S17/10 , G01S17/42 , G01S17/89 , G02B26/0833
Abstract: A scanning device includes a frame, having a central opening, and an array including a plurality of parallel mirrors contained within the central opening of the frame. Hinges respectively connect the mirrors to the frame and define respective, mutually-parallel axes of rotation of the mirrors relative to the frame. A main drive applies a driving force to the array so as to drive an oscillation of the mirrors about the hinges at a resonant frequency of the array. A sensor is configured to detect a discrepancy in a synchronization of the oscillation among the mirrors in the array, and an adjustment circuit applies a corrective signal to at least one of the mirrors in order to alleviate the detected discrepancy.
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公开(公告)号：US20100271688A1
公开(公告)日：2010-10-28
申请号：US12831898
申请日：2010-07-07
Applicant: Chun-Ming Wang , Jeffrey Lan , Teruo Sasagawa
Inventor： Chun-Ming Wang , Jeffrey Lan , Teruo Sasagawa
IPC: G02F1/19
CPC classification number: B81C1/00047 , B81B2201/047 , B81C2201/0108 , B81C2201/0111 , G02B26/001
Abstract: MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One embodiment provides a method of making a MEMS device that includes depositing a polymer layer over a substrate, forming an electrically conductive layer over the polymer layer, and vaporizing at least a portion of the polymer layer to form a cavity between the substrate and the electrically conductive layer. Another embodiment provides a method for making an interferometric modulator that includes providing a substrate, depositing a first electrically conductive material over at least a portion of the substrate, depositing a sacrificial material over at least a portion of the first electrically conductive material, depositing an insulator over the substrate and adjacent to the sacrificial material to form a support structure, and depositing a second electrically conductive material over at least a portion of the sacrificial material, the sacrificial material being removable by heat-vaporization to thereby form a cavity between the first electrically conductive layer and the second electrically conductive layer.
Abstract translation: 可以使用包含热可汽化聚合物以在可移动层和基底之间形成间隙的牺牲层来制造MEMS器件（例如干涉式调制器）。 一个实施例提供了一种制造MEMS器件的方法，该MEMS器件包括在衬底上沉积聚合物层，在聚合物层上形成导电层，并蒸发聚合物层的至少一部分以在衬底和电 导电层。 另一个实施例提供了制造干涉式调制器的方法，该方法包括提供衬底，在衬底的至少一部分上沉积第一导电材料，在第一导电材料的至少一部分上沉积牺牲材料，沉积绝缘体 在所述衬底上并且邻近所述牺牲材料以形成支撑结构，以及在所述牺牲材料的至少一部分上沉积第二导电材料，所述牺牲材料可通过热蒸发而被去除，从而在所述第一电 导电层和第二导电层。
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13.发明申请公开(公告)号：US20170339494A1
公开(公告)日：2017-11-23
申请号：US15365590
申请日：2016-11-30
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Matteo PERLETTI , Igor VARISCO , Luca LAMAGNA , Silvia ADORNO , Gabriele GATTERE , Carlo VALZASINA , Sebastiano CONTI
CPC classification number: H04R19/005 , B81B3/0021 , B81B2201/0257 , B81B2203/0127 , B81B2203/0136 , B81B2203/0315 , B81B2203/04 , B81B2203/053 , B81C1/00158 , B81C2201/0109 , B81C2201/0111 , B81C2201/0133 , G01H11/06 , H04R31/00 , H04R2201/003 , H04R2201/023
Abstract: A MEMS acoustic transducer provided with: a substrate of semiconductor material, having a back surface and a front surface opposite with respect to a vertical direction; a first cavity formed within the substrate, which extends from the back surface to the front surface; a membrane which is arranged at the upper surface, suspended above the first cavity and anchored along a perimeter thereof to the substrate; and a combfingered electrode arrangement including a number of mobile electrodes coupled to the membrane and a number of fixed electrodes coupled to the substrate and facing respective mobile electrodes for forming a sensing capacitor, wherein a deformation of the membrane as a result of incident acoustic pressure waves causes a capacitive variation of the sensing capacitor. In particular, the combfingered electrode arrangement lies vertically with respect to the membrane and extends parallel thereto.
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公开(公告)号：US20170166435A1
公开(公告)日：2017-06-15
申请号：US15441791
申请日：2017-02-24
Inventor： Chia-Hua Chu , Kuei-Sung Chang , Chung-Hsien Lin
CPC classification number: B81B3/0005 , B81B3/001 , B81B7/007 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/07 , B81B2207/092 , B81B2207/095 , B81B2207/096 , B81C1/00269 , B81C1/00579 , B81C2201/0111 , B81C2201/014 , B81C2201/0176 , B81C2203/0118 , B81C2203/019
Abstract: A method for forming a MEMS structure includes forming, on a MEMS substrate, an interconnect structure having conductive lines and a first conductive plug of a semiconductor material, forming an etch stop layer on the interconnect structure, forming a dielectric layer over the etch stop layer, bonding a silicon substrate over the dielectric layer, forming a second and third conductive plugs of the semiconductor material in the silicon substrate, wherein the second conductive plug is configured to be electrically coupled with the first conductive plug and third conductive plug is configured to function as an anti-stiction bump, forming a MEMS device electrically coupled with the second conductive feature, and forming a bonding pad on the silicon substrate and surrounded by the second conductive plug.
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公开(公告)号：US08394656B2
公开(公告)日：2013-03-12
申请号：US12831898
申请日：2010-07-07
Applicant: Chun-Ming Wang , Jeffrey Lan , Teruo Sasagawa
Inventor： Chun-Ming Wang , Jeffrey Lan , Teruo Sasagawa
IPC: H01L21/00
CPC classification number: B81C1/00047 , B81B2201/047 , B81C2201/0108 , B81C2201/0111 , G02B26/001
Abstract: MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One embodiment provides a method of making a MEMS device that includes depositing a polymer layer over a substrate, forming an electrically conductive layer over the polymer layer, and vaporizing at least a portion of the polymer layer to form a cavity between the substrate and the electrically conductive layer. Another embodiment provides a method for making an interferometric modulator that includes providing a substrate, depositing a first electrically conductive material over at least a portion of the substrate, depositing a sacrificial material over at least a portion of the first electrically conductive material, depositing an insulator over the substrate and adjacent to the sacrificial material to form a support structure, and depositing a second electrically conductive material over at least a portion of the sacrificial material, the sacrificial material being removable by heat-vaporization to thereby form a cavity between the first electrically conductive layer and the second electrically conductive layer.
Abstract translation: 可以使用包含热可汽化聚合物以在可移动层和基底之间形成间隙的牺牲层来制造MEMS器件（例如干涉式调制器）。 一个实施例提供了一种制造MEMS器件的方法，该MEMS器件包括在衬底上沉积聚合物层，在聚合物层上形成导电层，并蒸发聚合物层的至少一部分以在衬底和电 导电层。 另一个实施例提供了制造干涉式调制器的方法，该方法包括提供衬底，在衬底的至少一部分上沉积第一导电材料，在第一导电材料的至少一部分上沉积牺牲材料，沉积绝缘体 在所述衬底上并且邻近所述牺牲材料以形成支撑结构，以及在所述牺牲材料的至少一部分上沉积第二导电材料，所述牺牲材料可通过热蒸发而被去除，从而在所述第一电 导电层和第二导电层。
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Patent Agency Ranking
公开(公告)号：US20120276674A1
公开(公告)日：2012-11-01
申请号：US13466595
申请日：2012-05-08
Applicant: Mehran Mehregany
Inventor： Mehran Mehregany
IPC: H01L21/306
CPC classification number: G01P15/18 , B81B2201/0235 , B81C1/00182 , B81C2201/0111 , G01P15/0802 , G01P15/125 , G01P15/131 , G01P2015/084 , Y10T29/49156
Abstract: MEMS accelerometers have a substrate, and a proof mass portion thereof which is separated from the substrate surrounding it by a gap. An electrically-conductive anchor is coupled to the proof mass, and a plurality of electrically-conductive suspension anus that are separated from the proof mass extend from the anchor and are coupled to the substrate surrounding the proof mass. A plurality of sense and actuation electrodes are separated from the proof mass by gaps and are coupled to processing electronics. The fabrication methods use deep reactive ion etch bulk micromachining and surface micromachining to form the proof mass, suspension arms and electrodes. The anchor, suspension arms and electrodes are made in the same process steps from the same electrically conductive material, which is different from the substrate material.
Abstract translation: MEMS加速度计具有基板和其与其周围的基板间隔开的检验质量部分。 导电锚固体耦合到检测质量块，并且与防护物质分离的多个导电悬浮肛门从锚固体延伸并且耦合到围绕证明物质的基底。 多个感测和致动电极通过间隙与证明块分离，并且耦合到处理电子器件。 制造方法使用深反应离子蚀刻体微加工和表面微加工形成证明质量块，悬臂和电极。 锚固器，悬架臂和电极由与基板材料不同的相同导电材料以相同的工艺步骤制成。
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公开(公告)号：US20110209343A1
公开(公告)日：2011-09-01
申请号：US13032081
申请日：2011-02-22
Applicant: Mehran Mehregany
Inventor： Mehran Mehregany
IPC: H05K3/02
CPC classification number: G01P15/18 , B81B2201/0235 , B81C1/00182 , B81C2201/0111 , G01P15/0802 , G01P15/125 , G01P15/131 , G01P2015/084 , Y10T29/49156
Abstract: Disclosed are MEMS accelerometers and methods for fabricating same. An exemplary accelerometer comprises a substrate, and a proof mass that is a portion of the substrate and which is separated from the substrate surrounding it by a gap. An electrically-conductive anchor is coupled to the proof mass, and a plurality of electrically-conductive suspension anus that are separated from the proof mass extend from the anchor and are coupled to the substrate surrounding the proof mass. A plurality of sense and actuation electrodes are separated from the proof mass by gaps and are coupled to processing electronics. Capacitive sensing is used to derive electrical signals caused by forces exerted on the proof mass, and the electrical signals are processed by the processing electronics to produce x-, y- and z-direction acceleration data. Electrostatic actuation is used to induce movements of the mass for force balance operation, or self-test and self-calibration. The fabrication methods use deep reactive ion etch bulk micromachining and surface micromachining to form the proof mass, suspension arms and electrodes. The anchor, suspension arms and electrodes are made in the same process steps from the same electrically conductive material, which is different from the substrate material.
Abstract translation: 公开了MEMS加速度计及其制造方法。 示例性的加速度计包括基板和作为基板的一部分的检测质量块，并且其与通过间隙围绕其的基板分离。 导电锚固体耦合到检测质量块，并且与防护物质分离的多个导电悬浮肛门从锚固体延伸并且耦合到围绕证明物质的基底。 多个感测和致动电极通过间隙与证明块分离，并且耦合到处理电子器件。 电容感测用于导出由施加在检验质量上的力引起的电信号，并且电信号由处理电子器件处理以产生x，y和z方向的加速度数据。 静电驱动用于引起质量的运动，用于力平衡运行，或自检和自校准。 制造方法使用深反应离子蚀刻体微加工和表面微加工形成证明质量块，悬臂和电极。 锚固器，悬架臂和电极由与基板材料不同的相同导电材料以相同的工艺步骤制成。
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公开(公告)号：US20090280594A1
公开(公告)日：2009-11-12
申请号：US12503382
申请日：2009-07-15
Applicant: Mehran Mehregany
Inventor： Mehran Mehregany
IPC: H01L21/30
CPC classification number: G01P15/18 , B81B2201/0235 , B81C1/00182 , B81C2201/0111 , G01P15/0802 , G01P15/125 , G01P15/131 , G01P2015/084 , Y10T29/49156
Abstract: Disclosed are MEMS accelerometers and methods for fabricating same. An exemplary accelerometer comprises a substrate, and a proof mass that is a portion of the substrate and which is separated from the substrate surrounding it by a gap. An electrically-conductive anchor is coupled to the proof mass, and a plurality of electrically-conductive suspension anus that are separated from the proof mass extend from the anchor and are coupled to the substrate surrounding the proof mass. A plurality of sense and actuation electrodes are separated from the proof mass by gaps and are coupled to processing electronics. Capacitive sensing is used to derive electrical signals caused by forces exerted on the proof mass, and the electrical signals are processed by the processing electronics to produce x-, y- and z-direction acceleration data. Electrostatic actuation is used to induce movements of the mass for force balance operation, or self-test and self-calibration. The fabrication methods use deep reactive ion etch bulk micromachining and surface micromachining to form the proof mass, suspension arms and electrodes. The anchor, suspension arms and electrodes are made in the same process steps from the same electrically conductive material, which is different from the substrate material.
Abstract translation: 公开了MEMS加速度计及其制造方法。 示例性的加速度计包括基板和作为基板的一部分的检测质量块，并且与基板周围的基板间隔开。 导电锚固体耦合到检测质量块，并且与防护物质分离的多个导电悬浮肛门从锚固体延伸并且耦合到围绕证明物质的基底。 多个感测和致动电极通过间隙与证明块分离，并且耦合到处理电子器件。 电容感测用于导出由施加在检验质量上的力引起的电信号，并且电信号由处理电子器件处理以产生x，y和z方向的加速度数据。 静电驱动用于引起质量的运动，用于力平衡运行，或自检和自校准。 制造方法使用深反应离子蚀刻体微加工和表面微加工形成证明质量块，悬臂和电极。 锚固器，悬架臂和电极由与基板材料不同的相同导电材料以相同的工艺步骤制成。
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公开(公告)号：US20070224720A1
公开(公告)日：2007-09-27
申请号：US11640849
申请日：2006-12-19
Applicant: Cheng-Chang Lee , Hsueh-Kuo Liao , Shih-Peng Chen , Tai-Kang Shing , Huang-Kun Chen
Inventor： Cheng-Chang Lee , Hsueh-Kuo Liao , Shih-Peng Chen , Tai-Kang Shing , Huang-Kun Chen
IPC: H01L21/00
CPC classification number: B81C1/0019 , B81C2201/0109 , B81C2201/0111
Abstract: A manufacturing method of a suspended microstructure includes the steps of providing a substrate having a surface; forming a first depositing layer over a part of the surface; forming a second depositing layer over the first depositing layer and another part of the surface wherein an adhesion between the first depositing layer and the substrate is weaker than that between the second depositing layer and the substrate; forming a hole through the second depositing layer to partially expose the surface of the substrate; and filling the hole with an etchant to remove a part of the substrate so as to form a cavity.
Abstract translation: 悬浮微结构的制造方法包括提供具有表面的基板的步骤; 在所述表面的一部分上形成第一沉积层; 在所述第一沉积层和所述表面的另一部分上形成第二沉积层，其中所述第一沉积层和所述衬底之间的粘附弱于所述第二沉积层和所述衬底之间的粘附; 通过所述第二沉积层形成孔以部分地暴露所述基底的表面; 并用蚀刻剂填充孔以去除衬底的一部分以形成空腔。
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20.发明授权公开(公告)号：US11905163B2
公开(公告)日：2024-02-20
申请号：US16753362
申请日：2019-04-03
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Xiaochen Ma , Guangcai Yuan , Ce Ning , Xin Gu , Xiao Zhang , Chao Li
CPC classification number: B81B1/002 , B01L3/502715 , B81C1/00071 , B01L2300/0645 , B81B2201/05 , B81B2203/0338 , B81C2201/0111 , B81C2201/036
Abstract: A micro-nano channel structure, a method for manufacturing the micro-nano channel structure, a sensor, a method for manufacturing the sensor, and a microfluidic device are provided by the embodiments of the present disclosure. The micro-nano channel structure includes: a base substrate; a base layer, on the base substrate and including a plurality of protrusions; and a channel wall layer, on a side of the plurality of the protrusions away from the base substrate, and the channel wall layer has a micro-nano channel; a recessed portion is provided between adjacent protrusions of the plurality of the protrusions, and an orthographic projection of the micro-nano channel on the base substrate is located within an orthographic projection of the recessed portion on the base substrate.
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