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公开(公告)号：US20240235512A9
公开(公告)日：2024-07-11
申请号：US17968812
申请日：2022-10-19
Inventor： JIA JIE XIA , BEVITA KALLUPALATHINKAL CHANDRAN , RANGANATHAN NAGARAJAN , RAMACHANDRAMURTHY PRADEEP YELEHANKA
CPC classification number: H03H3/02 , B81B7/02 , H04R19/005 , H03H2003/021 , H04R2201/003
Abstract: A micro-electro-mechanical system (MEMS) device includes a substrate having a cavity and a MEMS structure disposed over the cavity and attached to the substrate. The MEMS structure includes at least one first piezoelectric layer having a first piezoelectric coefficient and two second piezoelectric layers respectively disposed under and above the first piezoelectric layer, where each second piezoelectric layer has a second piezoelectric coefficient higher than the first piezoelectric coefficient. The MEMS structure further includes a first electrode layer and a second electrode layer sandwiching the two second piezoelectric layers.
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公开(公告)号：US20240223966A1
公开(公告)日：2024-07-04
申请号：US18395782
申请日：2023-12-26
Applicant: AAC Technologies Pte. Ltd.
Inventor： Yuwei Liu , Colin Robert Jenkins , Rui Zhang
CPC classification number: H04R19/04 , B81B3/0075 , H04R7/04 , H04R7/18 , B81B2201/0257 , B81B2203/0127 , H04R2201/003
Abstract: A MEMS microphone, includes a substrate with a back cavity, and a capacitive system arranged on the substrate, the capacitive includes a back plate and a diaphragm, a reinforcing portion is located between the diaphragm and the substrate, a projection of an inner surface of the reinforcing portion along a vibration direction of the diaphragm is flush with an inner surface of the back cavity or located in the back cavity, the reinforcing portion includes an etched barrier wall and a sacrificial layer located within the etched barrier wall. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the reliability.
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公开(公告)号：US20240215649A1
公开(公告)日：2024-07-04
申请号：US18454041
申请日：2023-08-22
Inventor： Jinyang Li , Rui Zhang
CPC classification number: A24F40/51 , A24F40/10 , A24F40/40 , B81B3/0021 , H04R1/028 , H04R7/04 , H04R19/04 , B81B2201/0257 , B81B2201/0292 , B81B2203/0127 , B81B2203/019 , H04R2201/003
Abstract: A MEMS sensor, includes a substrate with a back cavity, and a capacitive system arranged on the substrate, the MEMS sensor includes a first back plate assembly and a diaphragm opposite to the first back plate assembly. The first back plate assembly includes a first back plate and a second back plate, the first back plate includes a plurality of a first back plate holes, the second back plate includes a plurality of a second back plate holes, each first back plate hole and each second back plate hole are staggered with each other in a vibration direction of the diaphragm. Compared with the related art, the MEMS sensor disclosed by the present disclosure could play a good dustproof effect.
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公开(公告)号：US12028668B2
公开(公告)日：2024-07-02
申请号：US17738015
申请日：2022-05-06
Inventor： Hsiao-Yi Lin , Kwun Kit Chan , Yi Feng Wei , Yao-Sheng Chou
IPC: H04R1/08
CPC classification number: H04R1/083 , H04R2201/003 , H04R2499/11
Abstract: A sound wave transducer is provided. The sound wave transducer includes a first board, a spacer layer and a second board over the first board and the spacer layer. The first board includes a carrier, a first substrate layer and a first metal layer. The carrier has a first opening formed in a central region. The first substrate layer is disposed on the carrier and over the first opening. The first metal layer is disposed on the first substrate layer. The spacer layer is disposed on the first board and surrounds the central region. The second board includes a second substrate layer, a second metal layer disposed on the spacer layer, and a plurality of second openings penetrating through the second substrate layer and the second metal layer.
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公开(公告)号：US12022270B2
公开(公告)日：2024-06-25
申请号：US17761669
申请日：2020-05-26
Applicant: CSMC TECHNOLOGIES FAB2 CO., LTD.
Inventor： Jiale Su , Guoping Zhou , Xinwei Zhang , Changfeng Xia
CPC classification number: H04R31/003 , B81C1/00158 , H04R19/04 , B81C2201/0105 , B81C2201/0116 , B81C2201/0133 , H04R2201/003
Abstract: A preparation method for a micro-electromechanical systems (MEMS) microphone includes the steps of: providing a silicon substrate having a silicon surface; forming an enclosed cavity in the silicon substrate; forming a plurality of spaced apart acoustic holes in the silicon substrate, each acoustic hole having two openings, one of which communicating with the cavity and the other one located on the silicon surface; forming a sacrificial layer on the silicon substrate, which includes a first filling portion, a second filling portion and a shielding portion; forming a polysilicon layer on the shielding portion; forming a recess in the silicon substrate on the side away from the silicon surface; and removing the first filling portion, the second filling portion and part of the shielding portion so that the recess is brought into communication with the cavity to form a back chamber, and that the polysilicon layer, the remainder of the shielding portion and the silicon substrate together delimit a hollow chamber, the hollow chamber communicating with the opening of the plurality of acoustic holes away from the cavity, completing the MEMS microphone.
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Patent Agency Ranking
公开(公告)号：US12013282B2
公开(公告)日：2024-06-18
申请号：US17818820
申请日：2022-08-10
Applicant: INVENSENSE, INC.
Inventor： Jeremy Parker , Kieran Harney
CPC classification number: G01H3/00 , B81B3/0018 , B81B7/0061 , B81B2201/0257 , G01H11/06 , H04R19/005 , H04R31/006 , H04R2201/003
Abstract: An alternate venting path can be employed in a sensor device for pressure equalization. A sensor component of the device can comprise a diaphragm component and/or backplate component disposed over an acoustic port of the device. The diaphragm component can be formed with no holes to prevent liquid or particles from entering a back cavity of the device, or gap between the diaphragm component and backplate component. A venting port can be formed in the device to create an alternate venting path to the back cavity for pressure equalization for the diaphragm component. A venting component, comprising a filter, membrane, and/or hydrophobic coating, can be associated with the venting port to inhibit liquid and particles from entering the back cavity via the venting port, without degrading performance of the device. The venting component can be designed to achieve a desired low frequency corner of the sensor frequency response.
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公开(公告)号：US12010488B2
公开(公告)日：2024-06-11
申请号：US18126938
申请日：2023-03-27
Applicant: Qualcomm Technologies Inc.
Inventor： Robert J. Littrell
CPC classification number: H04R29/004 , G10L25/18 , G10L25/21 , G10L25/78 , H04R17/02 , H04R19/04 , H04R2201/003
Abstract: An acoustic device is described and includes an acoustic sensor element configured to sense acoustic energy and produce an output signal and a threshold detector circuit including a switch having an input coupled to the output of the acoustic sensor element to receive the output signal, a control port that receives a control signal, and first and second output ports, a first channel including an analog-to-digital converter that operates at a first power level a second analog-to-digital converter that operates at a second higher power level, relative to the first power level and a threshold level detector that receives an output from the first analog-to-digital converter to produce the control signal having a first state that causes the switch feed the output signal from the acoustic sensor element to the second analog-to-digital converter when the first digitized output signal meets a threshold criteria.
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公开(公告)号：US20240187774A1
公开(公告)日：2024-06-06
申请号：US18526287
申请日：2023-12-01
Applicant: USOUND GMBH
CPC classification number: H04R1/1016 , H04R17/00 , H04R2201/003
Abstract: The invention relates to an acoustic transducer unit (1), in particular for in-ear headphones, having an electrodynamic acoustic transducer (2) comprising a first membrane (10), preferably with a membrane perforation (42), and having at least one MEMS acoustic transducer (3) comprising a second membrane (30). According to the invention, the acoustic transducer unit (1) comprises a circuit board (58) adapted such that a first rear volume of the electrodynamic acoustic transducer (2) is open and/or closes a second rear volume of the MEMS acoustic transducer (3). The invention further relates to an electronic component and to the use of an acoustic transducer unit.
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公开(公告)号：US20240182297A1
公开(公告)日：2024-06-06
申请号：US18519897
申请日：2023-11-27
Applicant: Infineon Technologies AG
Inventor： Hutomo Suryo Wasisto , Fabian Streb , Sebastian Anzinger , Marc Füldner , Dominic Maier
CPC classification number: B81C1/00285 , B81B7/0029 , B81B2201/0257 , B81C2201/0132 , H04R1/023 , H04R2201/003 , H04R2201/029
Abstract: A method for manufacturing a micromechanical environmental barrier chip includes providing a substrate having a first surface and an opposite second surface, depositing a material layer having a different etch characteristic than the substrate onto the first surface, creating a microstructured micromechanical environmental barrier structure on top of the material layer by applying a microstructuring process, applying an anisotropic etching process comprising at least one etching step for anisotropically etching from the second surface towards the first surface to create at least a cavity underneath the micromechanical environmental barrier structure, the cavity extending between the second surface and the material layer, and removing the material layer underneath the micromechanical environmental barrier structure to expose the environmental barrier structure.
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公开(公告)号：US11979520B2
公开(公告)日：2024-05-07
申请号：US18121902
申请日：2023-03-15
Applicant: EPOS Group A/S
Inventor： Anders Røser Hansen , Poul Peder Hestbek , Casper Fynsk
CPC classification number: H04M3/568 , H04M1/6025 , H04R1/326 , H04S7/301 , H04S7/305 , H04S7/40 , H04M2203/509 , H04R2201/003
Abstract: A method for optimizing speech pickup in a speakerphone system, wherein the speakerphone system comprises a microphone system placed in a specific configuration, wherein the method comprising receiving acoustic input signals by the microphone system, processing said acoustic input signals by using an algorithm for focusing and steering a selected target sound signal towards a desired direction, and transmitting an output signal based on said processing.
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