公开(公告)号：US20180213637A1

公开(公告)日：2018-07-26

申请号：US15925990

申请日：2018-03-20

Applicant: Asahi Glass Company, Limited

Inventor： Tomoya HOSODA ,  Toru SASAKI ,  Nobutaka KIDERA ,  Tatsuya TERADA

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/0271 ,  B32B7/02 ,  B32B27/30 ,  H05K1/024 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/16 ,  H05K3/0011 ,  H05K3/0014 ,  H05K3/0055 ,  H05K3/422 ,  H05K3/427 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/068 ,  H05K2201/10098 ,  H05K2203/0789 ,  H05K2203/095

Abstract: To provide a process for producing a wiring substrate with conduction failure in a hole formed in an electrical insulator layer suppressed even without conducting an etching treatment using metal sodium, and with unexpected deformation such as warpage suppressed even when the electrical insulator layer contains no woven fabric or non-woven fabric comprising reinforcing fibers. A process for producing a wiring substrate 1, which comprises forming a hole 20 in a laminate comprising a first conductor layer 12, an electrical insulator layer 10 which contains a specific fluororesin layer (A) 16 and a heat resistant resin layer (B) 18, contains no reinforcing fiber to substrate, and has a dielectric constant of from 2.0 to 3.5 and a linear expansion coefficient of from 0 to 35 ppm/° C., and a second conductor layer 14, applying, to an inner wall surface 20a of the hole 20, either one or both of a treatment with a permanganic acid solution and a plasma treatment without conducting an etching treatment using metal sodium, and then forming a plating layer 22 on the inner wall surface 20a of the hole 20.

公开(公告)号：US09960301B2

公开(公告)日：2018-05-01

申请号：US15076081

申请日：2016-03-21

Applicant: ORBITAL SCIENCES CORPORATION

Inventor： Robert Minelli

IPC: H01L31/18 ,  H05K3/30 ,  H05K1/18 ,  H05K3/28 ,  H01L31/05 ,  H01L31/048 ,  H01L31/02 ,  H05K3/00

CPC classification number: H01L31/0504 ,  H01L31/02008 ,  H01L31/048 ,  H01L31/188 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/305 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/10121 ,  Y02E10/50 ,  Y02P70/613

Abstract: A flexible, lightweight photovoltaic cell array includes one or more individual photovoltaic cell strings attached to a polyimide film substrate and covered with a polyvinyl fluoride film. Each photovoltaic cell string includes one or more photovoltaic cells attached to a flexible printed circuit board. The photovoltaic cell array may be manufactured by a method that includes bonding at least one photovoltaic cell to a flexible printed circuit board, mounting the flexible printed circuit board on a polyimide film substrate, and covering the flexible printed circuit board with a substantially transparent polyvinyl fluoride film.

公开(公告)号：US20180052488A1

公开(公告)日：2018-02-22

申请号：US15243370

申请日：2016-08-22

Applicant: Apple Inc.

Inventor： Bryan W. Posner ,  Adam T. Garelli

IPC: G06F1/16 ,  H05K1/14 ,  H05K1/03

CPC classification number: G06F1/1616 ,  G06F1/1681 ,  G06F1/1683 ,  H05K1/0281 ,  H05K3/285 ,  H05K2201/015 ,  H05K2203/1173

Abstract: An electronic device may include flexible printed circuits. A flexible printed circuit may have metal traces supported by a polymer substrate. The flexible printed circuit may extend between an upper laptop computer housing and a lower laptop computer housing or other structures that move relative to each other in an electronic device. The flexible printed circuit may have a low-friction coating and a matte finish. The flexible printed circuit may have a fluoropolymer coating on the polymer substrate, a fluoropolymer coating on a matte coating on the polymer substrate, a fluoropolymer coating that includes a matting agent on the polymer substrate, a fluoropolymer layer or other polymer layer that is attached to the substrate with a layer of adhesive, a textured surface layer, and/or other structures that help provide the flexible printed circuit with desired physical properties and a desired appearance.

公开(公告)号：US20170327630A1

公开(公告)日：2017-11-16

申请号：US15520135

申请日：2015-10-13

Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Satoshi KIYA ,  Sumito UEHARA ,  Kousuke MIURA

IPC: C08G59/30 ,  H05K3/26 ,  H05K3/12 ,  C08J7/16 ,  B32B27/38 ,  H05K3/38 ,  B32B27/30

CPC classification number: C08G59/30 ,  B32B27/30 ,  B32B27/38 ,  C08J7/12 ,  C08J7/123 ,  C08J7/16 ,  C08J2327/12 ,  C09J163/00 ,  H05K3/1208 ,  H05K3/26 ,  H05K3/281 ,  H05K3/285 ,  H05K3/38 ,  H05K3/381 ,  H05K3/386 ,  H05K2201/0129 ,  H05K2201/015

Abstract: A resin film containing a fluororesin as a main component has, on at least one surface thereof, a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more. A coverlay includes the resin film and an adhesive layer laminated on the pre-treated surface. A substrate for a printed wiring board includes the resin film and a conductive layer laminated on the pre-treated surface. A printed wiring board includes an insulating base layer, a conductive pattern laminated on at least one surface of the base layer, and the coverlay for a printed wiring board, the coverlay being laminated on the conductive pattern.

公开(公告)号：US20170313916A1

公开(公告)日：2017-11-02

申请号：US15521359

申请日：2015-12-08

Applicant: LG CHEM, LTD.

Inventor： Young Ji TAE ,  Young Seok PARK ,  Byeong In AHN

IPC: C09J151/00 ,  B32B27/28 ,  H05K1/03 ,  C09J9/00 ,  C09J11/08 ,  B32B7/12 ,  C09J7/00 ,  B32B15/08 ,  H05K1/09

CPC classification number: C09J151/003 ,  B32B7/12 ,  B32B15/08 ,  B32B27/281 ,  B32B2309/105 ,  B32B2457/08 ,  C08G59/4042 ,  C08G59/50 ,  C08G59/5073 ,  C09J7/00 ,  C09J7/10 ,  C09J9/00 ,  C09J11/08 ,  C09J151/006 ,  C09J163/00 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2425/00 ,  C09J2451/00 ,  C09J2463/00 ,  H05K1/0346 ,  H05K1/0353 ,  H05K1/0393 ,  H05K1/09 ,  H05K2201/015 ,  H05K2201/0154 ,  C08L63/00

Abstract: The present invention relates to an adhesive resin composition including a styrene-ethylene-butylene-styrene copolymer with a specific chemical structure, an epoxy resin, an acid anhydride compound, and a curing catalyst, an adhesive film obtained from the resin composition, and a flexible metal laminate including the adhesive film.

公开(公告)号：US20170290172A1

公开(公告)日：2017-10-05

申请号：US15331307

申请日：2016-10-21

Applicant: Raytheon Company

Inventor： Patrick J. Kocurek ,  Sankerlingam Rajendran

IPC: H05K3/46 ,  H05K3/40 ,  H05K3/00 ,  H05K3/30

CPC classification number: H05K3/4626 ,  H05K1/185 ,  H05K3/0055 ,  H05K3/30 ,  H05K3/4038 ,  H05K3/4632 ,  H05K3/4697 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2203/025 ,  H05K2203/0285 ,  H05K2203/065

Abstract: A method of lamination of dielectric circuit materials is provided. The method includes preparing first and second circuit layers of dielectric materials, stacking the first and second circuit layers with circuit trace elements interposed between the first and second circuit layers and ultrasonically welding the second circuit layer onto the first circuit layer around the circuit trace elements.

公开(公告)号：US09743539B2

公开(公告)日：2017-08-22

申请号：US15100852

申请日：2014-11-17

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： Ryouichi Kajiwara ,  Masaru Kamoshida ,  Toshiaki Ishii

IPC: H05K5/00 ,  B23K35/22 ,  H05K1/11 ,  H05K3/28 ,  H05K3/34 ,  B23K35/26 ,  B23K35/02 ,  B23K1/00 ,  B23K1/08

CPC classification number: H05K5/0069 ,  B23K1/0016 ,  B23K1/08 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/226 ,  B23K35/26 ,  B23K35/262 ,  H05K1/117 ,  H05K3/282 ,  H05K3/3405 ,  H05K3/3463 ,  H05K5/003 ,  H05K5/0034 ,  H05K2201/015 ,  H05K2201/10189 ,  H05K2201/2045 ,  H05K2203/122

Abstract: There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps. The electronic module includes a mounting board having a circuit board on which an electronic component is mounted, and a case member for accommodating and protecting the mounting board from surrounding environment, The electronic module has a connection structure in which a portion of the circuit board is protruded to the outside through an opening of the case and inserts a board terminal into an external female connector to obtain electrical continuity, and a portion of the case member forms a connector housing that receives the female connector and isolates a space in which the board terminal is present from surrounding environment and an insulating resin member for fixing the circuit board in the case is integrally molded or joined with the circuit board.

公开(公告)号：US09736936B2

公开(公告)日：2017-08-15

申请号：US15012557

申请日：2016-02-01

Applicant: Intel Corporation

Inventor： Christopher Jezewski ,  Ravi Pillarisetty ,  Brian Doyle

IPC: H01L21/44 ,  H05K1/03 ,  D03D1/00 ,  D03D11/02 ,  D03D15/00 ,  H05K3/00 ,  H05K1/02 ,  H05K3/10 ,  H05K3/32 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/038 ,  D03D1/0088 ,  D03D11/02 ,  D03D15/00 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/10 ,  H05K3/28 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/029

Abstract: A system comprises an article comprising one or more fabric layers, a plurality of electronic devices, each being incorporated into or onto one of the one or more fabric layers, and one or more communication links between two or more of the plurality of electronic devices. Each of the plurality of electronic devices can comprise a flexible substrate coupled to the fabric layer, one or more metallization layers deposited on the flexible substrate, and one or more electronic components electrically coupled to the one or more metallization layers.

公开(公告)号：US20170208680A1

公开(公告)日：2017-07-20

申请号：US15404351

申请日：2017-01-12

Applicant: JX Nippon Mining & Metals Corporation

Inventor： Ryo Fukuchi

IPC: H05K1/02 ,  H05K3/20 ,  H01Q1/38 ,  H05K3/06 ,  H05K1/03 ,  H05K1/09 ,  H05K3/38 ,  H05K3/02

CPC classification number: H05K1/0237 ,  C22C9/00 ,  C22C9/02 ,  H01Q1/38 ,  H05K1/0313 ,  H05K1/09 ,  H05K3/022 ,  H05K3/06 ,  H05K3/202 ,  H05K3/389 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0307

Abstract: To provide a copper foil and a copper-clad laminate board that have a good circuit formability and have a favorably suppressed transmission loss even in the use thereof in a high frequency circuit board. A copper foil comprising a gloss face, a surface roughness Ra of a surface of the copper foil on the gloss face side being 0.25 μm or less measured with a laser microscope and a surface roughness Rz of the surface of the copper foil on the gloss face side being 1.10 μm or less measured with a laser microscope, wherein the copper foil has a layer structure after heating at 200° C. for 30 minutes or after heating at 130° C. for 30 minutes or after heating at 300° C. for 30 minutes.

公开(公告)号：US09680273B2

公开(公告)日：2017-06-13

申请号：US13843274

申请日：2013-03-15

Applicant: David Noel Light ,  Hung-Ming Wang ,  David Rodney Baker ,  Peter Tho Nguyen ,  Dexter Shih-Wei Pao

Inventor： David Noel Light ,  Hung-Ming Wang ,  David Rodney Baker ,  Peter Tho Nguyen ,  Dexter Shih-Wei Pao

IPC: H01R43/16 ,  H01R12/70 ,  H01R12/73 ,  H01R12/71 ,  H01R13/24 ,  H05K3/28 ,  H05K3/40

CPC classification number: H01R43/16 ,  H01R12/7082 ,  H01R12/714 ,  H01R12/73 ,  H01R13/2407 ,  H01R13/2442 ,  H05K3/281 ,  H05K3/285 ,  H05K3/4015 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/2036 ,  Y10T29/49208

Abstract: Disclosed is an electrical connector having a substrate and movable electrical contacts which are mounted to the substrate and extend a distance D from the substrate. A layer of compressible material (such as a foam or elastomeric material) is positioned on the substrate adjacent at least some of the electrical contacts and ideally has an uncompressed thickness slightly greater than the distance D to provide for protection of the electrical contacts. When a mating electrical device such as an electrical connector or other circuit member is mated to the electrical connector with its electrical contacts and its layer of compressible material, the layer of compressible material is compressed to a thickness less than the distance D, allowing the contacts to make a suitable electrical interconnection to the mating electrical device. The compressible material may be selected which has a force-to-compression plot which includes at least one inflection, defining a first region on one side of the inflection where a given increment of force provides a larger increment of compression and a second region on the other side of the inflection where the same increment of compressive force provides a substantially smaller increment of compression. The compressible material can function to prevent damage to the movable electrical contacts from handling, packing, shipping, assembly, testing, connection and/or mating of the connector.