公开(公告)号：US20140134350A1

公开(公告)日：2014-05-15

申请号：US14157450

申请日：2014-01-16

Applicant: Lockheed Martin Corporation

Inventor： Alfred A. Zinn

IPC: C23C24/08

CPC classification number: C23C24/08 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2203/107 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.

Abstract translation: 组合物可以具有直径为20纳米或更小并具有小于约220℃的熔化温度的金属纳米颗粒。制备金属纳米颗粒的方法可包括制备溶剂，向溶剂中加入前体与金属， 加入第一表面活性剂，在还原剂中混合，并加入第二表面活性剂以阻止纳米颗粒的形成。 形成的铜和/或铝纳米颗粒组合物可用于将电子部件无铅焊接到电路板。 组合物可以包括可以具有铜纳米孔，无定形铝壳和有机表面活性剂涂层的纳米颗粒。 组合物可以具有铜或铝纳米颗粒。 大约30-50％的铜或铝纳米颗粒可以具有20纳米或更小的直径，剩余的70-50％的铜或铝纳米颗粒可以具有大于20纳米的直径。

公开(公告)号：US08383016B2

公开(公告)日：2013-02-26

申请号：US13416534

申请日：2012-03-09

Applicant: Nana Enomoto ,  Kunihiko Akai

Inventor： Nana Enomoto ,  Kunihiko Akai

IPC: H01B1/02 ,  H01B1/22 ,  B05D7/00 ,  B32B5/16

CPC classification number: H01B1/02 ,  H05K3/321 ,  H05K2201/0218 ,  Y10T428/2991

Abstract: Conductive fine particles have core particle surfaces coated with a metal-plated coating film layer containing nickel and phosphorus and a multilayer conductive layer comprising a palladium layer as the outer surface. The phosphorus content in region A of the metal-plated coating film layer, at a distance of no greater than 20% of the thickness of the entire metal-plated coating film layer from the surface of the core particle, is 7-15 wt % of the entire region A. The phosphorus content in region B of the metal-plated coating film layer, at a distance of no greater than 10% of the thickness of the entire metal-plated coating film layer from the surface of the metal-plated coating film layer on the palladium layer side, is 0.1-3 wt % of the entire region B, and the phosphorus content of the entire metal-plated coating film layer is 7 wt % or greater.

Abstract translation: 导电性微粒具有涂覆有含镍和磷的金属镀覆膜层的核心颗粒表面和包含钯层作为外表面的多层导电层。 金属镀膜层的区域A中的磷含量为不大于核心颗粒表面的整个金属镀覆膜层的厚度的20％以下的距离，为7-15重量％ 在金属镀覆膜层的区域B中的磷含量，距金属镀层表面的整个金属镀膜层的厚度不大于10％的距离 钯层侧的涂膜层为整个区域B的0.1〜3重量％，整个金属镀膜层的磷含量为7重量％以上。

公开(公告)号：US20120106111A1

公开(公告)日：2012-05-03

申请号：US12916569

申请日：2010-10-31

Applicant: JOSEPH MAZZOCHETTE ,  Sarwan Kumar Khanna

Inventor： JOSEPH MAZZOCHETTE ,  Sarwan Kumar Khanna

IPC: H05K7/00 ,  H01F1/00 ,  H01F1/26 ,  C09K5/00 ,  H01F1/04 ,  B82Y99/00 ,  B82Y30/00

CPC classification number: H05K3/323 ,  B82Y30/00 ,  H01F1/26 ,  H01F1/37 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29349 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/29388 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/83887 ,  H01L2225/06558 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15787 ,  H01L2924/3011 ,  H05K2201/0218 ,  H05K2201/0266 ,  H05K2201/083 ,  H05K2203/104 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A composition of matter comprising a plurality of nanoparticles in a non-conductive binder, wherein, the type of nanoparticles form isolated parallel electrically and thermally conductive columns when cured in the presence of the magnetic field. Also wherein the plurality of nanoparticles are Paramagnetic or Ferromagnetic magnetic. Wherein the nano particles are coated, and of a particular shape. Wherein the particles are selected from the group consisting of; Al, Pt, Cr, Mn, crown glass, Fe, Ni, and Co, Ni—Fe/SiO2, Co/SiO2, Fe—Co/SiO2, Fe/nickel-ferrite, Ni—Zn-ferrite/SiO2, Fe—Ni/polymer, Co/polymer, ferrites, iron oxide and any combination and alloy thereof, and the Binder selected from the group consisting of; epoxies, polyurethanes, polyimides, polymeric materials, silicones, adhesives, acrylates, the UV curable modifier and any combination thereof.

Abstract translation: 一种在非导电粘合剂中包含多个纳米颗粒的物质组合物，其中当在磁场存在下固化时，纳米颗粒的类型形成隔离的平行的导电和导热柱。 而且其中多个纳米颗粒是顺磁性或铁磁性的。 其中纳米颗粒被涂覆并且具有特定形状。 其中颗粒选自： Al，Pt，Cr，Mn，冠状玻璃，Fe，Ni和Co，Ni-Fe / SiO2，Co / SiO2，Fe-Co / SiO2，Fe /镍铁氧体，Ni-Zn-铁素体/ Ni /聚合物，Co /聚合物，铁氧体，氧化铁及其任何组合和合金，以及选自以下的粘合剂： 环氧树脂，聚氨酯，聚酰亚胺，聚合物材料，硅酮，粘合剂，丙烯酸酯，UV可固化改性剂及其任何组合。

公开(公告)号：US20120090882A1

公开(公告)日：2012-04-19

申请号：US13332555

申请日：2011-12-21

Applicant: Tomoyuki ISHIMATSU ,  Yuta Araki

Inventor： Tomoyuki ISHIMATSU ,  Yuta Araki

IPC: H05K1/09 ,  B32B3/00 ,  H01B13/00 ,  B22F1/02

CPC classification number: H05K3/323 ,  B22F1/02 ,  C22C5/02 ,  C22C19/03 ,  H01B1/02 ,  H05K2201/0218 ,  Y10T428/12181 ,  Y10T428/12944 ,  Y10T428/256 ,  Y10T428/287 ,  Y10T428/2991

Abstract: To provide a conductive particle, containing: a core particle; and a conductive layer formed on a surface of the core particle, wherein the core particle is a nickel particle, and wherein the conductive layer is a nickel plating layer a surface of which has a phosphorous concentration of 10% by mass or lower, and the conductive layer has an average thickness of 1 nm to 10 nm.

Abstract translation: 提供导电颗粒，其包含：核心颗粒; 以及形成在所述芯粒子的表面上的导电层，其中所述芯粒子为镍粒子，所述导电层为表面的磷浓度为10质量％以下的镀镍层， 导电层的平均厚度为1nm〜10nm。

公开(公告)号：US08089151B2

公开(公告)日：2012-01-03

申请号：US11500018

申请日：2006-08-07

Applicant: Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

Inventor： Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

IPC: H01L23/48

CPC classification number: H05K3/323 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29444 ,  H01L2224/2989 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19042 ,  H05K2201/0218 ,  H05K2201/0233 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle.Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.

Abstract translation: 本发明的实施方案包括导电颗粒，其包含在聚合物树脂颗粒的表面上形成的具有小于约1.5重量％的磷含量的导电镍/金（Ni / Au）复合金属层。 也包括其形成方法。 具有小于约1.5重量％的磷的Ni / Au复合金属层的导电颗粒可以具有相对高的导电性，同时提供Ni / Au金属层对聚合物树脂颗粒的相对良好的粘附。 本发明的其它实施方案提供了包含根据本发明实施方案的导电颗粒的各向异性粘合剂组合物。

公开(公告)号：US20110088935A1

公开(公告)日：2011-04-21

申请号：US12975421

申请日：2010-12-22

Applicant: Tomoyuki ISHIMATSU ,  Hiroki Ozeki ,  Hiroshi Hamachi

Inventor： Tomoyuki ISHIMATSU ,  Hiroki Ozeki ,  Hiroshi Hamachi

IPC: H05K1/09 ,  B32B37/00 ,  C09J163/00 ,  C09J133/08 ,  H01B1/02

CPC classification number: H05K3/323 ,  H05K2201/0212 ,  H05K2201/0218 ,  H05K2201/0221 ,  Y10T29/4913 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/2991 ,  Y10T428/31663

Abstract: The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer.

Abstract translation: 本发明的目的在于提供能够降低应力同时保持高硬度的导电性粒子（即使在连接工序中被破碎的状态下也难以产生裂纹），并且能够确保不仅对于ITO基板的充分的导电性， 而且对于IZO基板，设置有导电颗粒的各向异性导电膜，设置有各向异性导电膜的接合结构以及使用各向异性导电膜的接合方法。 本发明的导电粒子包括聚合物细颗粒和形成在聚合物细颗粒的表面上的导电层，其中导电层的最外表面壳是镍 - 钯合金层。

公开(公告)号：US20100243107A1

公开(公告)日：2010-09-30

申请号：US12796905

申请日：2010-06-09

Applicant: Richard K. Schmid ,  Jacobus C. Doesburg

Inventor： Richard K. Schmid ,  Jacobus C. Doesburg

IPC: B23K35/24

CPC classification number: C23C24/04 ,  B22F1/025 ,  B22F3/115 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/36 ,  B23K35/383 ,  C23C4/12 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/1344 ,  Y10T428/12181

Abstract: A solder composition for forming a solder joint. The composition includes a powder material including a solid metal matrix material and a filler material. The solid metal matrix material includes one or more of tin-silver-copper (Sn—Ag—Cu), tin-copper (Sn—Cu), tin-copper-nickel (Sn—Cu—Ni), tin-silver (Sn—Ag), tin-silver-bismuth (Sn—Ag—Bi), tin-bismuth-indium (Sn—Bi—In), tin-gold (Au—Sn), tin-zinc (Sn—Zn), tin-zinc-bismuth (Sn—Zn—Bi), tin-bismuth-silver (Sn—Bi—Ag), tin (Sn), tin-indium (Sn—In), indium (In), indium-silver (In—Ag), and tin-lead (Sn—Pb). The filler material includes one or more of copper (Cu), gold (Au), nickel (Ni), nickel-gold (Ni—Au), carbon, silver (Ag), aluminum (Al), molybdenum (Mo), nickel (Ni) or nickel-gold (Ni—Au) coated carbon, the platinum group metals (PGM's), and their alloys

Abstract translation: 用于形成焊点的焊料组合物。 组合物包括包含固体金属基质材料和填充材料的粉末材料。 固体金属基体材料包括锡 - 银 - 铜（Sn-Ag-Cu），锡 - 铜（Sn-Cu），锡 - 铜 - 镍（Sn-Cu-Ni），锡 - 银（Sn （Sn-Bi-In），锡 - 金（Au-Sn），锡 - 锌（Sn-Zn），锡 - 铋 - 锡（Sn-Ag-Bi） （Sn-Zn-Bi），锡 - 铋 - 银（Sn-Bi-Ag），锡（Sn），锡 - 铟（Sn-In），铟（In），铟 - 银 ）和锡铅（Sn-Pb）。 填充材料包括铜（Cu），金（Au），镍（Ni），镍 - 金（Ni-Au），碳，银（Ag），铝（Al），钼（Mo） （Ni）或镍 - 金（Ni-Au）涂覆的碳，铂族金属（PGM's）及其合金

公开(公告)号：US20100171064A1

公开(公告)日：2010-07-08

申请号：US11508312

申请日：2006-08-23

Applicant: In-Keun Shim ,  Jae-Woo Joung

Inventor： In-Keun Shim ,  Jae-Woo Joung

IPC: H01F1/04

CPC classification number: H01B1/16 ,  B22F1/0018 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  C09D11/52 ,  H01B1/02 ,  H05K1/097 ,  H05K2201/0218 ,  H05K2201/083 ,  Y10S977/775 ,  Y10T428/2991

Abstract: A nanoparticle for conductive ink including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core. The ferromagnetic core is 5 to 40 parts by weight, per 100 parts by weight of the nanoparticles. The conductive ink provides electrical reliability by allowing a uniform distribution of nanoparticles in ejected ink and prevents the coffee stain phenomenon and migration.

Abstract translation: 一种用于导电油墨的纳米颗粒，其包括铁磁芯和围绕铁磁芯的导电层。 每100重量份的纳米颗粒，铁磁芯为5〜40重量份。 导电油墨通过允许在喷射的油墨中均匀分布纳米颗粒而提供电可靠性，并防止咖啡污点现象和迁移。

公开(公告)号：US20100059260A1

公开(公告)日：2010-03-11

申请号：US12546117

申请日：2009-08-24

Applicant: Kiyohiko Takemoto ,  Miharu Kanaya

Inventor： Kiyohiko Takemoto ,  Miharu Kanaya

IPC: H05K1/09 ,  B05D5/12 ,  H01B1/22

CPC classification number: H01B1/22 ,  C09D11/38 ,  C09D11/52 ,  C09D17/006 ,  C22C9/00 ,  C22C21/00 ,  H05K1/097 ,  H05K2201/0218

Abstract: Objects of the present invention include providing composite metallic thin filmy particles for conductive inks and a conductive ink, both allowing the production of highly conductive substrates with simpler equipment and at a lower cost, providing a method for making such a conductive substrate, and providing such a conductive substrate.The present invention includes Step 1 for coating a surface of a base material sheet with a composite metallic thin film layer that contains at least one of a resin layer and a wax layer and at least one of a metal layer and a metal compound layer and Step 2 for removing the composite metallic thin film layer from the sheet. The resultant composite metallic thin filmy particles and conductive ink can be used in a conductive substrate producing apparatus, formed into a pattern on the conductive substrate by screen printing, an ink jet method, or some other liquid-based process.

Abstract translation: 本发明的目的包括提供用于导电油墨和导电油墨的复合金属薄膜颗粒，其允许以更简单的设备和更低的成本生产高导电性基材，提供制造这种导电基材的方法， 导电基板。 本发明包括用包含树脂层和蜡层中的至少一种和金属层和金属化合物层中的至少一种的复合金属薄膜层涂覆基材片的表面的步骤1和步骤 2用于从片材上除去复合金属薄膜层。 所得到的复合金属薄膜颗粒和导电油墨可以用于通过丝网印刷，喷墨法或一些其它基于液体的方法在导电基板上形成图案的导电基板制造装置中。

公开(公告)号：US20090294056A1

公开(公告)日：2009-12-03

申请号：US12365279

申请日：2009-02-04

Applicant: Hideaki YOSHIMURA ,  Takashi NAKAGAWA ,  Kenji FUKUZONO ,  Takashi KANDA ,  Tomohisa YAGI

Inventor： Hideaki YOSHIMURA ,  Takashi NAKAGAWA ,  Kenji FUKUZONO ,  Takashi KANDA ,  Tomohisa YAGI

IPC: B32B37/12

CPC classification number: H05K3/321 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0218 ,  H05K2201/0323 ,  H05K2201/0361 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/061

Abstract: The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other.

Abstract translation: 响应于粘合片的软化，第一支撑体被压靠在第二支撑体上。 允许填料在第一导电焊盘和第二导电焊盘之间彼此可靠地接触。 粘合片软化后，填料熔化。 金属间化合物形成在填料和导电性焊盘之间以及填料之间。 电连接以这种方式建立在第一导电焊盘和第二导电焊盘之间。 然后将基质材料和粘合片固化。 第一支撑体和第二支撑体彼此牢固地接合。