公开(公告)号：US20130105980A1

公开(公告)日：2013-05-02

申请号：US13659466

申请日：2012-10-24

Applicant: Hitachi, Ltd.

Inventor： Yusuke Yasuda ,  Toshiaki Morita ,  Yoshio Kobayashi

IPC: B23K35/24 ,  H01L23/488 ,  B23K31/02

CPC classification number: H05K1/097 ,  B22F1/0018 ,  B22F3/10 ,  B22F9/24 ,  B82Y30/00 ,  C22C1/0425 ,  C22C9/00 ,  H01B1/026 ,  H01B1/16 ,  H01B1/22 ,  H01L2224/16225 ,  H01L2224/83205 ,  H01L2224/8384 ,  H05K3/32 ,  H05K2201/0266 ,  H01L2924/00014

Abstract: Disclosed is a sinterable bonding material which is a liquid or a paste containing copper nanoparticles having a particle diameter of 1,000 nm or less, in which the copper nanoparticles have one or more particle diameter peaks of a number-based grain size distribution within a class of particle diameter of 1 to 35 nm and within a class of particle diameter of more than 35 nm and 1,000 nm or less respectively, and in which the copper nanoparticles include individual particles (primary particles) and secondary particles, each of the secondary particles being a fused body of the primary particles. Thus, oxidation resistance and bondability are made compatible in a sinterable bonding material using copper nanoparticles, and ion migration is suppressed in a bonded portion of a semiconductor device, etc. manufactured by using the sinterable bonding material.

Abstract translation: 公开了一种可烧结接合材料，其是含有粒径为1,000nm以下的铜纳米颗粒的液体或糊料，其中铜纳米颗粒具有一类或多种粒径分布的粒径分布的一个或多个粒径峰 粒径为1〜35nm，粒径分别为35nm以上且1000nm以下，其中，铜纳米粒子包括单粒子（一次粒子）和二次粒子，二次粒子为 融合体的初级粒子。 因此，使用铜纳米粒子的可烧结接合材料中的抗氧化性和结合性相容，并且通过使用可烧结接合材料制造的半导体器件等的接合部分抑制了离子迁移。

公开(公告)号：US20120189818A1

公开(公告)日：2012-07-26

申请号：US13498802

申请日：2010-09-28

Applicant: Katsura Hayashi

Inventor： Katsura Hayashi

IPC: B32B5/16 ,  H05K3/00 ,  H05K1/02 ,  B32B5/30 ,  B32B3/30

CPC classification number: H05K1/0306 ,  H05K3/4602 ,  H05K3/4655 ,  H05K3/4673 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0355 ,  Y10T428/24521 ,  Y10T428/25 ,  Y10T428/2982

Abstract: A circuit board includes an inorganic insulating layer having first inorganic insulating particles connected to each other, and second inorganic insulating particles connected to each other via the first inorganic insulating particles and having a larger particle diameter than that of the first inorganic insulating particles. A circuit board manufacturing method includes applying an inorganic insulating sol including first inorganic insulating particles and second inorganic insulating particles having a larger particle diameter than that of the first inorganic insulating particles, and heating the first inorganic insulating particles and the second inorganic insulating particles at a temperature lower than a crystallization onset temperature of the first inorganic insulating particles and lower than a crystallization onset temperature of the second inorganic insulating particles, and connecting the first inorganic insulating particles to each other, and connecting second insulating particles to each other via the first insulating particles.

Abstract translation: 电路板包括具有彼此连接的第一无机绝缘颗粒的无机绝缘层和通过第一无机绝缘颗粒彼此连接并且具有比第一无机绝缘颗粒的粒径更大的颗粒直径的第二无机绝缘颗粒。 一种电路板的制造方法，其特征在于，包括：第一无机绝缘粒子和比第一无机绝缘粒子的粒子直径大的第二无机绝缘粒子的无机绝缘溶胶，将第一无机绝缘粒子和第二无机绝缘粒子加热到 温度低于第一无机绝缘粒子的结晶起始温度，并且低于第二无机绝缘粒子的结晶化开始温度，并且将第一无机绝缘粒子彼此连接，并且经由第一绝缘体将第二绝缘粒子彼此连接 粒子。

公开(公告)号：US08178193B2

公开(公告)日：2012-05-15

申请号：US12260042

申请日：2008-10-28

Applicant: Beom Joon Cho ,  Jong Myeon Lee ,  Ho Sung Choo

Inventor： Beom Joon Cho ,  Jong Myeon Lee ,  Ho Sung Choo

IPC: B32B7/02 ,  B32B37/06 ,  B32B9/04

CPC classification number: H05K3/4611 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0266 ,  H05K2203/308 ,  Y10T428/24992

Abstract: Provided are a constraining green sheet and a method of manufacturing a multi-layer ceramic substrate. The constraining green sheet includes a first constraining layer and a second constraining layer. The first constraining layer has a side to be disposed on a multi-layer ceramic laminated structure and is formed of a first inorganic powder having a first particle diameter. The second constraining layer is disposed on top of the first constraining layer and is formed of a second inorganic powder having a second particle diameter larger than the first particle diameter. The second constraining layer is equal to or lower than the first constraining layer in terms of powder packing density. A shrinkage suppression rate can be increased and a de-binder passage can be secured in a firing process of the ceramic laminated structure by using the constraining green sheet formed of inorganic powders having different density and particle diameter.

Abstract translation: 本发明提供约束生片和多层陶瓷基片的制造方法。 约束生片包括第一约束层和第二约束层。 第一约束层具有设置在多层陶瓷层叠结构上的一侧，并且由具有第一粒径的第一无机粉末形成。 第二约束层设置在第一约束层的顶部，并且由具有大于第一粒径的第二粒径的第二无机粉末形成。 关于粉末填充密度，第二约束层等于或低于第一约束层。 通过使用由具有不同密度和粒径的无机粉末形成的约束生片，可以在陶瓷层压结构的烧制过程中确保收缩抑制率，并且可以确保去粘合剂通道。

公开(公告)号：US20120104618A1

公开(公告)日：2012-05-03

申请号：US13348072

申请日：2012-01-11

Applicant: Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

Inventor： Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

IPC: H01L23/488

CPC classification number: H05K3/321 ,  B22F1/0014 ,  B22F1/0062 ,  B22F3/14 ,  B22F2003/145 ,  B23K35/22 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29007 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/2076 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/8305 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/83205 ,  H01L2924/00012

Abstract: A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.

Abstract translation: 一种粘合材料，其包含涂覆有碳原子数为2〜8的有机物质的金属粒子，其中，所述金属粒子包含100nm以下的第一部分和大于100nm但不大于100μm的第二部分， 基于体积基数具有至少峰值分布的部分。 本公开还涉及使用接合材料的接合方法。

公开(公告)号：US08105414B2

公开(公告)日：2012-01-31

申请号：US12512315

申请日：2009-07-30

Applicant: Alfred A. Zinn

Inventor： Alfred A. Zinn

IPC: B22F1/00 ,  B22F1/02

CPC classification number: C23C24/08 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2203/107 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.

Abstract translation: 组合物可以具有直径为20纳米或更小并具有小于约220℃的熔融温度的金属纳米颗粒。制备金属纳米颗粒的方法可包括制备溶剂，向溶剂中加入前体与金属， 加入第一表面活性剂，在还原剂中混合，并加入第二表面活性剂以阻止纳米颗粒的形成。 形成的铜和/或铝纳米颗粒组合物可用于将电子部件无铅焊接到电路板。 组合物可以包括可以具有铜纳米孔，无定形铝壳和有机表面活性剂涂层的纳米颗粒。 组合物可以具有铜或铝纳米颗粒。 大约30-50％的铜或铝纳米颗粒可以具有20纳米或更小的直径，剩余的70-50％的铜或铝纳米颗粒可以具有大于20纳米的直径。

公开(公告)号：US20120018048A1

公开(公告)日：2012-01-26

申请号：US12307370

申请日：2007-07-03

Applicant: Mitsuo Yamashita ,  Tomoaki Goto ,  Takeshi Asagi

Inventor： Mitsuo Yamashita ,  Tomoaki Goto ,  Takeshi Asagi

IPC: B23K35/26

CPC classification number: H05K3/341 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K2101/36 ,  B23K2101/42 ,  C22C1/0483 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  H01L2924/0132 ,  H01L2924/0133 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/04 ,  H05K2203/12 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01029

Abstract: A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.

Abstract translation: 通过将Sn-Ag-Cu合金与助熔剂捏合而获得的膏状焊料，其中，Sn-Ag-Cu合金包括第一粉末合金和第二粉末合金的混合物，第一粉末合金由Sn- Ag相图具有固液共存区域，并且具有比共晶组合物（3.5重量％银）大的给定银量，第二粉末合金的银量为共晶组合物中的银量（ 3.5重量％的银），或者接近于共晶组合物中的银，并且小于第一粉末合金中的银。 这种膏状焊料具有优异的强度和热稳定性，并且具有令人满意的粘合性能。 它基于廉价的Sn-Ag-Cu焊料合金。 适用于符合温度梯度键合的高温侧无铅焊料。 还提供了一种焊接方法。

公开(公告)号：US20110284914A1

公开(公告)日：2011-11-24

申请号：US13131257

申请日：2008-11-25

Applicant: Motohiro Suzuki ,  Naomi Yonemura ,  Yoshihiko Okajima ,  Tetsuro Maeda ,  Eiji Yoshimura

Inventor： Motohiro Suzuki ,  Naomi Yonemura ,  Yoshihiko Okajima ,  Tetsuro Maeda ,  Eiji Yoshimura

IPC: H01L33/64 ,  B32B37/02 ,  H05K1/11

CPC classification number: H05K1/0204 ,  H01L33/486 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0206 ,  H05K1/0373 ,  H05K1/056 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09054 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2203/1545 ,  H01L2924/00014

Abstract: A substrate for a light emitting element package provided with a thick metal section formed under a mounting position of a light emitting element, comprising:an insulating layer which is composed of a resin containing heat conductive fillers under the mounting position of said light emitting element and has a heat conductivity of 1.0 W/mK or more; and a metal layer disposed inside said insulating layer and having the thick metal section, wherein a heat conductive mask section is disposed at the top of said thick metal section.

Abstract translation: 一种用于发光元件封装的衬底，其具有形成在发光元件的安装位置的厚金属部分，包括：绝缘层，其由在所述发光元件的安装位置处的包含导热填料的树脂构成;以及 热导率为1.0W / mK以上; 以及金属层，其设置在所述绝缘层的内部并且具有厚的金属部分，其中导热掩模部分设置在所述厚金属部分的顶部。

公开(公告)号：US07789285B2

公开(公告)日：2010-09-07

申请号：US11975227

申请日：2007-10-17

Applicant: Cheng Siew Tay ,  Pek Chew Tan ,  Swee Kian Cheng ,  Eng Hooi Yap

Inventor： Cheng Siew Tay ,  Pek Chew Tan ,  Swee Kian Cheng ,  Eng Hooi Yap

IPC: B23K31/02 ,  B05D5/12

CPC classification number: B23K1/0016 ,  B23K2101/42 ,  H01L21/4853 ,  H01L21/486 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2201/035 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2203/043 ,  H05K2203/1476

Abstract: In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than the first size.

Abstract translation: 在一个实施例中，提供了一种方法。 该方法包括用形成第一尺寸的焊球的焊膏填充在焊盘中形成的微孔; 以及用包括第二尺寸的焊球的焊膏涂覆所述接合焊盘，其中所述第二尺寸大于所述第一尺寸。

公开(公告)号：US20100104835A1

公开(公告)日：2010-04-29

申请号：US12510162

申请日：2009-07-27

Applicant: Soo Hyun LYOO ,  Yong Seok CHOI

Inventor： Soo Hyun LYOO ,  Yong Seok CHOI

IPC: B32B5/16 ,  B32B37/14 ,  B32B3/00

CPC classification number: B32B18/00 ,  C04B2235/36 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/656 ,  C04B2237/343 ,  C04B2237/56 ,  C04B2237/588 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01G4/129 ,  H01G4/30 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/24926 ,  Y10T428/2495 ,  Y10T428/252

Abstract: There are provided a ceramic laminate and a method of manufacturing a ceramic sintered body. A ceramic laminate according to an aspect of the invention may include: at least one ceramic sheet having first ceramic particles and glass particles; and at least one constraining sheet having second ceramic particles and alternating with the ceramic sheet while the constraining sheet and the ceramic sheet are in contact with each other, wherein the glass particles and the first ceramic particles each have a larger particle size than the second ceramic particles, and the first ceramic particles have a particle size of 1 μm or more, the glass particles have a particle size within the range of 1 μm to 10 μm, and the second ceramic particles have a particle size of 1 μm or less. An aspect of the present invention provides a ceramic laminate having constraining layers that can evenly exert a constraining force onto a ceramic laminate during sintering.

Abstract translation: 提供陶瓷层压体和制造陶瓷烧结体的方法。 根据本发明的一个方面的陶瓷层压体可以包括：至少一个具有第一陶瓷颗粒和玻璃颗粒的陶瓷片; 以及至少一个具有第二陶瓷颗粒并且在约束片和陶瓷片彼此接触的同时与陶瓷片交替的约束片，其中玻璃粒子和第一陶瓷粒子的粒径大于第二陶瓷粒径 颗粒，并且第一陶瓷颗粒具有1μm以上的粒径，玻璃粒子的粒径在1μm〜10μm的范围内，第二陶瓷粒子的粒径为1μm以下。 本发明的一个方面提供一种具有约束层的陶瓷层压板，其可以在烧结期间均匀地施加在陶瓷层压板上的约束力。

公开(公告)号：US07700185B2

公开(公告)日：2010-04-20

申请号：US10557890

申请日：2004-05-19

Applicant: Yasushi Kumashiro ,  Yoshitaka Hirata ,  Shin Takanezawa ,  Yasushi Shimada ,  Kazuhisa Otsuka ,  Hiroyuki Kuriya ,  Kazunori Yamamoto

Inventor： Yasushi Kumashiro ,  Yoshitaka Hirata ,  Shin Takanezawa ,  Yasushi Shimada ,  Kazuhisa Otsuka ,  Hiroyuki Kuriya ,  Kazunori Yamamoto

IPC: B32B5/16 ,  B32B15/04 ,  C08K7/00 ,  C08K3/22

CPC classification number: H05K1/162 ,  H01B3/30 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/25 ,  Y10T428/269 ,  Y10T428/31678

Abstract: There is provided an insulation material having a dielectric constant of 10 or more, comprising a filler having a dielectric constant of 50 or more and having two peaks in different particle size ranges in a particle size distribution and an insulating resin combined with each other; an insulation material having a dielectric constant of 10 or more comprising, as essential components, 1) at least one filler selected from the group consisting of barium titanate, strontium titanate, potassium titanate, magnesium titanate, lead titanate, titanium dioxide, barium zirconate, calcium zirconate and lead zirconate, 2) an insulating resin and 3) a dispersant containing a carboxylic group; or an insulation material comprising a filler having a dielectric constant of 50 or more, a dispersant for dispersing the filler and an insulating resin as essential components, wherein an extract of a cured product of the insulation material obtained by extraction with water at 120° C. for 20 hours using a pressure vessel has a pH of 6 or higher.

Abstract translation: 提供介电常数为10以上的绝缘材料，其包含介电常数为50以上的填料，并且在粒度分布中具有不同粒径范围的两个峰和彼此结合的绝缘树脂; 一种具有10或更高介电常数的绝缘材料，其包含作为必要组分的1）至少一种选自钛酸钡，钛酸锶，钛酸钾，钛酸镁，钛酸铅，二氧化钛，锆酸钡， 锆酸锆和锆酸铅，2）绝缘树脂和3）含有羧基的分散剂; 或包含介电常数为50以上的填料的绝缘材料，用于分散填料的分散剂和绝缘树脂作为必要成分，其中通过在120℃下用水萃取获得的绝缘材料的固化产物的提取物 使用压力容器20小时，pH为6以上。