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公开(公告)号：US11812553B2
公开(公告)日：2023-11-07
申请号：US17731621
申请日：2022-04-28
Inventor： Stephen McGarry Hatch , Jonathan Douglas Hatch
CPC classification number: H05K1/09 , H05K1/118 , H05K3/103 , H05K1/0393 , H05K1/11 , H05K1/189 , H05K2201/0335 , H05K2201/05 , H05K2201/1028
Abstract: A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.
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公开(公告)号：US20230199945A1
公开(公告)日：2023-06-22
申请号：US17923424
申请日：2021-06-11
Applicant: LG ENERGY SOLUTION, LTD.
Inventor： Ga Young WOO , Seog Jin YOON
CPC classification number: H05K1/028 , H05K1/0266 , H05K3/0014 , H05K3/0047 , H05K3/0023 , H05K3/381 , H05K3/384 , H05K13/04 , H05K2203/0278 , H05K2203/0264 , H05K2201/05 , H05K2201/09936
Abstract: The present disclosure relates to a flexible printed circuit board (FPCB) and a method for manufacturing a flexible printed circuit board, which is capable of minimizing a process tolerance generated when an outer shape of a board is processed by forming a reference mark in the FPCB and performing an outer shape processing by using the reference mark as a reference point among a series of processes for manufacturing the board.
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公开(公告)号：US20190189152A1
公开(公告)日：2019-06-20
申请号：US16273721
申请日：2019-02-12
Applicant: NHK SPRING CO., LTD.
Inventor： Hajime ARAI
CPC classification number: G11B5/4846 , G11B5/1272 , G11B5/4826 , G11B5/484 , G11B5/486 , H05K1/0245 , H05K1/0277 , H05K1/0298 , H05K1/056 , H05K1/18 , H05K1/189 , H05K3/0011 , H05K3/18 , H05K2201/05 , H05K2201/09245 , H05K2201/097 , H05K2201/2009 , Y10T29/49194
Abstract: A wiring structure of a head suspension including a flexure that supports a head and is attached to a load beam applying load onto the head, includes write wiring and read wiring formed on the flexure and connected to the head, each having wires of opposite polarities and further including a stacked interleaved part which includes segments electrically connected to the respective wires of the write wiring, the segments stacked on and facing the wires through an electrical insulating layer so that the facing wire and segment have opposite polarities, is manufactured by a wiring step, an insulating layer forming step and a stacked interleaved part forming step.
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公开(公告)号：US20190081389A1
公开(公告)日：2019-03-14
申请号：US16123021
申请日：2018-09-06
Applicant: ASUSTeK COMPUTER INC.
Inventor： Chien-Hung TSAI , Kuo-Chu LIAO , Wei-Cheng LO , Te-Li LIEN , Hsuan-Chi TSAI , Ming-Shan WU , Yung-Chieh YU
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q7/00 , H04B5/0081 , H05K1/028 , H05K1/165 , H05K2201/05 , H05K2201/09063 , H05K2201/09072 , H05K2201/10098
Abstract: An antenna module is provided. The antenna module includes a circuit board, a conductive layer, and a spiral coil. The circuit board has a first surface and a second surface opposite to each other. The circuit board further includes a first block and a second block connected to each other. The conductive layer is disposed on the first block. The spiral coil is disposed in the second block of the circuit board. The conductive layer at least partially surrounds the spiral coil.
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公开(公告)号：US20180255636A1
公开(公告)日：2018-09-06
申请号：US15758527
申请日：2016-09-23
Applicant: AMOGREENTECH CO., LTD.
Inventor： In Yong SEO
CPC classification number: H05K1/038 , A41D1/002 , D04H1/728 , D10B2401/18 , D10B2403/02431 , G02B27/017 , G06F1/163 , H05K1/0212 , H05K3/12 , H05K2201/0278 , H05K2201/0293 , H05K2201/05 , H05K2201/10151
Abstract: Provided is a wearable device and a method of manufacturing the same. The wearable device includes: a wearable flexible printed circuit board having a circuit pattern formed on a base substrate having flexibility, air-permeability, and waterproofness; and a functional module mounted on the wearable flexible printed circuit board.
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Patent Agency Ranking
公开(公告)号：US20180175274A1
公开(公告)日：2018-06-21
申请号：US15578472
申请日：2016-06-02
Applicant: WISOL CO., LTD.
Inventor： Jung Rae NOH , Jae Hyung CHOI , Yo Sep CHOI
CPC classification number: H01L41/042 , H01L41/094 , H02N2/04 , H05K1/189 , H05K2201/05 , H05K2201/10068 , H05K2203/0292
Abstract: A piezoelectric vibration module includes a vibration plate adapted to have one end fixed and the other end not fixed and driven in a vertical direction based on the fixed first end, a first piezoelectric element attached to the top or bottom of the vibration plate and adapted to generate a vibration power when power is applied, and a weight formed in the other end of the top or bottom of the vibration plate and adapted to control the vibration frequency of the piezoelectric vibration module. The first piezoelectric element is attached to the top or bottom of the vibration plate with a predetermined interval from a fixed point at the one end of the vibration plate.
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公开(公告)号：US09955574B2
公开(公告)日：2018-04-24
申请号：US14369909
申请日：2012-01-13
Applicant: Koichiro Tanaka , Kazuki Kammuri
Inventor： Koichiro Tanaka , Kazuki Kammuri
CPC classification number: H05K1/0393 , B32B7/02 , B32B15/08 , B32B15/20 , B32B2307/712 , B32B2457/08 , H05K1/053 , H05K1/056 , H05K1/09 , H05K3/022 , H05K2201/0145 , H05K2201/0154 , H05K2201/0355 , H05K2201/0358 , H05K2201/05 , H05K2201/06 , Y10T29/302 , Y10T428/12438 , Y10T428/273
Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1
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18.发明申请公开(公告)号：US20180042125A1
公开(公告)日：2018-02-08
申请号：US15365674
申请日：2016-11-30
Applicant: TAIMIDE TECHNOLOGY INCORPORATION
Inventor： Yen-Po Huang , Tsung-Hsien Tsai
CPC classification number: H05K3/007 , C03C17/3405 , C03C2218/11 , C03C2218/32 , C08G73/1039 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08L79/08 , C08L2203/20 , C09D179/08 , H01L21/6835 , H01L23/4985 , H01L23/49894 , H01L2221/68345 , H01L2221/68386 , H05K1/0393 , H05K3/4682 , H05K3/4691 , H05K2201/0154 , H05K2201/05 , H05K2203/0152 , H05K2203/016 , H05K2203/0264 , C08L27/18 , C08K5/544
Abstract: A method of fabricating a flexible printed circuit includes providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other, forming a flexible substrate on the carrying support, the formed flexible substrate being adhered in contact with the release layer, applying one or more processing step on the flexible substrate while the flexible substrate is supported by the carrying support, and peeling the flexible substrate with an electric circuit formed thereon from the release layer while the release layer remains adhered in contact with the support base.
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公开(公告)号：US09875834B2
公开(公告)日：2018-01-23
申请号：US15184626
申请日：2016-06-16
Applicant: Sensata Technologies, Inc.
Inventor： Janselme M. Eral , Richard R. Guerrero
CPC classification number: H01F7/0205 , H05K1/028 , H05K1/0346 , H05K1/0393 , H05K1/111 , H05K2201/0154 , H05K2201/05 , H05K2201/09063 , Y02P70/611
Abstract: A flexible printed circuit may include a flexible body portion and a flexible head end portion, where conductors and/or elongated cut outs may be formed in a pattern. The flexible body may include a proximal end and a distal end, wherein the proximal end is configured to be connected to a stationary object and the distal end is configured to be connected to a moving object that moves in relation to the stationary object. The head end of the flexible printed circuit may be located at the distal end of the flexible body. The head end may include a plurality of elongated cut-outs, and/or a plurality of electrical connection pads suspended from the flexible body by the plurality of elongated cutouts.
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公开(公告)号：US20180019417A1
公开(公告)日：2018-01-18
申请号：US15587625
申请日：2017-05-05
Applicant: Japan Display Inc.
Inventor： Naohisa ANDOU
CPC classification number: H01L51/0097 , H01L27/3244 , H01L51/56 , H01L2251/5338 , H05K1/0269 , H05K1/028 , H05K1/118 , H05K2201/05
Abstract: A method for manufacturing a display device includes the steps of preparing a spacer that includes a first alignment mark, forming a notch on a back reinforcing film and cutting the back reinforcing film in a size corresponding to a size of a first bottom surface, disposing the back reinforcing film on a back surface side of a display area, disposing the spacer on a back surface side of a flexible substrate, and bending a bent area so as to conform to a shape of the spacer and disposing a terminal area on a back surface side of the spacer. In the step of disposing the spacer, viewed from the back surface side of the flexible substrate, the spacer is positioned on the back reinforcing film based on a position of the notch and a position of the first alignment mark.
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