公开(公告)号：US09866738B2

公开(公告)日：2018-01-09

申请号：US14793111

申请日：2015-07-07

Applicant: OLYMPUS CORPORATION

Inventor： Kazuaki Kojima

IPC: A61B1/04 ,  H04N5/225 ,  A61B1/00 ,  A61B1/05 ,  G02B23/24 ,  H04N5/369 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K5/04

CPC classification number: H04N5/2257 ,  A61B1/0011 ,  A61B1/00124 ,  A61B1/051 ,  G02B23/2484 ,  H04N5/2253 ,  H04N5/369 ,  H05K1/021 ,  H05K1/181 ,  H05K1/189 ,  H05K3/3431 ,  H05K5/04 ,  H05K2201/055 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/1305 ,  H05K2203/302

Abstract: A manufacturing method of an image pickup apparatus includes a step of manufacturing an image pickup device chip, a step of manufacturing a wiring board having first terminals and second terminals disposed on both sides of a first primary surface with a central flexible portion intervened in between, a step of joining a heat conductive block to a second primary surface of the wiring board, a step of joining the image pickup device chip to the first terminals of the wiring board, a step of performing solder joining of core wires of a cable to the second terminals of the wiring board by conducting heat generated by a heat tool through the heat conductive block, a step of bending the wiring board, and a step of performing housing inside a frame member, and sealing with sealing resin.

公开(公告)号：US20170182723A1

公开(公告)日：2017-06-29

申请号：US15391745

申请日：2016-12-27

Applicant: Massachusetts Institute of Technology

Inventor： Samuel Eli Calisch ,  Neil A. Gershenfeld

IPC: B29D99/00 ,  B29C53/80 ,  B64C3/00 ,  B31D3/02 ,  H05K1/02 ,  B29C53/36 ,  B29D35/12

CPC classification number: B29D99/0089 ,  A43B1/0009 ,  B29C53/285 ,  B29C53/36 ,  B29C53/80 ,  B31D3/0207 ,  B64C3/20 ,  F21V1/18 ,  F21Y2109/00 ,  F21Y2115/10 ,  H05K1/028 ,  H05K2201/055 ,  H05K2201/09045

Abstract: A method of forming a structural honeycomb includes cutting and folding a substrate sheet according to predetermined cutting and folding patterns and fold angles that cause the sheet to form a honeycomb having cells that each have at least one face abutting, or nearly abutting, the face of another cell. The honeycomb is then stabilized by joining abutting, or nearly abutting, faces to hold the honeycomb together. The honeycomb may have a prespecified three-dimensional shape. The folding pattern may include corrugation, canted corrugation, or zig-zag folds. Joining may employ fixed and/or reversible joinery, including slotted cross section, tabbed strip, angled strip, integral skin, sewn, or laced. At least some folds may be partially-closed to create bends and twists in the honeycomb structure. Some surfaces of the honeycomb may be covered with a skin or face sheet. The substrate sheet may have flexible electronic traces.

公开(公告)号：US20170111998A1

公开(公告)日：2017-04-20

申请号：US15187002

申请日：2016-06-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. BRODSKY ,  James A. BUSBY ,  Edward N. COHEN ,  Phillip Duane ISAACS

IPC: H05K3/10

CPC classification number: H05K3/10 ,  G06F21/00 ,  G06F21/87 ,  H05K1/0275 ,  H05K1/028 ,  H05K2201/055 ,  H05K2201/09263

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes, for instance, a tamper-respondent sensor having at least one flexible layer and paired conductive lines disposed on the at least one flexible layer. The paired conductive lines form, at least in part, at least one tamper-detect network of the tamper-respondent sensor. The tamper-respondent electronic circuit structure further includes monitor circuitry electrically connected to the paired conductive lines to differentially monitor the paired conductive lines for a tamper event. In enhanced embodiments, multiple interconnect vias electrically connect to two or more layers of paired conductive lines and are disposed in an unfolded interconnect area of the tamper-respondent sensor when the sensor is operatively positioned about an electronic component or assembly to be protected.

公开(公告)号：US20170111993A1

公开(公告)日：2017-04-20

申请号：US15294592

申请日：2016-10-14

Applicant: OSRAM OLED GmbH

Inventor： Erwin LANG ,  Heiko HEPPNER

IPC: H05K1/14 ,  F21V23/06 ,  H05K1/11 ,  H01R12/79 ,  H01L51/00 ,  H05K1/18

CPC classification number: H05K1/147 ,  F21K9/20 ,  F21V23/06 ,  F21Y2115/15 ,  H01L51/0097 ,  H01L51/5203 ,  H01L2251/5338 ,  H01R12/79 ,  H05K1/028 ,  H05K1/111 ,  H05K1/117 ,  H05K1/16 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/055 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2203/168

Abstract: In one embodiment, the organic light emitting diode (1) comprises a carrier substrate (2) having an organic layer stack for producing light. The organic light emitting diode (1) is electrically connectable via at least one connector (3) as intended. The connector (3) has two main sides (32) situated opposite one another that each have at least two electrical contact pads (31) of the connector (3) located on them. As seen in a cross section perpendicular to the main sides (32) and perpendicular to an insertion direction (x) of the connector (3), the contact pads (31) are arranged both geometrically and with electrical point symmetry, so that incorrect-polarity protection against incorrect electrical connection of the organic light emitting diode (1) is attained.

公开(公告)号：US20170094803A1

公开(公告)日：2017-03-30

申请号：US15249663

申请日：2016-08-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John R. DANGLER ,  Phillip Duane ISAACS ,  David C. LONG

IPC: H05K3/10

CPC classification number: H05K3/10 ,  G06F21/72 ,  G06F21/87 ,  H05K1/0275 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/147 ,  H05K1/167 ,  H05K3/062 ,  H05K3/366 ,  H05K2201/0352 ,  H05K2201/042 ,  H05K2201/047 ,  H05K2201/055 ,  H05K2201/09036 ,  H05K2201/09263 ,  H05K2201/10151

Abstract: Methods of fabricating tamper-respondent electronic circuit structures and electronic assembly packages are provided which include, at least in part, a tamper-respondent sensor including one or more formed flexible layers of, for instance, a dielectric material, having opposite first and second sides, and circuit lines defining at least one resistive network. The circuit lines are disposed on at least one of the first side or the second side of the formed flexible layer(s). The formed flexible layer(s) with the circuit lines includes curvatures, and the circuit lines overlie, at least in part, the curvatures of the formed flexible layer(s). In certain embodiments, the formed flexible layer(s) may be one or more corrugated layers or one or more flattened, folded layers.

公开(公告)号：US09554484B2

公开(公告)日：2017-01-24

申请号：US13853770

申请日：2013-03-29

Applicant: The Board of Trustees of the University of Illinois

Inventor： John A Rogers ,  Ming Ying ,  Andrew Bonifas ,  Nanshu Lu

IPC: H05K1/00 ,  H05K7/02 ,  A61B5/00 ,  A41D19/015 ,  H05K3/00 ,  A61B5/11 ,  H01L23/538 ,  A61B5/01 ,  H05K1/02

CPC classification number: A61B5/6806 ,  A41D19/015 ,  A61B5/01 ,  A61B5/1125 ,  A61B5/483 ,  A61B5/4875 ,  A61B5/6826 ,  A61B5/6843 ,  A61B5/7455 ,  A61B34/35 ,  A61B34/76 ,  A61B42/10 ,  A61B2034/741 ,  A61B2505/05 ,  A61B2562/0209 ,  A61B2562/0233 ,  A61B2562/0247 ,  A61B2562/0261 ,  A61B2562/0271 ,  A61B2562/028 ,  A61B2562/0285 ,  A61B2562/029 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/227 ,  A61N1/0456 ,  A61N1/0476 ,  H01L23/5388 ,  H01L2224/95 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K1/11 ,  H05K1/162 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/303 ,  H05K7/02 ,  H05K2201/0133 ,  H05K2201/055 ,  H05K2201/10098 ,  H05K2201/10151 ,  Y10T29/49124 ,  H01L2924/00

Abstract: Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and/or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

Abstract translation: 公开了附件可安装的电子系统和用于覆盖和符合附属表面的相关方法。 柔性或可拉伸基底具有用于接收附件的内表面，其包括具有弯曲表面的附肢和可外部表面接近的相对外表面。 取决于感兴趣的应用，可拉伸或柔性电子器件由衬底内表面和/或外表面支撑。 与基板组合的电子装置提供净弯曲刚度，以便于内表面与外壳内提供的附件的表面之间的共形接触。 在一方面，该系统能够在不影响电子设备功能的情况下进行表面翻转，例如包括传感器阵列，致动器或传感器和致动器的电子设备。

公开(公告)号：US20170017873A1

公开(公告)日：2017-01-19

申请号：US15171281

申请日：2016-06-02

Applicant: FUJITSU LIMITED

Inventor： Shunji Baba ,  Hiroyuki Nakamoto

IPC: G06K19/077 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/028 ,  G06K19/0704 ,  G06K19/0716 ,  G06K19/072 ,  G06K19/07722 ,  G06K19/07728 ,  G06K19/07773 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0314 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10068 ,  H05K2201/10098 ,  H05K2201/10143

Abstract: A substrate includes: a base member that has flexibility and insulation properties; an electrically conductive member disposed on the base member and has flexibility and electrical conductivity; an electronic component disposed over the base member and coupled to the electrically conductive member; and a covering member that has flexibility and insulation properties and that covers a portion of the base member and a portion of the electronic component, wherein the covering member has a hardness higher than a hardness of the base member, and wherein the base member is bent so as to hold the covering member inside.

Abstract translation: 基板包括：具有柔性和绝缘性能的基体; 导电构件，其设置在所述基底构件上并具有柔性和导电性; 电子部件，设置在所述基座部件上并且耦合到所述导电部件; 以及覆盖部件，其具有柔性和绝缘性能，并且覆盖所述基部部件的一部分和所述电子部件的一部分，其中所述覆盖部件具有高于所述基部部件的硬度的硬度，并且其中所述基部部件弯曲 以便将盖部件保持在内部。

公开(公告)号：US09516744B2

公开(公告)日：2016-12-06

申请号：US14253939

申请日：2014-04-16

Applicant: Thomas Nathaniel Tombs ,  Ronald Steven Cok ,  Christopher R. Morton

Inventor： Thomas Nathaniel Tombs ,  Ronald Steven Cok ,  Christopher R. Morton

IPC: H01R43/00 ,  H05K1/02 ,  H05K3/22 ,  H05K1/18 ,  H05K3/10 ,  H05K3/12 ,  H05K3/46 ,  G06F3/044

CPC classification number: H05K1/028 ,  G06F3/044 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/22 ,  H05K3/4635 ,  H05K2201/0108 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10121 ,  H05K2201/10128 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T156/1015

Abstract: A method of making a micro-wire circuit structure adapted for wrapping includes providing a display and a flexible substrate. The flexible substrate includes a plurality of electrically conductive micro-wires on, in, or adjacent to a common side of the flexible substrate and forming micro-wire electrodes in a touch portion of the flexible substrate. One or more electrical circuits is located on or in a circuit portion of the flexible substrate and one or more micro-wires electrically connects the one or more electrical circuits to corresponding micro-wire electrodes. The flexible substrate is located in relation to the display with the touch portion located adjacent to a display viewing side, the circuit portion located adjacent to a display back side, and an edge portion of the flexible substrate wrapping around a display edge from the display viewing side to the display back side.

Abstract translation: 制造适于包装的微线电路结构的方法包括提供显示器和柔性基板。 柔性基板包括在柔性基板的共同侧上或附近的多个导电微线，并且在柔性基板的接触部分中形成微线电极。 一个或多个电路位于柔性基板的电路部分上或电路部分中，并且一个或多个微线将一个或多个电路电连接到相应的微线电极。 柔性基板相对于显示器定位，触摸部分位于显示观察侧附近，电路部分位于显示器背面附近，并且柔性基板的边缘部分从显示器观看围绕显示边缘缠绕 侧面显示背面。

公开(公告)号：US09491854B2

公开(公告)日：2016-11-08

申请号：US13865730

申请日：2013-04-18

Applicant: RAYTHEON COMPANY

Inventor： Clifton Quan ,  Hee Kyung Kim ,  Fangchou Yang ,  Kevin C. Rolston ,  Edward Marsh Jackson

IPC: H05K1/02 ,  H05K3/36 ,  H05K1/14 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K1/024 ,  H05K1/144 ,  H05K1/147 ,  H05K3/361 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/055 ,  H05K2201/058 ,  H05K2201/09109 ,  H05K2201/09318 ,  H05K2201/10378 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole.

Abstract translation: 提供多层微波波纹印刷电路板。 在一个实施例中，互连组件包括具有信号导体和形成第一微带或微带传输线的接地导体的第一扁平柔性层，具有信号导体的第二折叠柔性层和形成第二微带或微带传输的接地导体 具有脊部的第二折叠柔性层的底面，设置在第一平面柔性层的顶面与第二折叠柔性层的隆起部之间的非导电性粘合剂层，延伸穿过的信号通孔 非导电粘合剂层和第一平坦柔性层，以及延伸穿过非导电粘合剂层和第二折叠柔性层的两个接地通孔，其中两个接地通孔设置在信号通过的相对侧上 -孔。

公开(公告)号：US09474160B2

公开(公告)日：2016-10-18

申请号：US14400261

申请日：2012-05-18

Applicant: Logan Peter Palmer

Inventor： Logan Peter Palmer

IPC: H05K7/00 ,  H05K1/18 ,  H05K3/28 ,  H05K9/00 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/189 ,  H05K3/0091 ,  H05K3/284 ,  H05K3/4691 ,  H05K9/0022 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/042 ,  H05K2201/055 ,  H05K2201/056 ,  Y10T29/49124

Abstract: Printed circuit board apparatus with electromagnetic interference shields and methods of making the same.

Abstract translation: 具有电磁干扰屏蔽的印刷电路板装置及其制造方法。