公开(公告)号：US11729897B1

公开(公告)日：2023-08-15

申请号：US17850721

申请日：2022-06-27

Applicant: Meta Platforms Technologies, LLC

Inventor： Qiuming Li ,  Ming Lei ,  Colden Niles Eldridge ,  Yeonsoo Ko

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K1/0216 ,  H05K9/0032 ,  H05K2201/0715 ,  H05K2201/10371

Abstract: The disclosed hybrid shielding structure may include a printed circuit board (PCB) that is to be overmolded with at least a portion of molding compound. The PCB may include various electronic components disposed thereon. The hybrid shielding structure may also include conductive trenches and conductive fences that are disposed on the PCB. The conductive trenches and the conductive fences may provide an electromagnetic shield for at least a portion of the electronic components of the PCB. The hybrid shielding structure may further include a conformal shielding and a PCB ground flood and ground layers. Various other systems, electronic devices, apparatuses, and methods of manufacturing are also disclosed.

公开(公告)号：US20190191250A1

公开(公告)日：2019-06-20

申请号：US16217542

申请日：2018-12-12

Applicant: YAMAHA CORPORATION

Inventor： Shinichi FUJITA

IPC: H04R5/04 ,  H04S5/00

CPC classification number: H04R5/04 ,  H03F3/181 ,  H03F3/68 ,  H03F2200/03 ,  H03F2200/189 ,  H04S5/00 ,  H05K1/0219 ,  H05K1/142 ,  H05K1/144 ,  H05K2201/0715 ,  H05K2201/09672

Abstract: An amplifying device includes first and second substrates. The first substrate has a first mounting surface, and the second substrate has a second mounting surface. The first mounting surface of the first substrate that is opposite the second substrate is provided with: a first ground line; a first signal line configured to transfer an audio signal; and a first amplifier configured to amplify the audio signal. The second mounting surface of the second substrate that is opposite the first substrate is provided with: a second grounded line; a second signal line configured to transfer an audio signal; and a second amplifier configured to amplify the audio signal. The first and second grounded lines correspond to each other in position and shape, and overlap in planar view. The first and second signal lines correspond to each other in position and shape, and overlap in planar view.

公开(公告)号：US20190029109A1

公开(公告)日：2019-01-24

申请号：US16144421

申请日：2018-09-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takanori UEJIMA

IPC: H05K1/02 ,  H05K1/18 ,  H04B1/40

CPC classification number: H05K1/0216 ,  H01L23/00 ,  H01L2924/15311 ,  H01L2924/19105 ,  H04B1/00 ,  H04B1/38 ,  H04B1/40 ,  H05K1/0218 ,  H05K1/182 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/10378 ,  H05K2201/10522 ,  H05K2203/1316

Abstract: A front-end circuit includes an insulating substrate, a power amplifier, a receiver circuit device, and a shielding conductor. The power amplifier and the receiver circuit device are mounted on a top surface of the insulating substrate. The shielding conductor covers a part of the insulating substrate at the top surface side. A transmitter circuit region (Retx) where the power amplifier is mounted is arranged closer to a first side surface side than a second side surface. A receiver circuit region (Rerx) where the receiver circuit device is mounted is arranged between the transmitter circuit region (Retx) and the second side surface. The shielding conductor includes a top surface side conductor covering the transmitter circuit region (Retx) and a first side surface side conductor covering the first side surface side of the transmitter circuit region (Retx).

公开(公告)号：US20190008032A1

公开(公告)日：2019-01-03

申请号：US16125886

申请日：2018-09-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takanori UEJIMA

IPC: H05K1/02 ,  H05K9/00 ,  H05K1/18 ,  H03H7/38 ,  H04B1/04

CPC classification number: H05K1/0216 ,  H01L23/3121 ,  H01L23/552 ,  H01L2223/6655 ,  H01L2224/16227 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H03H7/38 ,  H04B1/0475 ,  H04B1/525 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/181 ,  H05K9/0022 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/0919 ,  H05K2201/1006

Abstract: A high-frequency module includes a branching circuit element, a multilayer substrate, and a shield conductor. The branching circuit element includes transmission and receiving terminals and is disposed on a surface of the multilayer substrate. The shield conductor is disposed on the side of the surface of the multilayer substrate and covers the branching circuit element. The transmission and receiving terminals are disposed with respect to the shield conductor such that a signal in at least a portion of the frequency band of a first signal, which is transmitted from the transmission terminal, is cancelled by a second signal at the receiving terminal.

公开(公告)号：US20180255667A1

公开(公告)日：2018-09-06

申请号：US15756114

申请日：2017-03-27

Applicant: OMRON CORPORATION

Inventor： Wakahiro KAWAI

IPC: H05K9/00 ,  H05K1/18 ,  H05K5/04 ,  H05K3/12

CPC classification number: H05K9/0084 ,  H01L21/565 ,  H01L21/568 ,  H01L23/00 ,  H01L23/3135 ,  H01L23/552 ,  H05K1/0218 ,  H05K1/182 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/125 ,  H05K3/282 ,  H05K3/288 ,  H05K5/04 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09118 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/1316 ,  H05K2203/1469

Abstract: The present invention provides an electronic device which includes an electromagnetic shield, can keep down a production cost, can be made to have a reduced thickness, and has a high degree of freedom in designing a wiring circuit. Further, the present invention provides a method for producing such an electronic device. The electronic device (1A) includes at least one high frequency functional component (21), an electrically conductive member (10) which electromagnetically shields the at least one high frequency functional component (21), and a resin molded body (23) in which at least part of the high frequency functional component (21) and at least part of the electrically conductive member (10) are embedded and fixed.

公开(公告)号：US20180199427A1

公开(公告)日：2018-07-12

申请号：US15859784

申请日：2018-01-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kunihiro MIYAHARA

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0218 ,  H01G4/20 ,  H03H7/0153 ,  H05K1/0224 ,  H05K1/0269 ,  H05K1/115 ,  H05K9/00 ,  H05K9/0049 ,  H05K2201/0195 ,  H05K2201/0715 ,  H05K2201/09936

Abstract: An electronic component includes dielectric layers laminated along a lamination direction and shield electrodes. The dielectric layers include first and second dielectric layers. The side surfaces of the first dielectric layer are not covered with the shield electrodes. The side surfaces of the second dielectric layer are covered with the shield electrodes. The dielectric constant of the first dielectric layer is lower than the second dielectric constant of the dielectric layer.

公开(公告)号：US10015915B2

公开(公告)日：2018-07-03

申请号：US14360609

申请日：2012-10-12

Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

Inventor： Hiroshi Tajima ,  Sirou Yamauchi ,  Kenji Kamino ,  Masahiro Watanabe

IPC: H05K9/00 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K9/00 ,  H05K1/0216 ,  H05K3/28 ,  H05K9/0084 ,  H05K9/0088 ,  H05K2201/0715 ,  Y10T29/49226

Abstract: To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 μm to 12 μm thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.

公开(公告)号：US09999120B2

公开(公告)日：2018-06-12

申请号：US14367894

申请日：2012-11-27

Applicant: Florian Poprawa ,  Markus Schieber ,  Christina Schindler ,  Jörg Zapf

Inventor： Florian Poprawa ,  Markus Schieber ,  Christina Schindler ,  Jörg Zapf

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K3/30 ,  H05K3/40 ,  H01L23/00 ,  H05K3/28

CPC classification number: H05K1/0216 ,  H01L24/19 ,  H01L2224/18 ,  H05K1/0225 ,  H05K1/0243 ,  H05K1/115 ,  H05K1/18 ,  H05K1/185 ,  H05K3/284 ,  H05K3/30 ,  H05K3/4038 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2203/1469 ,  Y10T29/4913

Abstract: The invention relates to a circuit carrier (11), comprising a digital circuit, which contains at least two components (12, 14) that are electrically connected to each other (19, 21, 20). Additionally, an electric shield (24) is provided. According to the invention, the electric shield (24) and a conducting path (21) for electrically connecting the components (12, 14) are realized by means of a single layered composite (18). In particular, the electric shield (24) and the conducting path (21) are formed by the same electrically conductive layer, wherein a hole (25) ensures complete electrical insulation of the conducting path (21) from the shield (24). The invention further relates to a method for producing such a circuit carrier.

公开(公告)号：US09994153B2

公开(公告)日：2018-06-12

申请号：US15520371

申请日：2015-10-20

Applicant: Connaught Electronics Ltd.

Inventor： Martin Oliver Coleman

IPC: B60R1/00 ,  H01R13/66 ,  H04N5/225 ,  H01R13/658 ,  H05K1/02 ,  H05K1/14

CPC classification number: B60R1/00 ,  H01R13/658 ,  H01R13/66 ,  H01R13/6625 ,  H01R2201/26 ,  H04N5/225 ,  H04N5/2257 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/14 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/0715 ,  H05K2201/10121

Abstract: The invention relates to a camera (2) for a motor vehicle (1), which includes a printed circuit board (16), on which a current connector (29) and a communication bus connector (30) and a video interface connector (31) each for connecting to the motor vehicle (1) are disposed, wherein the video interface connector (31) is connected to a capacitor (25) and a parallel-to-serial converter (26), wherein the video interface connector (31) and/or the capacitor (25) and/or the parallel-to-serial converter (26) are surrounded by a device (32) shielding electromagnetic radiation.

公开(公告)号：US09913412B2

公开(公告)日：2018-03-06

申请号：US14308386

申请日：2014-06-18

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar S. Pennathur

IPC: H05K7/00 ,  H05K9/00 ,  H05K1/02 ,  H05K3/28 ,  H05K1/18 ,  H05K1/16

CPC classification number: H05K9/0024 ,  H01L2924/1815 ,  H01L2924/3025 ,  H05K1/0215 ,  H05K1/0218 ,  H05K3/284 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09972 ,  H05K2201/1056

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and conformally coating the insulating layer and trenches with a metal shielding layer. In some examples, trenches between subsystems can be formed using a laser source. In some examples, trenches between subsystems can have angled walls. In some examples, the metal shielding layer can be formed using at least one of electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition.