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公开(公告)号：US09978510B2
公开(公告)日：2018-05-22
申请号：US14418308
申请日：2013-08-09
Applicant: Phoenix Contact GmbH & Co. KG
Inventor： Peter-Dominik Scholz
IPC: H01F27/29 , H01F38/14 , H01F17/00 , H01F17/04 , H01F27/28 , H05K1/16 , H05K1/14 , H05K3/46 , H01F19/08
CPC classification number: H01F38/14 , H01F17/0013 , H01F17/04 , H01F27/2804 , H01F27/29 , H01F2019/085 , H01F2027/2819 , H05K1/141 , H05K1/165 , H05K3/46 , H05K2201/086
Abstract: A planar transmitter having a vertical extent and a horizontal extent, having a layer structure with a plurality of electrical circuits, wherein a first electrical circuit and a second electrical circuit are electrically conductively disconnected from one another. The transmitter also has at least one magnetic core which at least partially surrounds the layer structure and acts at least on the first electrical circuit and on the second electrical circuit, wherein the first electrical circuit and the second electrical circuit lie substantially in one plane and form one layer of the layer structure. Provision is further made for at least the first electrical circuit or the second electrical circuit to be subdivided into a plurality of electrical circuits which are electrically conductively disconnected from one another.
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公开(公告)号：US09978505B2
公开(公告)日：2018-05-22
申请号：US14777399
申请日：2014-03-10
Applicant: OMRON AUTOMOTIVE ELECTRONICS CO., LTD.
Inventor： Koji Hachiya , Tomoyoshi Kobayashi , Koichi Nakabayashi
CPC classification number: H01F27/2876 , H01F27/22 , H01F27/2804 , H01F37/00 , H01F2027/2819 , H05K1/0204 , H05K1/0263 , H05K1/165 , H05K3/0061 , H05K2201/086 , H05K2201/10409 , H05K2201/10416
Abstract: A printed circuit board with integrated coil includes: a plurality of layers; and coil patterns which are formed of a conductor and which are provided in at least one outer surface layer and another layer of the plurality of layers. A heat-dissipation pattern formed of a conductor is provided on at least the one outer surface layer so as to correspond to the coil pattern provided in the another layer. The coil pattern provided in the one outer surface layer and the heat-dissipation pattern provided in the one outer surface layer are separated from each other. A thermal inter-layer connector formed of a conductor is provided to connect the coil pattern provided in the another layer and the heat-dissipation pattern provided in the one outer surface layer which correspond to each other.
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公开(公告)号：US20180096764A1
公开(公告)日：2018-04-05
申请号：US15283350
申请日：2016-10-01
Applicant: Intel Corporation
Inventor： Donald S. GARDNER , Gerhard SCHROM , Edward A. BURTON
IPC: H01F1/147 , H01F27/255 , H01F10/06 , H01F27/28 , H01F41/04 , H01F41/16 , H01F41/26 , H01F41/32 , H05K3/00 , H01L23/64 , H01L49/02 , H01L25/18
CPC classification number: H01F1/14733 , H01F10/06 , H01F17/0006 , H01F27/255 , H01F27/2804 , H01F27/365 , H01F41/041 , H01F41/046 , H01F41/16 , H01F41/18 , H01F41/26 , H01F41/32 , H01F2017/0066 , H01L23/552 , H01L23/645 , H01L25/18 , H01L28/10 , H05K1/165 , H05K3/0085 , H05K2201/086 , H05K2201/09236
Abstract: Embodiments are generally directed to hybrid magnetic material structures for electronic devices and circuits. An embodiment of an inductor includes a first layer of magnetic film material applied on a substrate, one or more conductors placed on the first layer of magnetic film material, and a second layer of magnetic particles, wherein the magnetic particles are suspended in an insulating medium.
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14.发明申请公开(公告)号：US20180072901A1
公开(公告)日：2018-03-15
申请号：US15804306
申请日：2017-11-06
Applicant: University of Massachusetts
Inventor： Mahdi Haghzadeh , Alkim Akyurtlu , Craig Armiento
IPC: C09D11/102 , C09D11/03 , C09D11/033 , H05K1/16 , H01P3/00
CPC classification number: C09D11/102 , C09D11/03 , C09D11/033 , H01P1/181 , H01P3/00 , H01Q21/065 , H05K1/16 , H05K1/162 , H05K2201/086
Abstract: A novel ferroelectric ink comprising multiphase Barium Strontium Titanate (BST) in a polymer composite is described. The ink can be employed using direct-ink writing techniques to print high dielectric constant, low loss, and electrostatically-tunable dielectrics on substrates. The substrates can be flexible such as plastics or rigid, such as substrates comprising semiconductor materials or ceramics and the like. The dielectric ink is made by suspending pre-sintered nano/submicron-sized particles of BST in a thermoplastic polymer with a solvent. After printing with the ink, a low temperature curing process is performed at temperatures below 200° C., a temperature too low to sinter BST. Fully printed devices, such as a varactor and a phase shifter using direct ink writing methodologies are described.
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公开(公告)号：US20170359897A1
公开(公告)日：2017-12-14
申请号：US15620866
申请日：2017-06-13
Applicant: Infineon Technologies Austria AG
Inventor： Frank Pueschner , Peter Stampka , Jens Pohl , Marcus Janke
CPC classification number: H05K1/181 , G06K19/07722 , G06K19/07733 , G06K19/07737 , G06K19/07739 , G06K19/07741 , G06K19/07747 , G06K19/07766 , G06K19/07773 , H01R12/714 , H05K1/0275 , H05K1/11 , H05K1/113 , H05K3/4007 , H05K3/4608 , H05K3/4694 , H05K2201/086 , H05K2201/09409 , H05K2201/09445 , H05K2201/09663 , H05K2201/10098 , H05K2201/10719
Abstract: In various embodiments, a chip card module is provided. The chip card module includes a chip card module contact array having six contact pads that are arranged in two rows having three contact pads each in accordance with ISO 7816, and three additional contact pads that are arranged between the two rows. Each additional contact pad is electrically conductively connected to a respective associated contact pad from a row from the two rows.
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Patent Agency Ranking
16.发明授权公开(公告)号：US09809720B2
公开(公告)日：2017-11-07
申请号：US15203706
申请日：2016-07-06
Applicant: University of Massachusetts
Inventor： Mahdi Haghzadeh , Alkim Akyurtlu , Craig Armiento
IPC: H05K1/00 , C09D11/102 , C09D11/03 , C09D11/033 , H01P3/00 , H05K1/16
CPC classification number: C09D11/102 , C09D11/03 , C09D11/033 , H01P1/181 , H01P3/00 , H01Q21/065 , H05K1/16 , H05K1/162 , H05K2201/086
Abstract: A novel ferroelectric ink comprising multiphase Barium Strontium Titanate (BST) in a polymer composite is described. The ink can be employed using direct-ink writing techniques to print high dielectric constant, low loss, and electrostatically-tunable dielectrics on substrates. The substrates can be flexible such as plastics or rigid, such as substrates comprising semiconductor materials or ceramics and the like. The dielectric ink is made by suspending pre-sintered nano/submicron-sized particles of BST in a thermoplastic polymer with a solvent. After printing with the ink, a low temperature curing process is performed at temperatures below 200° C., a temperature too low to sinter BST. Fully printed devices, such as a varactor and a phase shifter using direct ink writing methodologies are described.
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公开(公告)号：US20170294835A1
公开(公告)日：2017-10-12
申请号：US15536846
申请日：2014-12-18
Applicant: Telefonaktiebolaget LM Ericsson (publ)
Inventor： Mattias ANDERSSON , Martin ETSARE , Per FERM , Roger HOFFSTRÖM , Igor PEREZ-URIA
CPC classification number: H02M1/44 , H01F2017/065 , H02M1/12 , H02M1/126 , H02M2001/0064 , H03H7/427 , H03H2001/0035 , H05K1/141 , H05K1/18 , H05K9/00 , H05K2201/086 , H05K2201/09063
Abstract: The invention is directed towards a power source interface module for electronic circuits supplied by power from a power source as well as a power supply arrangement for electronic circuits comprising such a power source interface module. The module comprises a first circuit board carrying components, the first circuit board comprising a number of stacked circuit board layers as well as at least two openings, at least a part of a filter comprising at least one pair of magnetically coupled inductive coils, a core with two core legs, each core leg stretching through a corresponding opening in the circuit board, wherein each coil is wound around a corresponding core leg, the turns of the coils stretch through the circuit board layers, and each layer between an upper outer layer and a lower outer layer comprises at least a part of one turn.
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公开(公告)号：US09748652B2
公开(公告)日：2017-08-29
申请号：US14572991
申请日：2014-12-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui , Naoki Gouchi
IPC: H01P11/00 , H01Q13/00 , H01Q7/06 , H01Q1/24 , G06K19/077 , H05K1/16 , H05K3/44 , H05K3/46 , H05K1/02
CPC classification number: H01Q7/06 , G06K19/07722 , G06K19/07779 , G06K19/07794 , H01Q1/243 , H05K1/0239 , H05K1/165 , H05K3/44 , H05K3/4602 , H05K3/4617 , H05K2201/086 , H05K2201/10098 , H05K2203/0278 , H05K2203/063 , H05K2203/1131 , Y10T29/49016
Abstract: An antenna device includes a resin multilayer board in which a plurality of resin sheets are stacked, and a coil conductor provided in the resin multilayer board. A plurality of line portions of the coil conductor are provided on a lower surface of the resin sheet. When a magnetic material core is preliminarily pressure-bonded to the resin sheet, the magnetic material core is fractured along the line portions and cracks occur. Thus, the resin sheet with the magnetic material core in which the cracks have been formed is fully pressure-bonded together with the other resin sheets.
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公开(公告)号：US09730325B2
公开(公告)日：2017-08-08
申请号：US14155709
申请日：2014-01-15
Applicant: NAPRA CO., LTD.
Inventor： Shigenobu Sekine , Yurina Sekine , Kazutoshi Kamibayashi
CPC classification number: H05K1/165 , H01L2924/0002 , H05K1/0306 , H05K1/162 , H05K1/167 , H05K3/4061 , H05K2201/086 , H01L2924/00
Abstract: A substrate with built-in passive element includes passive elements and a substrate. The passive elements include at least one of a capacitor, an inductor, a resistor, a signal transmission element or an optical waveguide element. The capacitor, the inductor, the resistor, the signal transmission element or the optical waveguide element has a functional element filled in a groove-like or hole-like element forming region provided in the substrate along a thickness direction thereof. The functional element has a Si—O bond region obtained by reacting Si particles with an organic Si compound.
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公开(公告)号：US09699928B2
公开(公告)日：2017-07-04
申请号：US14370516
申请日：2013-01-04
Applicant: Access Business Group International LLC
Inventor： Joseph C. Van Den Brink , Sean T. Eurich , Neil W. Kuyvenhoven , Kaitlyn J. Turner , Benjamin C. Moes , Hai D. Nguyen
IPC: H05K1/00 , H05K7/02 , H05K1/02 , H05K1/09 , H05K1/11 , H05K1/16 , H05K13/00 , H01F27/28 , H05K3/36 , H01F38/14
CPC classification number: H05K7/02 , H01F27/2804 , H01F38/14 , H05K1/028 , H05K1/092 , H05K1/111 , H05K1/165 , H05K3/361 , H05K13/00 , H05K2201/032 , H05K2201/0329 , H05K2201/086 , H05K2201/1003 , H05K2201/10037 , H05K2201/1028 , H05K2201/10386 , H05K2201/10401 , Y10T29/49117
Abstract: An item of print media (30) including an inductive secondary (50) for providing power to a load (32). The inductive secondary is responsive to an electromagnetic flux to generate a time-varying current or voltage therein. The current or voltage induced in the inductive secondary directly or indirectly powers the load to thereby enhance the functionality and/or the appeal of the item of print media without significantly adding to its cost. The load can provide a visual and/or auditory output, and can include an electroluminescent display, an e-ink display, a piezo speaker coil, an electrostatic speaker, an OLED, an LED or an LCD display. Embodiments of the invention can be utilized in connection with a wide variety of print media, including for example books, booklets, pamphlets, labels, magazines, manuals, brochures, maps, charts, posters, journals, newspapers or loose leaf pages.
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