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    LIGHT BOARD
    11.
    发明申请
    LIGHT BOARD 审中-公开
    光板

    公开(公告)号：US20160298834A1

    公开(公告)日：2016-10-13

    申请号：US15097946

    申请日：2016-04-13

    Applicant: Hubbell Incorporated

    Inventor： Derek B. Baker ,  Cory A. Passerello ,  Thomas Clawson

    IPC: F21V23/06 ,  F21V23/00

    CPC classification number: F21V23/003 ,  F21S8/04 ,  F21V23/009 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/0286 ,  H05K2201/09063 ,  H05K2201/09127 ,  H05K2201/10106

    Abstract: A light board for a light fixture includes a first portion and a second portion. The first portion includes at least one light emitting element, and the second portion includes at least one light emitting element. A first state is defined by the second portion being coupled to the first portion and a second state is defined by the second portion being detached from the first portion. In the first state, the light emitting elements of the first portion and the second portion are configured to provide an evenly distributed light output along at least the combined length of the first portion and the second portion. In the second state, the at least one light emitting element of the first portion is configured to provide an evenly distributed light output along at least the length of the first portion.

    Abstract translation: 用于灯具的灯板包括第一部分和第二部分。 第一部分包括至少一个发光元件，第二部分包括至少一个发光元件。 第一状态由第二部分联接到第一部分限定，第二状态由第二部分与第一部分分离。 在第一状态下，第一部分和第二部分的发光元件构造成沿至少第一部分和第二部分的组合长度提供均匀分布的光输出。 在第二状态下，第一部分的至少一个发光元件构造成沿至少第一部分的长度提供均匀分布的光输出。

    Compact rigid-flexible printed circuit board and method for manufacturing same
    15.
    发明授权
    Compact rigid-flexible printed circuit board and method for manufacturing same 有权
    紧凑型柔性柔性印刷电路板及其制造方法

    公开(公告)号：US09210811B2

    公开(公告)日：2015-12-08

    申请号：US14095878

    申请日：2013-12-03

    Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

    Inventor： Biao Li

    IPC: H05K1/00 ,  H05K1/14 ,  H05K3/36 ,  H05K3/46

    CPC classification number: H05K1/14 ,  H05K3/361 ,  H05K3/4691 ,  H05K2201/0909 ,  H05K2201/09109 ,  H05K2201/09127 ,  Y10T29/302

    Abstract: A compact rigid-flexible board includes two flexible PCBs, two rigid substrates, a third trace layer and a fourth trace layer. The first flexible PCB includes a first depressing portion, a first exposed portion and a third depressing portion, and a separated second exposed portion. The second flexible PCB includes fourth and fifth depressing portions, and a second exposed portion. The first rigid substrate includes sixth, seventh, and eighth depressing portions. The second rigid substrate includes ninth and tenth depressing portions. The third trace layer, the sixth, first, fourth, and ninth depressing portions and the fourth trace layer are stacked in sequence. The third trace layer, the seven, second, fifth, and tenth depressing portions, and the fourth trace layer are stacked in sequence. The third trace layer and the eighth and third depressing portions are stacked in sequence.

    Abstract translation: 紧凑的刚性柔性板包括两个柔性PCB，两个刚性基板，第三轨迹层和第四轨迹层。 第一柔性PCB包括第一按压部分，第一暴露部分和第三按压部分，以及分离的第二暴露部分。 第二柔性PCB包括第四和第五按压部分和第二暴露部分。 第一刚性基板包括第六，第七和第八按压部分。 第二刚性基板包括第九和第十按压部。 第三迹线层，第六，第一，第四和第九按压部分和第四迹线层依次层叠。 第三迹线层，七，第二，第五和第十按压部分和第四迹线层依次层叠。 第三迹线层和第八和第三按压部分依次层叠。

    Semi-Finished Product for the Production of a Printed Circuit Board, Method for Producing a Printed Circuit Board and Printed Circuit Board
    16.
    发明申请
    Semi-Finished Product for the Production of a Printed Circuit Board, Method for Producing a Printed Circuit Board and Printed Circuit Board 有权
    制造印刷电路板的半成品，印刷电路板和印刷电路板的制造方法

    公开(公告)号：US20150342062A1

    公开(公告)日：2015-11-26

    申请号：US14652416

    申请日：2013-12-20

    Applicant: AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

    Inventor： Stefan Jäger ,  Markus Leitgeb ,  Thomas Judge

    IPC: H05K3/38 ,  H05K1/11 ,  H05K1/09 ,  H05K3/24 ,  H05K3/46 ,  H05K1/03 ,  H05K1/02

    CPC classification number: H05K3/387 ,  H05K1/0298 ,  H05K1/034 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/111 ,  H05K1/117 ,  H05K3/244 ,  H05K3/4611 ,  H05K3/4632 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/09127 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2203/0228 ,  H05K2203/068

    Abstract: A semi-finished product for the production of a printed circuit board having a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector is characterised by the hard gold-plated edge connector being arranged on an inner conductive layer of the semi-finished product and being fully covered by at least one group of an insulating layer and a conductive layer. The inventive Method for producing a printed circuit board having a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector, where an outer conductive layer is surface treated, is characterised by the steps of providing a hard gold-plated edge connector on a group of an insulating layer and a conductive layer, covering the conductive layer and the hard gold-plated edge connector with at least one group of an insulating layer and a conductive layer, surface-treating an outer conductive layer to form connector pads for wire bonding of electronic components, cutting the insulating layers and the conductive layers down to the conductive layer forming the hard gold-plated edge connector, removing the insulating layers and conductive layers from the hard gold-plated edge connector. The inventive printed circuit board comprised of a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector is characterised by the hard gold-plated edge connector being arranged on an inner conductive layer of the printed circuit board, and the inner conductive layer forming the hard gold-plated edge connector protruding from the plurality of insulating layers and conductive layers.

    Abstract translation: 用于制造具有多个交替布置的绝缘层和导电层的印刷电路板和至少一个硬镀金边缘连接器的半成品的特征在于，硬镀金边缘连接器布置在内部导电 并且被至少一组绝缘层和导电层完全覆盖。 本发明的用于制造具有多个交替布置的绝缘层和导电层的印刷电路板的方法和至少一个硬镀金边缘连接器，其中外部导电层被表面处理，其特征在于以下步骤：提供硬金 在一组绝缘层和导电层上的电镀边缘连接器，用至少一组绝缘层和导电层覆盖导电层和硬镀金边缘连接器，将外部导电层表面处理成 形成用于电子部件的引线接合的连接器焊盘，将绝缘层和导电层切割成形成硬镀金边缘连接器的导电层，从硬镀金边缘连接器去除绝缘层和导电层。 由多个交替布置的绝缘层和导电层以及至少一个硬镀金边缘连接器组成的本发明印刷电路板的特征在于，硬镀金边缘连接器布置在印刷电路板的内导电层上， 并且形成从多个绝缘层和导电层突出的硬金镀边缘连接器的内导电层。

    METHOD FOR MANUFACTURING RIGID-FLEXIBLE MULTILAYER WIRING BOARD AND COLLECTIVE BOARD
    17.
    发明申请
    METHOD FOR MANUFACTURING RIGID-FLEXIBLE MULTILAYER WIRING BOARD AND COLLECTIVE BOARD 有权
    刚性柔性多层接线板和集合板的制造方法

    公开(公告)号：US20150327374A1

    公开(公告)日：2015-11-12

    申请号：US14801929

    申请日：2015-07-17

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shunsuke CHISAKA

    IPC: H05K3/46

    CPC classification number: H05K3/4691 ,  H05K2201/0129 ,  H05K2201/09127 ,  H05K2203/0228 ,  Y10T29/49155 ,  Y10T156/1052

    Abstract: A method for manufacturing a rigid-flexible multilayer wiring board includes a step of forming a release layer such that the release layer covers a flexible portion forming region of a principal surface of a first thermoplastic resin sheet, a step of conducting surface modification on the principal surface of the first thermoplastic resin sheet while using the release layer as a mask, a step of laminating a second thermoplastic resin sheet such that the second thermoplastic resin sheet covers the release layer to form a laminate including the first and second thermoplastic resin sheets, a step of press-bonding the laminate, a step of forming a cut from at least either one of upper and lower surfaces of the laminate toward an outline of the release layer when seen in a plan view, and a step of removing a portion surrounded by the cut.

    Abstract translation: 制造刚性 - 柔性多层布线板的方法包括形成剥离层的步骤，使得剥离层覆盖第一热塑性树脂片的主表面的柔性部分形成区域，在主体上进行表面改性的步骤 使用剥离层作为掩模的第一热塑性树脂片的表面，层叠第二热塑性树脂片以使第二热塑性树脂片覆盖剥离层以形成包含第一和第二热塑性树脂片的层压体的步骤， 压接层压体的步骤，当从俯视图中观察时，从层叠体的上表面和下表面中的至少一个形成切割至剥离层的轮廓的步骤，以及除去由 那个切口。

    SEMICONDUCTOR DEVICE, SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    19.
    发明申请
    SEMICONDUCTOR DEVICE, SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    半导体器件，半导体器件及制造半导体器件的方法

    公开(公告)号：US20150282325A1

    公开(公告)日：2015-10-01

    申请号：US14672611

    申请日：2015-03-30

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Tomoharu Fujii

    IPC: H05K1/18 ,  H05K1/14 ,  H05K1/11

    CPC classification number: G01R31/2818 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/19105 ,  H05K1/0268 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09127 ,  H05K2201/0989 ,  H05K2201/09972 ,  H05K2203/175

    Abstract: A semiconductor device includes a board, an electronic component, an evaluation component, a wiring, and a groove portion. The board includes a product area, a non-product area, and a boundary area between the product area and the non-product area. The electronic component is mounted in the product area. The evaluation component is mounted in the non-product area. The wiring electrically connects the electronic component and the evaluation component. The groove portion is formed in the boundary area of the board so as to overlap at least a part of the wiring in a plan view. The non-product area is surrounded by the groove portion and at least a portion of sides of the board.

    Abstract translation: 半导体器件包括板，电子元件，评估元件，布线和槽部。 董事会包括产品区域，非产品区域和产品区域与非产品区域之间的边界区域。 电子部件安装在产品区域。 评估组件安装在非产品区域。 布线将电子部件和评估部件电连接。 凹槽部分形成在板的边界区域中，以在平面图中与布线的至少一部分重叠。 非产品区域被槽部分和板的至少一部分侧面包围。

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