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公开(公告)号：US09215802B2
公开(公告)日：2015-12-15
申请号：US14234604
申请日：2012-12-25
Applicant: NGK SPARK PLUG CO., LTD.
Inventor： Jyun Suzuki , Naoki Kito , Masami Hasegawa , Chizuo Nakashima
CPC classification number: H05K1/0306 , H05K1/183 , H05K3/0052 , H05K3/403 , H05K2201/0909 , H05K2201/09181 , H05K2201/0919 , H05K2201/09354
Abstract: A wiring substrate includes a substrate body formed of a plate-like ceramic, having a front surface, a back surface, and a height of 0.8 mm or less; a cavity opening at the front surface and having a rectangular shape as viewed in plane; and side walls having a thickness of 0.3 mm or less between a side surface of the cavity and a side surface of the substrate body. The wiring substrate further includes an electrically conductive layer having the form of a frame and formed on the front surface to surround an opening of the cavity; a ceramic surface having the form of a frame and located adjacently to the electrically conductive layer and along the outer periphery of the front surface; and a via conductor formed in the substrate body along the side surface of the cavity between a bottom surface of the cavity and the front surface.
Abstract translation: 布线基板包括由板状陶瓷形成的基板主体，具有前表面，背面和0.8mm以下的高度; 在前表面开口的空腔，在平面上具有矩形形状; 以及在空腔的侧表面和基板主体的侧表面之间具有0.3mm或更小的厚度的侧壁。 布线基板还包括具有框架形式并形成在前表面上以包围空腔的开口的导电层; 陶瓷表面，其具有框架的形式并且与导电层相邻并且沿着前表面的外周定位; 以及形成在所述基板主体中的所述通孔导体，其沿着所述空腔的底表面和所述前表面之间的所述空腔的侧表面。
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公开(公告)号：US09155205B2
公开(公告)日：2015-10-06
申请号：US14134096
申请日：2013-12-19
Applicant: National Taipei University of Technology
Inventor： Chien-Yi Huang , Pin-Jou Liao
CPC classification number: H05K3/225 , H05K1/142 , H05K2201/09127 , H05K2201/0919 , H05K2201/09618 , H05K2201/09827 , H05K2201/09836 , H05K2203/175 , H05K2203/176 , Y10T29/4913
Abstract: An electronic device is disclosed. The electronic device includes at least an electronic element; and a circuit board having a base with at least a block, wherein the at least a block is used as a replaceable carrying portion for carrying the electronic element, and the electronic element is electrically connected to the circuit board. As such, when a defect occurs to the replaceable carrying portion, the replaceable carrying portion as well as the defective electronic element can be removed and replaced with good ones.
Abstract translation: 公开了一种电子设备。 电子设备至少包括电子元件; 以及具有至少具有块的基座的电路板，其中所述至少一个块用作用于承载所述电子元件的可替换的承载部分，并且所述电子元件电连接到所述电路板。 因此，当可替换的携带部分发生缺陷时，可以移除可替换的携带部分以及有缺陷的电子元件，并且更换好的。
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公开(公告)号：US09089046B2
公开(公告)日：2015-07-21
申请号：US13747979
申请日：2013-01-23
Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD. , UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
Inventor： Jen-Chun Chen , Pai-Sheng Shih , Hsin-Chin Chang
IPC: H05K1/18 , H05K9/00 , H05K3/10 , H05K1/02 , H05K3/28 , H01L23/31 , H01L23/498 , H01L23/552 , H01L25/16 , H01L23/00
CPC classification number: H05K9/002 , H01L23/3121 , H01L23/49805 , H01L23/49811 , H01L23/552 , H01L23/562 , H01L25/16 , H01L2224/16 , H01L2224/16227 , H01L2224/48227 , H01L2924/1815 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K3/107 , H05K3/284 , H05K9/0037 , H05K2201/0715 , H05K2201/0919 , H05K2201/09509 , H05K2203/1316
Abstract: An electronic module includes a circuit board, a plurality of electronic components, a plurality of molding layers, at least one first conductive layer, at least one insulating filler, and one second conductive layer. The circuit board has a first plane and at least one grounding pad on the first plane. The electronic components are mounted on the first plane and electrically connected with the circuit board. The molding layers cover the electronic components and the first plane. The trench appears between two adjacent molding layers. The grounding pad is positioned at the bottom of the trench. The first conductive layer covers the sidewall of the trench and the grounding pad. The grounding pad electrically connected with the first conductive layer. The insulating filler is positioned in the trench. The second conductive layer covers the molding layers and the insulating filler, and electrically connects with the first conductive layer.
Abstract translation: 电子模块包括电路板，多个电子部件，多个成型层，至少一个第一导电层，至少一个绝缘填料和一个第二导电层。 电路板具有第一平面和在第一平面上的至少一个接地垫。 电子部件安装在第一平面上并与电路板电连接。 成型层覆盖电子部件和第一平面。 沟槽出现在两个相邻的成型层之间。 接地垫位于沟槽的底部。 第一导电层覆盖沟槽的侧壁和接地垫。 接地垫与第一导电层电连接。 绝缘填料位于沟槽中。 第二导电层覆盖模制层和绝缘填料，并与第一导电层电连接。
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公开(公告)号：US20150043189A1
公开(公告)日：2015-02-12
申请号：US14102212
申请日：2013-12-10
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Kenzo KITAZAKI , Masaya SHIMAMURA , Eiji MUGIYA , Takehiko KAI
CPC classification number: H05K9/0081 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/12042 , H01L2924/1461 , H01L2924/15159 , H01L2924/15192 , H01L2924/15313 , H01L2924/181 , H01L2924/19105 , H05K1/0216 , H05K3/244 , H05K3/284 , H05K2201/0341 , H05K2201/0919 , H05K2201/0979 , H05K2201/09845 , H05K2203/085 , H05K2203/107 , H05K2203/1316 , H05K2203/1361 , Y10T29/4913 , H01L2924/00 , H01L2924/00012 , H01L2224/83 , H01L2224/85
Abstract: A circuit module includes a wiring substrate having a mount surface and a conductor pattern, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, an outermost layer of the conductor pattern including Au or Ag; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer formed along the boundary, the insulating sealing layer having a trench with a depth such that at least a part of the outermost layer of the conductor pattern is exposed, the insulating sealing layer covering the electronic components; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being formed at the trench, the second shield portion being electrically connected to the conductor pattern.
Abstract translation: 电路模块包括具有安装表面和导体图案的布线基板，安装表面具有第一和第二区域，导体图案沿着安装表面上的第一和第二区域之间的边界形成，导体的最外层 包括Au或Ag; 安装在所述第一和第二区域上的多个电子部件; 绝缘密封层，其沿着边界形成绝缘密封层，所述绝缘密封层具有使所述导体图案的最外层的至少一部分露出的深度的沟槽，所述绝缘密封层覆盖所述电子部件; 以及具有第一和第二屏蔽部分的导电屏蔽，所述第一屏蔽部分覆盖所述密封层的外表面，所述第二屏蔽部分形成在所述沟槽处，所述第二屏蔽部分电连接到所述导体图案。
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公开(公告)号：US20150043172A1
公开(公告)日：2015-02-12
申请号：US14103601
申请日：2013-12-11
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Eiji MUGIYA , Kenzo KITAZAKI , Masaya SHIMAMURA , Tetsuo SAJI , Hiroshi NAKAMURA
CPC classification number: H05K1/0218 , H01L2224/16225 , H01L2924/16152 , H01L2924/16153 , H01L2924/181 , H01L2924/19105 , H05K1/0215 , H05K1/0216 , H05K3/284 , H05K3/303 , H05K9/0024 , H05K9/0045 , H05K2201/0723 , H05K2201/09036 , H05K2201/09145 , H05K2201/0919 , H05K2201/09972 , H05K2201/1056 , H05K2203/108 , Y10T29/4913 , H01L2924/00012
Abstract: There is provided a circuit module and a method of producing the same where interlayer wirings of a circuit substrate are prevented from damaging by laser irradiation, and a shield is assuredly electrically connected to the superficial conductor of the circuit substrate. The circuit substrate includes mount components, a sealing body, and a shield. The circuit substrate is a multi-layer substrate on which interlayer wirings are formed, and includes a mount surface on which a superficial conductor is disposed. The mount components are mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench including a first trench section reaching the superficial conductor and a second trench section not reaching the superficial conductor. The shield has an outer shield section and an inner shield section.
Abstract translation: 提供一种电路模块及其制造方法，可以防止电路基板的层间布线受到激光照射的损害，并且屏蔽层可靠地电连接到电路基板的表面导体。 电路基板包括安装部件，密封体和屏蔽件。 电路基板是形成有层间配线的多层基板，具有设置有表面导体的安装面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有包括到达表面导体的第一沟槽部分和没有到达表面导体的第二沟槽部分的沟槽。 屏蔽件具有外屏蔽部分和内屏蔽部分。
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Patent Agency Ranking
16.发明申请METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST TWO PRINTED CIRCUIT BOARD REGIONS, AND PRINTED CIRCUIT BOARD 有权生产印刷电路板的方法，包括至少两个印刷电路板区域和印刷电路板公开(公告)号：US20140376196A1
公开(公告)日：2014-12-25
申请号：US14368623
申请日：2012-12-28
Inventor： Volodymyr Karpovych , Johannes Stahr
CPC classification number: H05K3/4611 , H05K1/11 , H05K1/142 , H05K1/18 , H05K3/368 , H05K3/403 , H05K3/4694 , H05K2201/09045 , H05K2201/0919 , H05K2201/09572 , H05K2201/1059 , H05K2201/209 , Y10T29/49126
Abstract: The invention relates to a method for producing a printed circuit board consisting of at least two printed circuit board regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one conductive component, wherein printed circuit board regions to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a mechanical coupling. According to the invention, at least one sub-region or connection port of the conductive layer, and/or a conductive element of the component are electrically conductively coupled to each other at the lateral surface, whereby a simple and reliable lateral electrical coupling between printed circuit board regions to be connected to each other is rendered possible. The invention further relates to such a printed circuit board.
Abstract translation: 本发明涉及一种用于制造由至少两个印刷电路板区域组成的印刷电路板的方法，其中印刷电路板区域各自包括至少一个导电层和/或至少一个导电部件，其中印刷电路板区域 彼此连接，在每种情况下，至少一个彼此直接相邻的侧表面的区域通过机械联接相互连接。 根据本发明，导电层的至少一个子区域或连接端口和/或该部件的导电元件在侧面处彼此导电耦合，从而在印刷之间形成简单且可靠的横向电耦合 使彼此连接的电路板区域成为可能。 本发明还涉及这种印刷电路板。
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公开(公告)号：US08804363B2
公开(公告)日：2014-08-12
申请号：US13683997
申请日：2012-11-21
Applicant: Apple Inc.
Inventor： Jahan Minoo , Anthony P. N. Bidmead , Michael Nikkhoo
CPC classification number: H05K1/183 , H04R1/025 , H04R1/04 , H05K1/02 , H05K1/115 , H05K1/181 , H05K1/185 , H05K2201/0919 , H05K2201/10053 , H05K2201/10083 , H05K2201/10356 , H05K2201/10446
Abstract: Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mounted. Recesses may be provided with solder pads to which the wires may be soldered or attached with conductive adhesive. An integrated switch may be provided in an opening within a printed circuit board substrate. The integrated switch may have a dome switch member that is mounted within the opening. A cover member for the switch may be formed from a flexible layer that covers the dome switch member. Terminals for the integrated switch may be formed from conductive structures in an interior printed circuit board layer. Interconnects may be used to electrically connect embedded components such as switches, integrated circuits, solder pads for wires, and other devices.
Abstract translation: 印刷电路板配有嵌入式组件。 嵌入式部件可以安装在印刷电路板基板的表面中的凹部内。 印刷电路板基板可以具有可以安装电线的凹槽和埋入通道。 凹部可以设置有焊料，焊丝可以焊接或者用导电粘合剂附着。 集成开关可以设置在印刷电路板基板的开口内。 集成开关可以具有安装在开口内的圆顶开关构件。 用于开关的盖构件可以由覆盖圆顶开关构件的柔性层形成。 集成开关的端子可以由内部印刷电路板层中的导电结构形成。 互连可用于电连接嵌入式组件，例如开关，集成电路，电线焊盘和其他设备。
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公开(公告)号：US20140177177A1
公开(公告)日：2014-06-26
申请号：US14134096
申请日：2013-12-19
Applicant: National Taipei University of Technology
Inventor： Chien-Yi Huang , Pin-Jou Liao
CPC classification number: H05K3/225 , H05K1/142 , H05K2201/09127 , H05K2201/0919 , H05K2201/09618 , H05K2201/09827 , H05K2201/09836 , H05K2203/175 , H05K2203/176 , Y10T29/4913
Abstract: An electronic device is disclosed. The electronic device includes at least an electronic element; and a circuit board having a base with at least a block, wherein the at least a block is used as a replaceable carrying portion for carrying the electronic element, and the electronic element is electrically connected to the circuit board. As such, when a defect occurs to the replaceable carrying portion, the replaceable carrying portion as well as the defective electronic element can be removed and replaced with good ones.
Abstract translation: 公开了一种电子设备。 电子设备至少包括电子元件; 以及具有至少具有块的基座的电路板，其中所述至少一个块用作用于承载所述电子元件的可替换的承载部分，并且所述电子元件电连接到所述电路板。 因此，当可替换的携带部分发生缺陷时，可以移除可替换的携带部分以及有缺陷的电子元件，并且更换好的。
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公开(公告)号：US08339798B2
公开(公告)日：2012-12-25
申请号：US12832885
申请日：2010-07-08
Applicant: Jahan Minoo , Anthony P. N. Bidmead , Michael Nikkhoo
Inventor： Jahan Minoo , Anthony P. N. Bidmead , Michael Nikkhoo
CPC classification number: H05K1/183 , H04R1/025 , H04R1/04 , H05K1/02 , H05K1/115 , H05K1/181 , H05K1/185 , H05K2201/0919 , H05K2201/10053 , H05K2201/10083 , H05K2201/10356 , H05K2201/10446
Abstract: Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mounted. Recesses may be provided with solder pads to which the wires may be soldered or attached with conductive adhesive. An integrated switch may be provided in an opening within a printed circuit board substrate. The integrated switch may have a dome switch member that is mounted within the opening. A cover member for the switch may be formed from a flexible layer that covers the dome switch member. Terminals for the integrated switch may be formed from conductive structures in an interior printed circuit board layer. Interconnects may be used to electrically connect embedded components such as switches, integrated circuits, solder pads for wires, and other devices.
Abstract translation: 印刷电路板配有嵌入式组件。 嵌入式部件可以安装在印刷电路板基板的表面中的凹部内。 印刷电路板基板可以具有可以安装电线的凹槽和埋入通道。 凹部可以设置有焊料，焊丝可以焊接或者用导电粘合剂附着。 集成开关可以设置在印刷电路板基板的开口内。 集成开关可以具有安装在开口内的圆顶开关构件。 用于开关的盖构件可以由覆盖圆顶开关构件的柔性层形成。 集成开关的端子可以由内部印刷电路板层中的导电结构形成。 互连可用于电连接嵌入式组件，例如开关，集成电路，电线焊盘和其他设备。
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公开(公告)号：US08198017B2
公开(公告)日：2012-06-12
申请号：US12320258
申请日：2009-01-22
Applicant: Keiji Takemura
Inventor： Keiji Takemura
CPC classification number: H05K3/108 , H05K1/056 , H05K3/0082 , H05K3/28 , H05K3/44 , H05K2201/0919 , H05K2203/0156 , H05K2203/0597
Abstract: A producing method of a wired circuit board includes the steps of preparing a two-layer base material including a metal supporting layer and an insulating layer, covering an upper surface of the insulating layer and respective side end surfaces of the insulating layer and the metal supporting layer with a photoresist, placing a photomask so as to light-shield an end portion and a portion where a conductive layer is to be formed of the upper surface, exposing to light the photoresist covering the upper surface from above the photoresist via the photomask, exposing to light the photoresist covering the respective side end surfaces from below the photoresist, forming an exposed portion of the photoresist into a pattern by removing an unexposed portion thereof to form a plating resist, and forming an end-portion conductive layer and the conductive layer.
Abstract translation: 布线电路板的制造方法包括以下步骤：制备包括金属支撑层和绝缘层的两层基材，覆盖绝缘层的上表面和绝缘层的各个侧端面以及金属支撑 层叠光致抗蚀剂，放置光掩模以遮蔽端部和由上表面形成导电层的部分，通过光掩模将光致抗蚀剂上方的光致抗蚀剂曝光， 将光致抗蚀剂下面的光致抗蚀剂下面的光致抗蚀剂从光致抗蚀剂的下方露出，从而将光致抗蚀剂的曝光部分除去未曝光的部分形成电镀抗蚀剂，形成端部导电层， 。
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