公开(公告)号：US20170241039A1

公开(公告)日：2017-08-24

申请号：US15438931

申请日：2017-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kenji TAKAI

IPC: C25D15/00 ,  C25D5/02 ,  H05K1/03 ,  C25D1/00 ,  H05K1/02 ,  H05K1/09 ,  C25D3/46 ,  C25D5/48

CPC classification number: C25D15/00 ,  C25D1/00 ,  C25D3/46 ,  C25D5/022 ,  C25D5/48 ,  C25D7/0614 ,  H05K1/028 ,  H05K1/0353 ,  H05K1/09 ,  H05K3/025 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/09681

Abstract: A flexible electrically conductive structure includes: a first polymer layer; and an electrically conductive layer disposed on a surface of the first polymer layer, wherein the electrically conductive layer includes an electrically conductive metal and a nanocarbon material, and wherein the flexible wiring board is to be used with a bending portion provided at least one position of the electrically conductive layer.

公开(公告)号：US09736928B2

公开(公告)日：2017-08-15

申请号：US13979710

申请日：2012-02-01

Applicant: Matthew H. Frey ,  Ta-Hua Yu ,  Kari A. McGee ,  Hui Luo ,  William B. Kolb ,  Brant U. Kolb ,  Moses M. David ,  Lijun Zu ,  Stephen P. Maki

Inventor： Matthew H. Frey ,  Ta-Hua Yu ,  Kari A. McGee ,  Hui Luo ,  William B. Kolb ,  Brant U. Kolb ,  Moses M. David ,  Lijun Zu ,  Stephen P. Maki

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/46 ,  H05K3/06 ,  H05K9/00 ,  G06F3/041 ,  B82Y99/00

CPC classification number: H05K1/0274 ,  B82Y20/00 ,  B82Y30/00 ,  B82Y99/00 ,  G02B1/116 ,  G02B27/142 ,  G06F3/041 ,  H03K17/962 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/061 ,  H05K3/4644 ,  H05K9/0086 ,  H05K9/0096 ,  H05K2201/0108 ,  H05K2201/09681 ,  Y10S977/755

Abstract: The present disclosure provides an article having (a) a substrate having a first nanostructured surface that is antireflective when exposed to air and an opposing second surface; and (b) a conductor micropattern disposed on the first surface of the substrate, the conductor micropattern formed by a plurality of traces defining a plurality of open area cells. The micropattern has an open area fraction greater than 80% and a uniform distribution of trace orientation. The traces of the conductor micropattern have a specular reflectance in a direction orthogonal to and toward the first surface of the substrate of less than 50%. Each of the traces has a width from 0.5 to 10 micrometer. The articles are useful in devices such as displays, in particular, touch screen displays useful for mobile hand held devices, tablets and computers. They also find use in antennas and for EMI shields.

公开(公告)号：US09650716B2

公开(公告)日：2017-05-16

申请号：US14602500

申请日：2015-01-22

Applicant: Eastman Kodak Company

Inventor： Marcus Stephen Bermel ,  Lisa Baxter Todd ,  Linda Mae Franklin ,  Thomas Henry Mourey ,  Christine Joanne Landry-Coltrain

IPC: G03C1/09 ,  C23C18/16 ,  G03F7/20 ,  C23C18/40 ,  B32B15/00 ,  C09D11/101 ,  C23C18/20 ,  C23C18/44 ,  C09D11/03 ,  C09D11/037 ,  C23C18/30 ,  H05K3/18

CPC classification number: C23C18/1608 ,  B32B15/00 ,  C09D11/03 ,  C09D11/037 ,  C09D11/101 ,  C23C18/204 ,  C23C18/206 ,  C23C18/30 ,  C23C18/405 ,  C23C18/44 ,  G03F7/20 ,  H05K3/185 ,  H05K2201/09681

Abstract: A method is used to provide an electrically conductive article. The method includes: (i) providing a continuous polymeric web of a transparent polymeric substrate; (ii) forming a first photocurable pattern on at least a first portion on a first supporting side of the continuous polymeric web using a photocurable composition comprising metal particles; (iii) exposing the photocurable pattern to form a photocured pattern on the first portion of the first supporting side; (iv) electrolessly plating the photocured pattern with an electrically-conductive metal to form an electrically-conductive metal pattern; and (v) forming a dry outermost polymeric coating over at least part but not all of the electrically-conductive pattern, the dry polymeric coating having a dry thickness of less than 5 μm, an integrated transmittance of at least 80%, and comprising a non-crosslinked thermoplastic polymer having a glass transition temperature (Tg) that is equal to or greater than 65° C.

公开(公告)号：US09565777B1

公开(公告)日：2017-02-07

申请号：US14970165

申请日：2015-12-15

Applicant: International Business Machines Corporation

Inventor： Charles L. Arvin ,  Brian M. Erwin

IPC: H05K3/46 ,  H05K1/09 ,  H05K1/11 ,  H05K3/06 ,  C25D11/04 ,  C25D11/16 ,  H05K1/00 ,  H05K1/16 ,  H05K1/03

CPC classification number: H05K1/0275 ,  B05D3/102 ,  B41N1/083 ,  C23C22/66 ,  C23C22/76 ,  C23C22/78 ,  C25D11/04 ,  C25D11/045 ,  C25D11/16 ,  H01L23/57 ,  H05K1/00 ,  H05K1/0306 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/115 ,  H05K1/16 ,  H05K3/06 ,  H05K3/28 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/07 ,  H05K2201/09681 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/033 ,  H05K2203/0369 ,  H05K2203/0392 ,  H05K2203/0733 ,  H05K2203/1142

Abstract: A method of making a security mesh comprises forming on a conductive substrate an alumina film having through-holes in which metal, e.g., copper, through-wires are formed. First surface wires are formed on one surface of the alumina film and second surface wires are formed on the second, opposite surface of the alumina film in order to connect selected through-wires into a continuous undulating electrical circuit embedded within the alumina film. The security mesh product comprises an alumina film having a continuous undulating electrical circuit comprising copper or other conductive metal extending therethrough. A stacked security mesh comprises two or more of the mesh products being stacked one above the other.

Abstract translation: 制造安全网的方法包括在导电基板上形成具有通孔的氧化铝膜，其中形成有例如铜的通孔。 第一表面线形成在氧化铝膜的一个表面上，并且第二表面线形成在氧化铝膜的第二相对表面上，以便将所选择的通孔连接到嵌入在氧化铝膜内的连续起伏的电路中。 安全网产品包括氧化铝膜，其具有包括铜或延伸穿过其中的其它导电金属的连续波形电路。 堆叠的安全网格包括两个或多个网格产品，一个彼此堆叠。

公开(公告)号：US09549460B2

公开(公告)日：2017-01-17

申请号：US14717456

申请日：2015-05-20

Applicant: FUJIKURA LTD

Inventor： Hirohito Watanabe ,  Taiji Ogawa

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H01P3/08

CPC classification number: H05K1/0216 ,  H01P3/085 ,  H05K1/0225 ,  H05K1/0237 ,  H05K1/025 ,  H05K1/0393 ,  H05K2201/0715 ,  H05K2201/09027 ,  H05K2201/09681 ,  H05K2201/09727

Abstract: To suppress occurrence of a difference in transmission time due to a difference in length between signal lines, there is provided a printed wiring board having: an insulating substrate (10); a first signal line (L31A) that constitutes differential signal lines formed on the insulating substrate (10) and includes a curved portion; a second signal line (L31B) provided along the first signal line (L31A) and side by side inside the curved portion; and a ground layer (30) formed for the first signal line (L31A) and the second signal line (L31B) via an insulating material (10). The ground layer (30) includes a first ground layer (G31A) corresponding to a first region (D1) and a second ground layer (G31B) corresponding to a second region (D2). The first region (D1) is defined based on the first signal line (L31A) and has a first predetermined width (W31A). The second region (D2) is defined based on the second signal line (L31B) and has a second predetermined width (W31B). The first ground layer (G31A) has a remaining ratio lower than a remaining ratio of the second ground layer (G31B).

Abstract translation: 为了抑制由于信号线之间的长度差导致的传输时间差的发生，提供了一种印刷线路板，其具有：绝缘基板（10）; 第一信号线（L31A），其构成形成在绝缘基板（10）上并包括弯曲部分的差分信号线; 沿着第一信号线（L31A）设置并并列在弯曲部分内的第二信号线（L31B）; 以及经由绝缘材料（10）为第一信号线（L31A）和第二信号线（L31B）形成的接地层（30）。 接地层（30）包括对应于第一区域（D1）的第一接地层（G31A）和对应于第二区域（D2）的第二接地层（G31B）。 第一区域（D1）基于第一信号线（L31A）定义并具有第一预定宽度（W31A）。 第二区域（D2）基于第二信号线（L31B）被定义并且具有第二预定宽度（W31B）。 第一接地层（G31A）的剩余比率比第二接地层（G31B）的剩余率低。

公开(公告)号：US09532491B2

公开(公告)日：2016-12-27

申请号：US14102228

申请日：2013-12-10

Applicant: MITSUBISHI ELECTRIC CORPORATION

Inventor： Ryuichi Hashido

IPC: H05K9/00 ,  G02F1/133 ,  H05K1/02 ,  G02F1/1345 ,  H05K3/36 ,  G02F1/1333

CPC classification number: H05K9/0054 ,  G02F1/13306 ,  G02F1/13452 ,  G02F2001/133334 ,  H05K1/0224 ,  H05K1/0259 ,  H05K1/028 ,  H05K3/361 ,  H05K2201/0715 ,  H05K2201/09681

Abstract: A shield layer is selectively formed on a front surface of a base film having an insulating property to form a wiring layer on a rear surface of the base film, and a connector connection terminal and a mounting terminal are selectively provided on the wiring layer. A liquid crystal display device is configured so as to be housed in a set housing, in a state that a TFT array substrate and a control board are connected to each other via an FPC having the structure as described above. In this case, the shield layer is provided in such a manner of opposing to an inner surface of the housing, the shield layer maintains an insulating relationship with the drive circuit, and is electrically connected to a portion of the housing via the first ground wiring portion.

Abstract translation: 在具有绝缘性的基膜的前表面上选择性地形成屏蔽层，以在基膜的后表面上形成布线层，并且在布线层上选择性地设置连接器连接端子和安装端子。 在TFT阵列基板和控制基板经由具有上述结构的FPC彼此连接的状态下，液晶显示装置被配置为容纳在设置的壳体中。 在这种情况下，屏蔽层以与壳体的内表面相对的方式设置，屏蔽层与驱动电路保持绝缘关系，并通过第一接地线与外壳的一部分电连接 一部分。

公开(公告)号：US09529460B2

公开(公告)日：2016-12-27

申请号：US14340564

申请日：2014-07-25

Applicant: WINTEK CORPORATION

Inventor： Chun-Ming Huang ,  Yi-Chun Lin ,  Yi-Chen Tsai ,  Ming-Kung Wu

IPC: H05K1/09 ,  G06F3/041 ,  B32B23/02 ,  H05K1/02 ,  H05K3/12

CPC classification number: G06F3/041 ,  G06F2203/04103 ,  H05K1/0296 ,  H05K3/12 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/09681 ,  H05K2201/09727

Abstract: A panel structure includes a substrate, a decoration layer and a conductive component. The decoration layer is located in a first region and the rest region is a second region. The decoration layer includes a middle portion and a first edge protruding portion located between the middle portion and the second region and thinner than the middle portion. Each the conductive component extends in a first direction towards the first region from the second region and crosses the first edge protruding portion followed by extending in a second direction on the middle portion of the decoration layer, the first direction intersects the second direction, each the conductive component on the first edge protruding portion has a first width, each the conductive component on the middle portion extends in the second direction and has a second width less than the first width.

Abstract translation: 面板结构包括基板，装饰层和导电部件。 装饰层位于第一区域中，其余区域是第二区域。 装饰层包括位于中间部分和第二区域之间的中间部分和第一边缘突出部分，并且比中间部分薄。 每个导电部件沿着第一方向从第二区域朝向第一区域延伸，并且穿过第一边缘突出部分，然后在装饰层的中间部分上沿第二方向延伸，第一方向与第二方向相交， 第一边缘突出部分上的导电部件具有第一宽度，中间部分上的导电部件在第二方向上延伸，并且具有小于第一宽度的第二宽度。

公开(公告)号：US09490312B2

公开(公告)日：2016-11-08

申请号：US14579511

申请日：2014-12-22

Applicant: LG Display Co., Ltd.

Inventor： JungJoo Lee ,  Janghoon Song

IPC: H01L27/32 ,  H01L51/00

CPC classification number: H01L27/3276 ,  H01L51/0097 ,  H01L2251/5338 ,  H05K1/028 ,  H05K2201/09681 ,  H05K2201/10128 ,  Y02E10/549 ,  Y02P70/521

Abstract: There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an assembled flexible display.

Abstract translation: 提供了一种柔性显示器，其具有多个创新，其被配置为允许部分或部分的弯曲以减少表观边界尺寸和/或利用组装的柔性显示器的侧表面。

公开(公告)号：US09437533B2

公开(公告)日：2016-09-06

申请号：US14511676

申请日：2014-10-10

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Hayato Masubuchi ,  Naoki Kimura ,  Manabu Matsumoto ,  Toyota Morimoto

IPC: G11C5/02 ,  H01L23/498 ,  H01L27/115 ,  H01L23/31 ,  H05K1/02 ,  H05K3/30

CPC classification number: H01L25/18 ,  G11C5/02 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5286 ,  H01L23/552 ,  H01L23/562 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/115 ,  H01L2924/0002 ,  H05K1/0225 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/09136 ,  H05K2201/09681 ,  H05K2201/10159 ,  Y02P70/613 ,  H01L2924/00

Abstract: According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

Abstract translation: 根据一个实施例，半导体存储器系统包括衬底，多个元件和粘合剂部分。 基板具有其中形成布线图案并且在平面图中具有大致矩形形状的多层结构。 元件沿着衬底的表面层侧的长边方向设置和布置。 粘合剂部分填充在元件之间的间隙中，并且在元件和基板之间的间隙中填充元件的表面。

公开(公告)号：US20160245491A1

公开(公告)日：2016-08-25

申请号：US14695149

申请日：2015-04-24

Applicant: Kumho Electric, Inc.

Inventor： Byung Hyun KIM

IPC: F21V23/00 ,  F21V23/02

CPC classification number: H05K1/0274 ,  F21Y2115/10 ,  H05K1/189 ,  H05K2201/0108 ,  H05K2201/09681 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: Disclosed is a transparent light emitting apparatus including a first transparent substrate, a wiring sheet including a base layer disposed on the first transparent substrate and a plurality of wiring electrodes formed on the base layer, and a plurality of light emitting diode (LED) packages electrically connected to the wiring electrodes.

Abstract translation: 公开了一种透明发光装置，包括第一透明基板，布线板，其包括设置在第一透明基板上的基底层和形成在基底层上的多个布线电极，以及多个发光二极管（LED）封装 连接到布线电极。