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    Sloped vias in a substrate, spring-like contacts, and methods of making
    13.
    发明授权
    Sloped vias in a substrate, spring-like contacts, and methods of making 有权
    衬底中的斜槽，类似弹簧的触点，以及制作方法

    公开(公告)号：US07390740B2

    公开(公告)日：2008-06-24

    申请号：US10933847

    申请日：2004-09-02

    Applicant: James M. Wark ,  Syed S. Ahmad

    Inventor： James M. Wark ,  Syed S. Ahmad

    IPC: H01L21/44 ,  H01L21/60

    CPC classification number: H01L23/5226 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/49827 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/0029 ,  H05K3/0041 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09836 ,  H01L2924/00

    Abstract: Methods for forming vias are disclosed. The methods include providing a substrate having a first surface and an opposing, second surface. The vias are formed within the substrate to have a longitudinal axis sloped at an angle with respect to a reference line extending perpendicular to the first surface and the second surface of the substrate. The vias may be formed from the first surface to the opposing second surface, or the via may be formed as a first blind opening from the first surface, then a second opening may be formed from the second surface to be aligned with the first opening. Vias may be formed completely through a first substrate and a second substrate, and the substrates may be bonded together. Semiconductor devices including the vias of the present invention are also disclosed. A method of forming spring-like contacts is also disclosed.

    Abstract translation: 公开了形成通孔的方法。 所述方法包括提供具有第一表面和相对的第二表面的基底。 通孔形成在衬底内，以具有相对于垂直于衬底的第一表面和第二表面延伸的参考线成一定角度倾斜的纵向轴线。 通孔可以由第一表面形成到相对的第二表面，或者通孔可以从第一表面形成为第一盲孔，然后可以从第二表面形成第二开口以与第一开口对准。 可以通过第一基板和第二基板完全形成通孔，并且基板可以结合在一起。 还公开了包括本发明的通孔的半导体器件。 还公开了一种形成弹簧状触点的方法。

    Thermal conductive electronics substrate and assembly
    14.
    发明申请
    Thermal conductive electronics substrate and assembly 失效
    导热电子基板和组件

    公开(公告)号：US20070120250A1

    公开(公告)日：2007-05-31

    申请号：US11287834

    申请日：2005-11-28

    Applicant: M. Fairchild ,  Aleksandra Djordjevic ,  Javier Ruiz

    Inventor： M. Fairchild ,  Aleksandra Djordjevic ,  Javier Ruiz

    IPC: H01L23/34

    CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L24/33 ,  H01L2224/32225 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H05K3/0061 ,  H05K2201/09836 ,  H01L2924/00

    Abstract: An electronics assembly is provided including a circuit board substrate having a top surface and a bottom surface and a plurality of thermal conductive vias extending from the top surface to the bottom surface. At least one electronics package is mounted to the top surface of the substrate. A heat sink device is in thermal communication with the bottom surface of the substrate. Thermal conductive vias are in thermal communication to pass thermal energy from the at least one electronics package to the heat sink. At least some of the thermal conductive vias are formed extending from the top surface to the bottom surface of the substrate at an angle.

    Abstract translation: 提供一种电子组件，其包括具有顶表面和底表面的电路板基底和从顶表面延伸到底表面的多个导热通孔。 至少一个电子封装被安装到基板的顶表面。 散热器件与衬底的底表面热连通。 导热通孔热传导通过热能从至少一个电子封装到散热器。 至少一些导热通孔形成为以一定角度从基板的顶表面延伸到底表面。

    Slanted vias for electrical circuits on circuit boards and other substrates
    16.
    发明授权
    Slanted vias for electrical circuits on circuit boards and other substrates 失效
    电路板和其他基板上的电路的倾斜通孔

    公开(公告)号：US07083425B2

    公开(公告)日：2006-08-01

    申请号：US10927760

    申请日：2004-08-27

    Applicant: Chin Hui Chong ,  Choon Kuan Lee

    Inventor： Chin Hui Chong ,  Choon Kuan Lee

    IPC: H01R12/00 ,  H05K1/00

    CPC classification number: H01R12/526 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09836 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/4922

    Abstract: Circuit boards, microelectronic devices, and other apparatuses having slanted vias are disclosed herein. In one embodiment, an apparatus for interconnecting electronic components includes a dielectric portion having a first surface and a second surface. A first terminal is disposed on the first surface of the dielectric portion for connection to a first electronic component. A second terminal is disposed on the second surface of the dielectric portion for connection to a second electronic component. The apparatus further includes a passage extending through the dielectric portion along a longitudinal axis oriented at an oblique angle relative to the first surface. The passage is at least partially filled with conductive material electrically connecting the first terminal to the second terminal.

    Abstract translation: 本文公开了具有倾斜通孔的电路板，微电子器件和其它设备。 在一个实施例中，用于互连电子部件的装置包括具有第一表面和第二表面的电介质部分。 第一端子设置在电介质部分的第一表面上，用于连接到第一电子部件。 第二端子设置在电介质部分的第二表面上，用于连接到第二电子部件。 该装置还包括沿着相对于第一表面以倾斜角定向的纵向轴线延伸通过电介质部分的通道。 该通道至少部分地填充有将第一端子与第二端子电连接的导电材料。

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