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公开(公告)号：US09832889B2
公开(公告)日：2017-11-28
申请号：US14623769
申请日：2015-02-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui
CPC classification number: H05K3/4697 , B32B3/263 , B32B2457/08 , H01L2224/16225 , H01L2924/19105 , H05K1/0271 , H05K1/115 , H05K1/181 , H05K1/182 , H05K1/186 , H05K3/4617 , H05K3/4632 , H05K2201/0141 , H05K2201/091 , H05K2201/09781 , H05K2201/09909 , Y10T29/49126 , Y10T428/24612
Abstract: A circuit board includes a main portion and at least one uneven portion. The main portion is obtained by stacking a plurality of base sheets made of a flexible material in a predetermined direction and subjecting the stacked base sheets to compression bonding. The at least one uneven portion is provided on one of the base sheets. The uneven portion includes a concave portion and a convex portion extending in a direction perpendicular or substantially perpendicular to the predetermined direction. The concave portion is sunken in the predetermined direction. The convex portion protrudes in an opposite direction to the predetermined direction.
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公开(公告)号：US09693457B2
公开(公告)日：2017-06-27
申请号：US14106220
申请日：2013-12-13
Applicant: International Business Machines Corporation
Inventor： Brian Samuel Beaman
CPC classification number: H05K1/117 , H01R12/721 , H05K3/403 , H05K2201/09145 , H05K2201/09909 , H05K2201/10863 , Y10T29/49124 , Y10T29/49155 , Y10T29/49156
Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.
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公开(公告)号：US20170181263A1
公开(公告)日：2017-06-22
申请号：US14974594
申请日：2015-12-18
Applicant: INTEL CORPORATION
Inventor： Emad Al-Momani , Srikanth Mothukuri
CPC classification number: H05K1/0203 , G06F1/20 , H01L23/4006 , H05K1/181 , H05K3/301 , H05K7/2039 , H05K7/2049 , H05K2201/066 , H05K2201/09909 , H05K2201/10325 , H05K2201/2018
Abstract: The present disclosure provides systems and methods for a package securing system including a top plate, an alignment frame, a gasket, and a back plate. The top plate comprises a thermal conductive member to transfer heat from a central processing unit (CPU) and secure the CPU to a ball grid array (BGA) socket and a printed circuit board (PCB). The alignment frame is configured to align a connection between the BGA socket and the PCB. The gasket is to seal the CPU, the BGA socket, and the alignment frame between the PCB and the top plate. The back plate is configured to couple with the top plate through the PCB.
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14.发明申请公开(公告)号：US20170175972A1
公开(公告)日：2017-06-22
申请号：US15451787
申请日：2017-03-07
Applicant: SHARP KABUSHIKI KAISHA
Inventor： Toshio HATA , Makoto AGATANI , Toyonori UEMURA , Shinya ISHIZAKI , Hitoshi MATSUSHITA
IPC: F21V3/02 , H05B33/08 , F21K9/64 , F21V29/77 , F21K9/237 , F21K9/68 , F21K9/235 , F21K9/232 , H05B37/02
CPC classification number: F21V3/02 , F21K9/232 , F21K9/235 , F21K9/237 , F21K9/60 , F21K9/64 , F21K9/68 , F21V3/00 , F21V23/001 , F21V29/77 , F21Y2101/00 , F21Y2115/10 , H01L25/0753 , H01L33/508 , H01L2224/48137 , H01L2924/3025 , H05B33/0845 , H05B33/0857 , H05B37/0272 , H05K1/0274 , H05K1/11 , H05K3/28 , H05K2201/09909 , H05K2201/10106 , H05K2203/049 , H01L2924/00
Abstract: The light-emitting device includes a substrate and a plurality of light-emitting sections. A first light-emitting section is made up of LED chips and a first fluorescent-substance-containing resin layer, and a second light-emitting section is made up of LED chips and a second fluorescent-substance-containing resin layer. The first fluorescent-substance-containing resin layer and the second fluorescent-substance-containing resin layer are provided in a plurality of locations such that the fluorescent-substance-containing resin layers for the different light-emitting sections are adjacently arranged.
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15.发明申请公开(公告)号：US20170047485A1
公开(公告)日：2017-02-16
申请号：US15231806
申请日：2016-08-09
Applicant: OSRAM GmbH
Inventor： Alessandro Scordino , Davide Grosso
CPC classification number: H01L33/486 , H01L33/62 , H01L33/644 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H05K1/111 , H05K1/189 , H05K3/3431 , H05K2201/09381 , H05K2201/09663 , H05K2201/09909 , H05K2201/10106 , H05K2203/048 , Y02P70/611 , Y02P70/613
Abstract: A substrate for mounting electrically-powered light radiation sources, e.g. LED sources, includes a base layer of electrically-insulating material, such as PET, and a contact layer of electrically conductive material, e.g. copper. The contact layer includes a mounting area for a light radiation source having opposed anode and cathode terminals, including two portions with a gap therebetween. Therefore, the light radiation source may be mounted bridge-like across gap, with anode and cathode terminals soldered to respective soldering surfaces provided in the one and the other of said two portions of the mounting area. The latter portions include respective solder flow blocking formations including fork-shaped apertures in contact layer leaving base layer uncovered. The fork-shaped apertures have a web portion and prongs extending from web portion towards said soldering surfaces.
Abstract translation: 用于安装电动光辐射源的基板，例如 LED源包括诸如PET的电绝缘材料的基层，以及导电材料的接触层，例如， 铜。 接触层包括用于具有相对的阳极和阴极端子的光辐射源的安装区域，包括两个在其间具有间隙的部分。 因此，光辐射源可以跨越间隙安装为桥状，阳极和阴极端子焊接到设置在安装区域的所述两个部分中的一个和另一个中的相应焊接表面。 后面的部分包括相应的焊料流动阻塞结构，其包括接触层中的叉形孔，使基层未被覆盖。 叉形孔具有腹板部分和从腹板部分朝向所述焊接表面延伸的尖头。
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Patent Agency Ranking
公开(公告)号：US09332641B2
公开(公告)日：2016-05-03
申请号：US14024021
申请日：2013-09-11
Applicant: Samsung Display Co., Ltd.
Inventor： Jin-Suk Lee
CPC classification number: H05K1/117 , H01R12/52 , H05K1/0248 , H05K1/118 , H05K3/323 , H05K3/361 , H05K2201/09709 , H05K2201/09909
Abstract: A connection structure of a circuit board is disclosed. In one aspect, the connection structure includes a first circuit board, a second circuit board and an adhesive member. A first connection pad and a second connection pad are disposed on the first circuit board. The second circuit board has a first surface facing the first circuit board. A plurality of third connection pads and fourth connection pads are disposed on the first surface of the second circuit board in a staggered pattern. The adhesive member is disposed between the first and second circuit boards. At least one of the third and fourth connection pads is electrically connected to a wire which is disposed on a second surface of the second circuit board opposite to the first surface of the second circuit board.
Abstract translation: 公开了一种电路板的连接结构。 一方面，连接结构包括第一电路板，第二电路板和粘合构件。 第一连接焊盘和第二连接焊盘设置在第一电路板上。 第二电路板具有面向第一电路板的第一表面。 多个第三连接焊盘和第四连接焊盘以交错图案设置在第二电路板的第一表面上。 粘合部件设置在第一和第二电路板之间。 第三和第四连接焊盘中的至少一个电连接到布置在与第二电路板的第一表面相对的第二电路板的第二表面上的导线。
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公开(公告)号：US09329434B2
公开(公告)日：2016-05-03
申请号：US13649302
申请日：2012-10-11
Applicant: Funai Electric Co., Ltd.
Inventor： Akira Yokawa , Yuki Kita , Akihiro Fujikawa , Yasuyuki Fukumoto , Yasuhiro Mori , Yuto Suzuki , Hirofumi Horiuchi , Hirohiko Tsuji , Takahito Yamanaka , Hideo Yonezawa
IPC: G02F1/1335 , H05K7/20 , G06F1/20 , H05K1/02 , F21V8/00 , G02F1/1333
CPC classification number: G02B6/0088 , G02B6/0068 , G02B6/0073 , G02B6/0085 , G02F1/133615 , G02F2001/133314 , G02F2001/133317 , G02F2001/133328 , G02F2001/133628 , G06F1/20 , H05K1/0209 , H05K7/20963 , H05K2201/0162 , H05K2201/09909
Abstract: This display includes a light source portion, a first heat radiation member for radiating heat generated by the light source portion, a rear housing covering the first heat radiation member in a state in contact with the first heat radiation member, and a cover member covering a rear surface of the rear housing so that the rear surface of the rear housing is partially exposed outward. The first heat radiation member is arranged on a region corresponding to a region of the rear housing exposed outward from the cover member as viewed from the side of the rear surface.
Abstract translation: 该显示器包括光源部分，用于辐射由光源部分产生的热量的第一散热构件，以与第一散热构件接触的状态覆盖第一散热构件的后壳体，以及覆盖 后壳体的后表面使得后壳体的后表面部分地向外露出。 第一散热构件布置在从后表面侧观察到的从盖构件向外露出的区域对应的区域上。
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18.发明授权公开(公告)号：US09264014B2
公开(公告)日：2016-02-16
申请号：US14058349
申请日：2013-10-21
Applicant: Ambit Microsystems (Zhongshan) LTD.
Inventor： Xiao-Ya Guo
CPC classification number: H03H7/463 , H01L2224/16225 , H01L2224/97 , H05K3/284 , H05K2201/09909 , H05K2203/1316 , Y10T29/4913
Abstract: A package structure includes a printed circuit board (PCB), a duplexer, a first dam, a second dam and a cover. The duplexer includes a transmission filter and a reception filter and is electrically connected with the PCB. The first dam is located on a surface of the PCB, and in cooperation with the PCB forms a first receptacle receiving the transmission filter. The second dam is located on the surface of the PCB, and in cooperation with the PCB forms a second receptacle receiving the reception filter. The cover is fixed with top parts of the first dam and the second dam to seal the transmission filter and the reception filter. A method of manufacturing plural such package structures is also provided.
Abstract translation: 封装结构包括印刷电路板（PCB），双工器，第一坝，第二坝和盖。 双工器包括传输滤波器和接收滤波器，并与PCB电连接。 第一个坝位于PCB的表面上，与PCB协作形成一个第一个容纳接收传输过滤器的容器。 第二个水坝位于PCB的表面上，与PCB协作形成一个接收接收滤波器的第二个插座。 盖子固定在第一个水坝和第二个水坝的顶部，以密封传输过滤器和接收过滤器。 还提供了制造多个这种封装结构的方法。
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19.发明申请公开(公告)号：US20160014892A1
公开(公告)日：2016-01-14
申请号：US14861272
申请日：2015-09-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Sumiyo Nakamura , Takahiro Sumi , Takahiro Oka
CPC classification number: H05K1/0306 , C04B35/195 , C04B35/20 , C04B35/62218 , C04B35/62625 , C04B2235/3215 , C04B2235/3217 , C04B2235/3481 , C04B2235/36 , C04B2235/80 , H01L21/4867 , H01L23/12 , H01L23/15 , H01L23/49822 , H01L23/49838 , H01L2924/0002 , H05K1/0298 , H05K1/111 , H05K1/115 , H05K3/1291 , H05K3/4629 , H05K2201/017 , H05K2201/0209 , H05K2201/068 , H05K2201/09563 , H05K2201/099 , H05K2201/09909 , Y02P70/611 , H01L2924/00
Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.
Abstract translation: 提供一种绝缘陶瓷膏，陶瓷电子元件，以及陶瓷电子元件的制造方法，能够防止窄间距端子电极之间的焊料短路，并抑制覆盖一部分端子电极的绝缘体的裂纹产生 点火步骤 陶瓷电子部件包括陶瓷多层基板，形成在陶瓷多层基板的表面上的端子电极和形成在陶瓷多层基板的表面上以覆盖一部分端子电极的绝缘陶瓷膜。 绝缘陶瓷膜的暴露表面部分（富含凝胶层的层）的热膨胀系数低于陶瓷多层基板的热膨胀系数。
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20.发明申请PRINTED CIRCUIT BOARD COMPRISING CO-PLANAR SURFACE PADS AND INSULATING DIELECTRIC 审中-公开印制电路板，包括平面表面和绝缘介质公开(公告)号：US20150351229A1
公开(公告)日：2015-12-03
申请号：US14289098
申请日：2014-05-28
Inventor： Lea-Teng Lee , Sarah Haney
CPC classification number: H05K1/0268 , H05K2201/09881 , H05K2201/09909 , H05K2203/0353 , H05K2203/0588
Abstract: A printed circuit board (PCB) comprises a non-conductive base layer, a conductive interconnect disposed on the non-conductive base layer and comprising at least two surface pads separated by a trench, and a insulating dam disposed in the trench, wherein the insulating dam electrically isolates the at least two surface pads and has an upper surface that is substantially co-planar with respective upper surfaces of the at least two surface pads.
Abstract translation: 印刷电路板（PCB）包括非导电基底层，布置在非导电基底层上的导电互连，并且包括由沟槽分隔开的至少两个表面焊盘和设置在沟槽中的绝缘堤坝，其中绝缘 坝至少两个表面焊盘电隔离，并且具有与至少两个表面焊盘的相应上表面基本共面的上表面。
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