公开(公告)号：US20240244747A1

公开(公告)日：2024-07-18

申请号：US17927576

申请日：2021-12-31

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Nianqi YAO ,  Feifei LI ,  Ce NING ,  Zhengliang LI ,  Hehe HU ,  Jiayu HE ,  Jie HUANG ,  Kun ZHAO ,  Zhanfeng CAO ,  Ke WANG

IPC: H05K1/11 ,  H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H05K1/18

CPC classification number: H05K1/111 ,  H01L23/49838 ,  H01L33/62 ,  H05K1/09 ,  H05K1/181 ,  H05K2201/0338 ,  H05K2201/10106 ,  H05K2201/10151

Abstract: A wiring board includes a base substrate and first connection pads disposed on the base substrate. The first connection pads each include electrical connection layer(s); each electrical connection layer includes a main material layer and protective layer(s) disposed on a side of the main material layer away from the base substrate; the protective layer(s) include a first reference protective layer, which is a protective layer farthest away from the base substrate in the protective layer(s); and a material of the main material layer includes copper. The electrical connection layer(s) includes a first electrical connection layer, which is an electrical connection layer farthest away from the base substrate in the electrical connection layer(s); and in protective layer(s) in the first electrical connection layer, at least a material of the first reference protective layer is capable of forming a first intermetallic compound with a first solder.

公开(公告)号：US12034387B2

公开(公告)日：2024-07-09

申请号：US17882913

申请日：2022-08-08

Applicant: CenturyLink Intellectual Property LLC

Inventor： Patrick Giagnocavo

IPC: H02N2/04 ,  H05K1/18 ,  H10N35/00

CPC classification number: H02N2/04 ,  H05K1/189 ,  H10N35/00 ,  H05K2201/083 ,  H05K2201/10037 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: Novel tools and techniques are provided for implementing flexible printed circuit board (“PCB”)-based mobile sensor platform. In various embodiments, a flexible PCB-based mobile sensor platform includes a body portion(s) and at least one of a microcontroller, a locomotion system, sensors, a transceiver(s), and/or the like, each disposed on the body portion(s). The locomotion system includes one or more flexible PCB portions and corresponding actuators. Based on instructions from the microcontroller, at least one actuator may cause bending and unbending of a corresponding flexible PCB portion(s) that causes the flexible PCB-based mobile sensor platform to move toward a target location within a first environment. Upon arrival, the sensors may collect sensor data regarding at least one of the target location, an object located at the target location, or a portion of the object, and the microcontroller may send the collected sensor data to an external device via the transceiver.

公开(公告)号：US20240181960A1

公开(公告)日：2024-06-06

申请号：US18553883

申请日：2022-04-05

Applicant: VALEO VISION

Inventor： Antoine DE-LAMBERTERIE ,  Samuel DAROUSSIN ,  Alexandre VAL ,  Zdravko ZOJCESKI

IPC: B60Q1/50 ,  B60Q1/32 ,  H05K3/28

CPC classification number: B60Q1/5035 ,  H05K3/28 ,  B60Q1/324 ,  B60Q1/545 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: A lighting device for a motor vehicle, including an illuminated screen having a plurality of light sources arranged in a matrix on a substrate having a plurality of electrical interconnecting tracks that extend between the light sources. The substrate includes a first protective layer which is disposed between the light sources and has a first albedo, and a second protective layer which is disposed between the light sources and has a second albedo that is greater than the first albedo, the second layer defining a logo.

公开(公告)号：US20240121899A1

公开(公告)日：2024-04-11

申请号：US18544586

申请日：2023-12-19

Applicant: Innolux Corporation

Inventor： Chin-Cheng Kuo ,  Chia-Chun Yang ,  Wen-Cheng Huang

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/36

CPC classification number: H05K1/148 ,  H05K1/181 ,  H05K3/284 ,  H05K3/303 ,  H05K3/361 ,  H05K2201/041 ,  H05K2201/09027 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10522 ,  H05K2203/0126

Abstract: An electronic device includes a substrate, a plurality of flexible circuit boards, a plurality of ICs and an insulator. The flexible circuit boards are disposed on the substrate. In a top view of the electronic device, the flexible circuit boards are overlapped with an edge of the substrate. The ICs are disposed on the substrate. The insulator is disposed on the flexible circuit boards and contacted the ICs, wherein the insulator has a first side and a second side opposite to the first side and the first side is closer to the edge than the second side. Along a first direction perpendicular to an extension direction of the edge, a first minimum distance between the second side and one of the ICs is less than a second minimum distance between the second side and one of the flexible circuit boards.

公开(公告)号：US20240112553A1

公开(公告)日：2024-04-04

申请号：US18459644

申请日：2023-09-01

Applicant: Rosemount Inc.

Inventor： Jacob D. HOLM ,  Brian M. AFFIAS

IPC: G08B7/06 ,  H05K5/02

CPC classification number: G08B7/06 ,  H05K5/0217 ,  H05K1/18 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10136 ,  H05K2201/10151

Abstract: A smart conduit plug includes a plug body having an externally threaded region and a diameter and thread pitch to engage a conduit port. At least one electrical component is mounted relative to the plug body and is configured to electrically couple to a field device and provide an indication relative to the field device.

公开(公告)号：US11942572B2

公开(公告)日：2024-03-26

申请号：US16768594

申请日：2018-12-13

Applicant: OSRAM OLED GMBH

Inventor： Siegfried Herrmann ,  Michael Völkl

IPC: H01L33/20 ,  F21K9/90 ,  H01L23/00 ,  H01L25/075 ,  H01L33/52 ,  H01L33/64 ,  H05K1/05 ,  H05K3/00 ,  H05K3/28 ,  H10K19/00 ,  H10K50/10 ,  F21Y115/10

CPC classification number: H01L33/20 ,  F21K9/90 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/52 ,  H01L33/64 ,  H01L33/644 ,  H05K1/05 ,  H05K3/0014 ,  H05K3/284 ,  H10K19/901 ,  H10K50/10 ,  F21Y2115/10 ,  H01L2924/181 ,  H05K2201/0129 ,  H05K2201/10106

Abstract: The invention relates to a method for producing a semiconductor component comprising a radiation-emitting optical semiconductor chip or a plurality of radiation-emitting optical semiconductor chips, said method comprising: applying the radiation-emitting optical semiconductor chip or the plurality of radiation-emitting optical semiconductor chips to a deformable flat support deforming the support; and permanently fixing the deformation.

公开(公告)号：US11934004B2

公开(公告)日：2024-03-19

申请号：US17674894

申请日：2022-02-18

Applicant: TACTOTEK OY

Inventor： Antti Keränen ,  Mikko Heikkinen

IPC: F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/28

CPC classification number: G02B6/0091 ,  G02B6/0021 ,  G02B6/0031 ,  G02B6/0051 ,  G02B6/0065 ,  G02B6/0093 ,  G02B6/0055 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/181 ,  H05K3/12 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

公开(公告)号：US20240080985A1

公开(公告)日：2024-03-07

申请号：US18351423

申请日：2023-07-12

Applicant: LG DISPLAY CO., LTD.

Inventor： Suhun LEE ,  MyungJoon PARK

IPC: H05K1/18 ,  G09G3/32 ,  H05K3/00

CPC classification number: H05K1/181 ,  G09G3/32 ,  H05K3/0044 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: According to embodiments of the disclosure, it is possible to increase scattering effect and light reflectance in the area around the light source by increasing the ratio of the base layer exposed around the light source, which have protrusion patterns and have a higher reflectance than the cover layer and are positioned under the cover layer and the wiring layer of the printed circuit where the light source included in the backlight unit. Thus, there may be provided a backlight unit with enhanced light efficiency and image quality in the area around the light source and a display device including the same.

公开(公告)号：US11924983B2

公开(公告)日：2024-03-05

申请号：US17698412

申请日：2022-03-18

Applicant: Honeywell Federal Manufacturing & Technologies, LLC

Inventor： Ryan J. Eickbush ,  Neiko P. Levenhagen ,  Christopher Scott Marchman ,  Steven Patterson ,  Nicholas J. Furman

IPC: H05K5/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/18

CPC classification number: H05K5/0065 ,  H05K1/111 ,  H05K1/181 ,  H05K3/181 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2203/107

Abstract: Systems and methods for providing an electronics module including a raceway for mounting submodules and establishing electrical communication with said submodules. The raceway comprises a base structure and a conductive trace formed by a conductive plating process. Connection pads on the raceway are configured to receive connection nodes of the submodules for providing a continuous electrical connection between the raceway and the submodules for electrical communication and power transmission.

公开(公告)号：US20240047393A1

公开(公告)日：2024-02-08

申请号：US18489871

申请日：2023-10-19

Applicant: Innolux Corporation

Inventor： Chueh Yuan Nien ,  Chao-Chin Sung ,  Chia-Hung Hsieh ,  Mei Cheng Liu

IPC: H01L23/00 ,  H01L25/16 ,  H05K1/11 ,  H01L23/31 ,  H05K1/18

CPC classification number: H01L24/05 ,  H01L25/162 ,  H05K1/111 ,  H01L23/3192 ,  H05K1/181 ,  H01L25/167 ,  H01L2924/35121 ,  H01L24/32 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/05073 ,  H01L2224/0502 ,  H01L2224/05573 ,  H01L2224/05564 ,  H01L2224/05553 ,  H01L2224/05013 ,  H01L2924/12041 ,  H01L2924/1426 ,  H05K2201/10522 ,  H05K2201/0989 ,  H05K2201/10106

Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a conductive electrode, and a first layer. The conductive electrode and the first layer are disposed on the base, the first layer surrounds the conductive electrode and overlaps an edge portion of the conductive electrode. In a cross-sectional view, the first layer is divided into a first part and a second part, the conductive electrode is located between the first part and the second part, and a width of the first part is different from a width of the second part.