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    SHIELDED MULTI-STAGE EMI NOISE FILTER
    11.
    发明申请
    SHIELDED MULTI-STAGE EMI NOISE FILTER 有权
    屏蔽多级EMI噪声滤波器

    公开(公告)号：US20150229288A1

    公开(公告)日：2015-08-13

    申请号：US14180119

    申请日：2014-02-13

    Applicant: UT-Battelle, LLC

    Inventor： Roger Allen Kisner ,  David Lee Fugate

    IPC: H03H7/01

    CPC classification number: H03H1/0007 ,  H03H7/0115 ,  H03H2001/0021 ,  H03H2001/0028 ,  H05K1/0209 ,  H05K1/0233 ,  H05K3/0061 ,  H05K2201/09972 ,  H05K2201/1006 ,  H05K2201/10219

    Abstract: Electromagnetic interference (EMI) noise filter embodiments and methods for filtering are provided herein. EMI noise filters include multiple signal exclusion enclosures. The multiple signal exclusion enclosures contain filter circuit stages. The signal exclusion enclosures can attenuate noise generated external to the enclosures and/or isolate noise currents generated by the corresponding filter circuits within the enclosures. In certain embodiments, an output of one filter circuit stage is connected to an input of the next filter circuit stage. The multiple signal exclusion enclosures can be chambers formed using conductive partitions to divide an outer signal exclusion enclosure. EMI noise filters can also include mechanisms to maintain the components of the filter circuit stages at a consistent temperature. For example, a metal base plate can distribute heat among filter components, and an insulating material can be positioned inside signal exclusion enclosures.

    Abstract translation: 本文提供电磁干扰（EMI）噪声滤波器实施例和滤波方法。 EMI噪声滤波器包括多个信号排除外壳。 多信号排除外壳包含滤波电路级。 信号排除外壳可以衰减外壳产生的噪声和/或隔离由外壳内的相应的滤波器电路产生的噪声电流。 在某些实施例中，一个滤波器电路级的输出连接到下一个滤波器电路级的输入端。 多个信号排除外壳可以是使用导电隔板形成的腔室，以分隔外部信号排除罩。 EMI噪声滤波器还可以包括将滤波器电路的部件级保持在恒定温度的机构。 例如，金属基板可以在过滤器部件之间分配热量，并且绝缘材料可以位于信号排除外壳内。

    System for thermal control of red LED(s) chips
    12.
    发明授权
    System for thermal control of red LED(s) chips 有权
    红色LED芯片的热控制系统

    公开(公告)号：US09035331B2

    公开(公告)日：2015-05-19

    申请号：US13711818

    申请日：2012-12-12

    Applicant: GE Lighting Solutions, LLC

    Inventor： Glenn Howard Kuenzler

    IPC: H01L29/18 ,  H01L33/00 ,  H01L27/15 ,  H05B33/08 ,  H05K1/02 ,  F21Y111/00 ,  F21Y113/00 ,  H05K1/18

    CPC classification number: H01L27/15 ,  F21V29/54 ,  F21Y2107/60 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05B33/0803 ,  H05B33/0872 ,  H05K1/0209 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10219

    Abstract: A light emitting diode assembly includes a first light emitting diode disposed on a first substrate and a second light emitting diode disposed on a second substrate that is disposed substantially adjacent to the first substrate. The second light emitting diode has a higher rate of performance degradation over time due to temperature than the first light emitting diode. A heat sink is thermally coupled to the first substrate and an electrical cooling circuit is thermally coupled to the second substrate. The electrical cooling circuit is configured to reduce a temperature of the second substrate when the electrical cooling circuit is electrically energized.

    Abstract translation: 发光二极管组件包括设置在第一衬底上的第一发光二极管和设置在基本上邻近于第一衬底的第二衬底上的第二发光二极管。 第二发光二极管由于温度而比第一发光二极管具有更高的性能劣化速度。 散热器热耦合到第一衬底，并且电冷却回路热耦合到第二衬底。 电冷却回路构造成当电冷却回路被通电时，减小第二基板的温度。

    SYSTEM FOR THERMAL CONTROL OF RED LED(S) CHIPS
    13.
    发明申请
    SYSTEM FOR THERMAL CONTROL OF RED LED(S) CHIPS 有权
    红色LED（S）灯的热控制系统

    公开(公告)号：US20140159077A1

    公开(公告)日：2014-06-12

    申请号：US13711818

    申请日：2012-12-12

    Applicant: GE LIGHTING SOLUTIONS, LLC

    Inventor： Glenn Howard KUENZLER

    IPC: H01L27/15

    CPC classification number: H01L27/15 ,  F21V29/54 ,  F21Y2107/60 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05B33/0803 ,  H05B33/0872 ,  H05K1/0209 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10219

    Abstract: A light emitting diode assembly includes a first light emitting diode disposed on a first substrate and a second light emitting diode disposed on a second substrate that is disposed substantially adjacent to the first substrate. The second light emitting diode has a higher rate of performance degradation over time due to temperature than the first light emitting diode. A heat sink is thermally coupled to the first substrate and an electrical cooling circuit is thermally coupled to the second substrate. The electrical cooling circuit is configured to reduce a temperature of the second substrate when the electrical cooling circuit is electrically energized.

    Abstract translation: 发光二极管组件包括设置在第一衬底上的第一发光二极管和设置在基本上邻近于第一衬底的第二衬底上的第二发光二极管。 第二发光二极管由于温度而比第一发光二极管具有更高的性能劣化速度。 散热器热耦合到第一衬底，并且电冷却回路热耦合到第二衬底。 电冷却回路构造成当电冷却回路被通电时，减小第二基板的温度。

    Thermoelectric conversion module and method for manufacturing the same
    14.
    发明授权
    Thermoelectric conversion module and method for manufacturing the same 有权
    热电转换模块及其制造方法

    公开(公告)号：US08575469B2

    公开(公告)日：2013-11-05

    申请号：US13252223

    申请日：2011-10-04

    Applicant: Yasuhiro Kawauchi ,  Takanori Nakamura

    Inventor： Yasuhiro Kawauchi ,  Takanori Nakamura

    IPC: H01L35/12

    CPC classification number: H01L35/32 ,  H01L35/34 ,  H05K1/0206 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/10219

    Abstract: A compact, high-performance thermoelectric conversion module includes a laminate having a plurality of insulating layers, p-type thermoelectric semiconductors and n-type thermoelectric semiconductors formed by a technique for manufacturing a multilayer circuit board, particularly a technique for forming a via-conductor. Pairs of the p-type thermoelectric semiconductors and the n-type thermoelectric semiconductors are electrically connected to each other in series through p-n connection conductors to define thermoelectric conversion element pairs. The thermoelectric conversion element pairs are connected in series through, for example, series wiring conductors. The thermoelectric semiconductors each have a plurality of portions in which the peak temperatures of thermoelectric figures of merit are different from each other. These portions are distributed in the stacking direction of the laminate.

    Abstract translation: 小型高性能热电转换模块包括具有多个绝缘层，p型热电半导体和通过用于制造多层电路板的技术形成的n型热电半导体的层压体，特别是形成通孔导体的技术 。 p型热电半导体和n型热电半导体的对通过p-n连接导体串联电连接以限定热电转换元件对。 热电转换元件对通过例如串联布线导体串联连接。 热电半导体各自具有多个热电元件的峰值温度彼此不同的部分。 这些部分沿层叠体的层叠方向分布。

    LIGHT SOURCE MODULE AND METHOD FOR MANUFACTURING SAME
    16.
    发明申请
    LIGHT SOURCE MODULE AND METHOD FOR MANUFACTURING SAME 审中-公开
    光源模块及其制造方法

    公开(公告)号：US20090153007A1

    公开(公告)日：2009-06-18

    申请号：US12212986

    申请日：2008-09-18

    Applicant: WEN-JANG JIANG

    Inventor： WEN-JANG JIANG

    IPC: H01J7/24 ,  H01J9/00

    CPC classification number: H05K1/0203 ,  H01L33/645 ,  H01L35/30 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/8592 ,  H05K1/145 ,  H05K2201/10106 ,  H05K2201/10219 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A light source module includes a light source and an thermoelectric cooler. The thermoelectric cooler includes a first base board, a second base board and a number of thermoelectric cooling units. The first base board includes a first surface and an opposing second surface. The second base board includes a top surface and a bottom surface. The light source is defined on the first surface of the first base board. The thermoelectric cooling units are disposed between the first surface of the first base board and the top surface of the second base board, and are configured for transferring heat generated from the light source from the first base board to the second base board.

    Abstract translation: 光源模块包括光源和热电冷却器。 热电冷却器包括第一基板，第二基板和多个热电冷却单元。 第一基板包括第一表面和相对的第二表面。 第二基板包括顶表面和底表面。 光源被限定在第一基板的第一表面上。 热电冷却单元设置在第一基板的第一表面和第二基板的顶表面之间，并且被配置为将从光源产生的热量从第一基板传递到第二基板。

    THERMOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING THE SAME
    17.
    发明申请
    THERMOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    热电转换模块及其制造方法

    公开(公告)号：US20090032080A1

    公开(公告)日：2009-02-05

    申请号：US12195538

    申请日：2008-08-21

    Applicant: Yasuhiro Kawauchi ,  Takanori Nakamura

    Inventor： Yasuhiro Kawauchi ,  Takanori Nakamura

    IPC: H01L35/02 ,  H01L21/00

    CPC classification number: H01L35/32 ,  H01L35/34 ,  H05K1/0206 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/10219

    Abstract: A compact, high-performance thermoelectric conversion module includes a laminate having a plurality of insulating layers, p-type thermoelectric semiconductors and n-type thermoelectric semiconductors formed by a technique for manufacturing a multilayer circuit board, particularly a technique for forming a via-conductor. Pairs of the p-type thermoelectric semiconductors and the n-type thermoelectric semiconductors are electrically connected to each other in series through p-n connection conductors to define thermoelectric conversion element pairs. The thermoelectric conversion element pairs are connected in series through, for example, series wiring conductors. The thermoelectric semiconductors each have a plurality of portions in which the peak temperatures of thermoelectric figures of merit are different from each other. These portions are distributed in the stacking direction of the laminate.

    Abstract translation: 小型高性能热电转换模块包括具有多个绝缘层，p型热电半导体和通过用于制造多层电路板的技术形成的n型热电半导体的层压体，特别是形成通孔导体的技术 。 p型热电半导体和n型热电半导体的对通过p-n连接导体串联电连接以限定热电转换元件对。 热电转换元件对通过例如串联布线导体串联连接。 热电半导体各自具有多个热电元件的峰值温度彼此不同的部分。 这些部分沿层叠体的层叠方向分布。

    Electrical circuit board and method for making the same
    18.
    发明授权
    Electrical circuit board and method for making the same 失效
    电路板及其制作方法

    公开(公告)号：US06327149B1

    公开(公告)日：2001-12-04

    申请号：US09655558

    申请日：2000-09-06

    Applicant: Lakhi Nandlal Goenka

    Inventor： Lakhi Nandlal Goenka

    IPC: H05K720

    CPC classification number: H05K1/0209 ,  H01L23/38 ,  H01L2924/0002 ,  H05K2201/0361 ,  H05K2201/09781 ,  H05K2201/10219 ,  Y10T428/252 ,  H01L2924/00

    Abstract: A multi-layer circuit board with a thermoelectric or “Peltier” cooler and a method forming a multi-layer circuit board with a thermoelectric or “Peltier” cooler is disclosed. The circuit board includes a thermoelectric cooler which is integrally formed within the circuit board and which is effective to efficiently absorb and dissipate heat from the circuit board.

    Abstract translation: 公开了一种具有热电或“珀尔帖”冷却器的多层电路板，以及形成具有热电或“珀尔帖”冷却器的多层电路板的方法。 电路板包括一体形成在电路板内的热电冷却器，其有效地有效地吸收和散发来自电路板的热量。

    CONTROL BOARD, ELECTRONIC EQUIPMENT, AND IMAGE FORMING APPARATUS
    19.
    发明公开
    CONTROL BOARD, ELECTRONIC EQUIPMENT, AND IMAGE FORMING APPARATUS 审中-公开

    公开(公告)号：US20230393516A1

    公开(公告)日：2023-12-07

    申请号：US18250100

    申请日：2021-11-10

    Applicant: Kenichi WATANABE

    Inventor： Kenichi WATANABE

    IPC: G03G15/00 ,  H05K1/02 ,  H10N10/13 ,  H10N10/82

    CPC classification number: G03G15/80 ,  H05K1/0203 ,  H10N10/13 ,  H10N10/82 ,  H05K2201/10219

    Abstract: To provide a control board for efficiently generating electric energy in a power generating device from heat generated from an electronic device. A control board includes a board including a first heat dissipating pad; an electronic device including a second heat dissipating pad to dissipate heat; a power generating device including a Peltier device which converts heat energy generated from the electronic device into electric energy, wherein the power generating device is sandwiched between the first heat dissipating pad and the second heat dissipating pad; and a power supply circuit configured to reuse the electric energy.

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