公开(公告)号：US08147278B2

公开(公告)日：2012-04-03

申请号：US12074112

申请日：2008-02-28

Applicant: Victor H. Renteria ,  Aurelio J. Gutierrez ,  William Mahlerbe ,  Gary L. Hurd ,  Russell L. Machado

Inventor： Victor H. Renteria ,  Aurelio J. Gutierrez ,  William Mahlerbe ,  Gary L. Hurd ,  Russell L. Machado

IPC: H01R13/66

CPC classification number: H01R13/66 ,  H01R12/70 ,  H01R13/6658 ,  H01R13/719 ,  H01R13/7193 ,  H01R24/64 ,  H05K1/0233 ,  H05K1/18 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10189 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10568 ,  H05K2201/2036

Abstract: An electrical connector mountable on a printed circuit board. In one embodiment, the electrical connector comprises an insulative housing comprising one or more electronic components, a plurality of electrical conductors in signal communication with the electronic components and adapted to interface with a plug and a plurality of terminals in signal communication with the one or more electronic components. In one aspect, the plurality of terminals are adapted to interface with one or more externally mounted electronic components on the printed circuit board thereby filtering signals passing between the electrical conductors and the printed circuit board, with the externally mounted electronic components mounted within the footprint of the electrical connector. Methods of manufacture for the aforementioned electrical connector and business methods are also disclosed.

Abstract translation: 可安装在印刷电路板上的电连接器。 在一个实施例中，电连接器包括绝缘壳体，该绝缘壳体包括一个或多个电子部件，与电子部件信号通信的多个电导体，并且适于与插头和多个终端进行信号通信，该多个终端与一个或多个 电子元器件。 在一个方面，多个端子适于与印刷电路板上的一个或多个外部安装的电子部件接合，从而过滤在电导体和印刷电路板之间通过的信号，其中外部安装的电子部件安装在 电连接器。 还公开了上述电连接器的制造方法和业务方法。

公开(公告)号：US07927156B2

公开(公告)日：2011-04-19

申请号：US12513581

申请日：2007-09-26

Applicant: Wilhelm Appel ,  Bernhard Eichhorner ,  Wolfgang Peprny ,  Martin Petricek ,  Arnold Schönleitner

Inventor： Wilhelm Appel ,  Bernhard Eichhorner ,  Wolfgang Peprny ,  Martin Petricek ,  Arnold Schönleitner

IPC: H01R33/05

CPC classification number: H01R12/515 ,  H01R4/366 ,  H01R9/2425 ,  H05K1/0256 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2203/167

Abstract: An electrical connector element for connection of a conductor to a circuit board, having a housing, at least one clamp connector for the conductor and at least two connector pins for preferably soldered connection to the circuit board, is disclosed. The housing has at least one separating element made from insulating material, projecting from the lower side, facing away from the circuit board in the assembled position, at least partly arranged between the connector pins and extending through the circuit board in the assembled position, in order to permit the connector pins of the electrical connector element to be arranged closer together.

Abstract translation: 一种用于将导体连接到电路板的电连接器元件，其具有壳体，用于导体的至少一个夹紧连接器和用于优选地焊接到电路板的连接的至少两个连接器引脚。 壳体具有至少一个由绝缘材料制成的分离元件，该组件从下侧突出，在组装位置背离电路板，至少部分地布置在连接器插脚之间并在组装位置中延伸穿过电路板， 以允许电连接器元件的连接器插脚更靠近地配置。

公开(公告)号：US20100136807A1

公开(公告)日：2010-06-03

申请号：US12513581

申请日：2007-09-26

Applicant: Wilhelm Appel ,  Bernhard Eichhomer ,  Wolfgang Peprny ,  Martin Petricek ,  Arnold Schönleitner

Inventor： Wilhelm Appel ,  Bernhard Eichhomer ,  Wolfgang Peprny ,  Martin Petricek ,  Arnold Schönleitner

IPC: H01R12/00

CPC classification number: H01R12/515 ,  H01R4/366 ,  H01R9/2425 ,  H05K1/0256 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2203/167

Abstract: An electrical connector element for connection of a conductor to a circuit board, having a housing, at least one clamp connector for the conductor and at least two connector pins for preferably soldered connection to the circuit board, is disclosed. The housing has at least one separating element made from insulating material, projecting from the lower side, facing away from the circuit board in the assembled position, at least partly arranged between the connector pins and extending through the circuit board in the assembled position, in order to permit the connector pins of the electrical connector element to be arranged closer together.

Abstract translation: 一种用于将导体连接到电路板的电连接器元件，其具有壳体，用于导体的至少一个夹紧连接器和用于优选地焊接到电路板的连接的至少两个连接器引脚。 壳体具有至少一个由绝缘材料制成的分离元件，该组件从下侧突出，在组装位置背离电路板，至少部分地布置在连接器插脚之间并在组装位置中延伸穿过电路板， 以允许电连接器元件的连接器插脚更靠近地配置。

公开(公告)号：US20100047961A1

公开(公告)日：2010-02-25

申请号：US12195441

申请日：2008-08-21

Applicant: Czeslaw Andrzej Ruszowski

Inventor： Czeslaw Andrzej Ruszowski

IPC: H01L21/00 ,  H05K3/30

CPC classification number: H05K3/303 ,  H01L2924/14 ,  H05K1/0266 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2203/167 ,  H05K2203/168 ,  Y02P70/613 ,  Y10T29/49133

Abstract: Disclosed herein is a method of positioning and placing an integrated circuit on a printed circuit board. The integrated circuit comprises first geometrical elements. The first geometrical elements are of one or more predefined shapes and are located on one or more predefined surfaces of the integrated circuit. The printed circuit board comprises second geometrical elements. The second geometrical elements are shaped to accommodate the first geometrical elements. The first geometrical elements are designed to fit into the second geometrical elements. The first geometrical elements are positioned and placed over the second geometrical elements. The first geometrical elements come in contact with the second geometrical elements at two or more points. The positioning and placement of the first geometrical elements over the second geometrical elements limits displacement of connections of the integrated circuit from the printed circuit board.

Abstract translation: 这里公开了一种将集成电路定位和放置在印刷电路板上的方法。 集成电路包括第一几何元件。 第一几何元件具有一个或多个预定形状并且位于集成电路的一个或多个预定表面上。 印刷电路板包括第二几何元件。 第二几何元件被成形为适应第一几何元件。 第一几何元件被设计成适合于第二几何元件。 第一几何元件被定位并放置在第二几何元件上。 第一几何元件在两个或多个点处与第二几何元件接触。 在第二几何元件上的第一几何元件的定位和放置限制了集成电路与印刷电路板的连接的位移。

公开(公告)号：US20090152659A1

公开(公告)日：2009-06-18

申请号：US11959308

申请日：2007-12-18

Applicant: Jari Hiltunen ,  Ian Montandon

Inventor： Jari Hiltunen ,  Ian Montandon

IPC: H01L31/0232 ,  H01L31/18

CPC classification number: H04N5/2253 ,  H04N5/2257 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/09781 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A reflowable camera module has a set of solder joints formed on a bottom surface of the camera module that provide electrical signal and power connections between the camera module and a printed circuit substrate. The solder joints are susceptible to failure caused by shear forces, particularly in corner regions. Additional localized mechanical supports are provided to protect those solder joints carrying power and electrical signals for the camera module. The localized mechanical supports are formed outside of a region containing the solder joints carrying power and electrical signals. The localized mechanical supports may include dummy solder joints formed in corner regions and/or dummy leads used to support the camera module. Solder joint reliability is enhanced without requiring the use of an underfill encapsulant.

Abstract translation: 可回流相机模块具有形成在相机模块的底表面上的一组焊接接头，其提供相机模块和印刷电路基板之间的电信号和电源连接。 焊点易受剪切力引起的故障，特别是在拐角区域。 提供了额外的局部机械支撑以保护承载相机模块的功率和电信号的焊点。 局部的机械支撑件形成在包含携带电力和电信号的焊点的区域的外部。 局部机械支撑件可以包括形成在拐角区域中的虚拟焊点和/或用于支撑相机模块的虚拟引线。 焊接可靠性得到提高，而不需要使用底部填充密封剂。

公开(公告)号：US07541294B2

公开(公告)日：2009-06-02

申请号：US11273666

申请日：2005-11-14

Applicant: Kenichi Shirasaka

Inventor： Kenichi Shirasaka

IPC: H01L21/31 ,  H01L21/469 ,  H01L23/04 ,  H01L32/50 ,  H01L23/544

CPC classification number: H05K3/303 ,  H01L23/544 ,  H01L2223/54406 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2924/1815 ,  H05K1/0269 ,  H05K2201/09936 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2203/168 ,  Y02P70/613 ,  Y10S438/975

Abstract: To provide a semiconductor package mounting method, with excellent work efficiency, wherein the direction of a semiconductor package can be verified by a simple method before mounting. One corner of a square shaped display section provided on the surface of a semiconductor package body is chamfered such that the chamfer dimensions are different from those of the other corners. If image recognition by a camera determines that this chamfered part is located correctly, the orientation of a semiconductor package is determined to be correct. On the other hand, if image recognition determines that it is not located correctly, the orientation of the semiconductor package is adjusted until it is correct.

公开(公告)号：US20090086447A1

公开(公告)日：2009-04-02

申请号：US12243243

申请日：2008-10-01

Applicant: Keiichi Sugimoto ,  Mitsuru Nakagawa

Inventor： Keiichi Sugimoto ,  Mitsuru Nakagawa

IPC: H05K3/30 ,  H05K5/00

CPC classification number: H05K3/303 ,  G07C9/00944 ,  H01L2924/1815 ,  H05K1/182 ,  H05K3/284 ,  H05K2201/10037 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10T29/49146

Abstract: A method of making an electronic circuit device includes preparing an electronic element having at least one projection, mounting the electronic element on only a first side of a circuit board in such a manner that the projection is substantially held in point contact with the first side of the circuit board to form a gap between the circuit board and the electronic element, placing the circuit board in a mold cavity in such a manner that a second side of the circuit board is held in close contact with an inner surface of the cavity. The method further includes encapsulating the circuit board in a casing by filling the cavity with a resin material so that the gap is filled with the resin material.

Abstract translation: 一种制造电子电路装置的方法包括制备具有至少一个突起的电子元件，将电子元件仅安装在电路板的第一侧上，使得突出部基本上保持与第一侧点接触 所述电路板在所述电路板和所述电子元件之间形成间隙，将所述电路板放置在模腔中，使得所述电路板的第二面与所述腔的内表面紧密接触。 该方法还包括通过用树脂材料填充空腔将电路板封装在壳体中，使得间隙填充有树脂材料。

公开(公告)号：US20080253098A1

公开(公告)日：2008-10-16

申请号：US11735067

申请日：2007-04-13

Applicant: Weifeng Liu

Inventor： Weifeng Liu

IPC: H05K7/10 ,  H01L21/00

CPC classification number: H05K3/303 ,  H01L23/49811 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: An assembly. The assembly reduces damage to a related electronic package during attachment to a related electronic interconnect structure. The assembly includes an interposer. The interposer has a first side and an opposing second side and has multiple holes formed in the interposer that extend from the first side to the second side. The electronic package is configurable to comprise one or more electronic structures; the interposer is configured for placement between the electronic package and the electronic interconnect structure; the locus of a wall of each of the holes is configured to facilitate insertion of a matching coupling component configured for electrically coupling the electronic package to the electronic interconnect structure; the wall of each hole is configured to provide complete encirclement of that hole; and the interposer mechanically inhibits physical contact between the electronic package and the electronic interconnect structure.

Abstract translation: 一个装配 该组件在附接到相关电子互连结构期间减少对相关电子封装的损坏。 组件包括插入器。 插入器具有第一侧和相对的第二侧，并且具有形成在插入件中的从第一侧延伸到第二侧的多个孔。 电子封装可配置为包括一个或多个电子结构; 插入器被配置为放置在电子封装和电子互连结构之间; 每个孔的壁的轨迹被配置为便于插入被配置用于将电子封装电耦合到电子互连结构的匹配耦合部件; 每个孔的壁被构造成提供该孔的完全包围; 并且插入器机械地抑制电子封装和电子互连结构之间的物理接触。

公开(公告)号：US20080203510A1

公开(公告)日：2008-08-28

申请号：US11933749

申请日：2007-11-01

Applicant: Atsushi KAWAMURA

Inventor： Atsushi KAWAMURA

IPC: H01L23/498

CPC classification number: H01L31/0203 ,  H01L25/167 ,  H01L31/0232 ,  H01L33/483 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/0243 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10121 ,  H05K2201/10568 ,  H05K2201/10969 ,  H05K2201/2036 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An optical module of the present invention includes: a semiconductor device 14; a grounded metal member 10 for mounting the semiconductor device 14 thereon; a substrate 16 for mounting the grounded metal member 10 thereon; and a lead pin 18 fixed to and insulated from the grounded metal member 10 and soldered to the substrate 16, the lead pin 18 being used to supply power to the semiconductor device 14; wherein the grounded metal member 10 has a protrusion on a surface thereof facing the substrate 16; and wherein the protrusion of the grounded metal member 10 is in contact with the substrate 16.

Abstract translation: 本发明的光模块包括：半导体器件14; 用于在其上安装半导体器件14的接地金属部件10; 用于将接地的金属构件10安装在其上的基板16; 以及与接地的金属构件10固定并绝缘并焊接到基板16的引脚18，引脚18用于向半导体器件14供电; 其中接地金属构件10在其面向基板16的表面上具有突起; 并且其中接地的金属构件10的突起与衬底16接触。

公开(公告)号：US07413451B2

公开(公告)日：2008-08-19

申请号：US11594314

申请日：2006-11-07

Applicant: Myoungsoo Jeon

Inventor： Myoungsoo Jeon

IPC: H01R12/00

CPC classification number: H01R12/57 ,  H01R12/52 ,  H01R12/727 ,  H01R43/0256 ,  H05K3/3426 ,  H05K2201/09136 ,  H05K2201/10189 ,  H05K2201/10568 ,  Y02P70/613 ,  Y10T29/4921

Abstract: A high speed electrical connector includes a plurality of substantially planar signal transmission bodies (SPSTB), an insulative housing that retains the plurality of SPSTBs, and a plurality of self-adjusting surface-mount attachment structures (SASMAS). Each SASMAS is confined in its own guide with respect to an associated SPSTB. During the connector-to-printed circuit board (PCB) attachment process, the connector is heated so that solder within the connector that holds the SASMAS structures in place melts. As the connector settles with respect to the PCB, the SASMAS structures slide in their respective guides varying amounts to accommodate non-planarity of the upper surface of the PCB. In one example, each SPSTB is a printed circuit that has a plurality of signal conductors. Each conductor terminates in planar sliding surface. A SASMAS is self-adjustably soldered to each such sliding surface.