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    Electronic component and selection method
    11.
    发明授权
    Electronic component and selection method 有权
    电子元件和选择方法

    公开(公告)号：US09374908B2

    公开(公告)日：2016-06-21

    申请号：US13598655

    申请日：2012-08-30

    Applicant: Yasuo Fujii

    Inventor： Yasuo Fujii

    IPC: H01G4/005 ,  H01G4/228 ,  H05K3/32 ,  H01G4/01 ,  H01G4/30 ,  H05K1/02 ,  H01G4/012 ,  H01G4/232 ,  H05K1/11 ,  H05K3/34

    CPC classification number: H05K3/32 ,  H01G4/01 ,  H01G4/012 ,  H01G4/2325 ,  H01G4/30 ,  H05K1/0295 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/2045 ,  Y10T29/4913

    Abstract: In an electronic component, a laminate is obtained by laminating a plurality of ceramic layers, and includes an upper surface and a bottom surface which are at ends of the laminate in the z-axis direction, end surfaces facing each other, and side surfaces facing each other. First capacitor conductors, second capacitor conductors, and the ceramic layers are laminated. One of the first capacitor conductors and one of the second capacitor conductors face each other via one of the ceramic layers. A first external electrode and a second external electrode are located on one of the end surfaces and one of the side surfaces, respectively, and are connected to the first capacitor conductors. A third external electrode and a fourth external electrode are located on the other one of the end surfaces and the other one of the side surfaces, respectively, and are connected to the second capacitor conductors.

    Abstract translation: 在电子部件中，通过层叠多个陶瓷层而获得层压体，并且包括位于层叠体的z轴方向的端部的上表面和底面，以及彼此面对的端面， 彼此。 第一电容器导体，第二电容器导体和陶瓷层被层压。 第一电容器导体和第二电容器导体中的一个通过一个陶瓷层彼此面对。 第一外部电极和第二外部电极分别位于一个端面和一个侧表面中，并且连接到第一电容器导体。 第三外部电极和第四外部电极分别位于另一个端面和另一个侧表面中，并且连接到第二电容器导体。

    Monolithic capacitor mounting structure and monolithic capacitor
    12.
    发明授权
    Monolithic capacitor mounting structure and monolithic capacitor 有权
    单片电容器安装结构和单片电容器

    公开(公告)号：US09374901B2

    公开(公告)日：2016-06-21

    申请号：US13960829

    申请日：2013-08-07

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo Hattori ,  Isamu Fujimoto

    IPC: H01G4/228 ,  H01G4/30 ,  H05K1/18 ,  H01G2/06 ,  H01G4/232 ,  H05K3/34

    CPC classification number: H05K1/18 ,  H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611

    Abstract: In a monolithic capacitor mounting structure, assuming that a portion of a first outer electrode joined with a first bonding material is a first bonding portion and a portion of a second outer electrode joined with a second bonding material is a second bonding portion, a length of each of the first and second bonding portions in a lengthwise direction of the monolithic capacitor is about 0.2 times to about 0.5 times a length of an elementary body in the lengthwise direction, and a center of each of the first and second bonding portions in the lengthwise direction is located at a position different from a center of the elementary body in the lengthwise direction. Vibration noise is changed depending on positions of outer electrodes of the monolithic capacitor, the outer electrodes being used to bond the monolithic capacitor to a mounting substrate.

    Abstract translation: 在单体电容器安装结构中，假设与第一接合材料接合的第一外部电极的一部分是第一接合部分，并且与第二接合材料接合的第二外部电极的一部分是第二接合部分， 单片电容器的长度方向上的第一接合部和第二接合部中的每一个在长度方向上为基本体的长度的约0.2倍〜约0.5倍，长度方向上的第一接合部和第二接合部的中心 方向位于与基本体的长度方向的中心不同的位置。 振动噪声根据单体电容器的外部电极的位置而变化，外部电极用于将单片电容器接合到安装基板。

    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    14.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开
    复合电子元件及其相应的板

    公开(公告)号：US20160133386A1

    公开(公告)日：2016-05-12

    申请号：US14869935

    申请日：2015-09-29

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sang Soo PARK ,  Kyoung Jin JUN ,  Young Ghyu AHN ,  Heung Kil PARK

    IPC: H01G4/40 ,  H05K1/18 ,  H01G4/30

    CPC classification number: H01G4/40 ,  H01G2/06 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30 ,  H05K3/301 ,  H05K3/321 ,  H05K3/3431 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/2045 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic electronic component are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body comprising dielectric layers and internal electrodes, the internal electrodes having at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on first and second end portions of the first ceramic body. The ceramic electronic component includes a second ceramic body coupled to a lower portion of the multilayer ceramic capacitor and made of ceramic; and first and second terminal electrodes disposed on first and second end portions of the second ceramic body and connected to the first and second external electrodes, and the multilayer ceramic capacitor and the ceramic electronic component have different lengths.

    Abstract translation: 复合电子部件包括多层陶瓷电容器和陶瓷电子部件彼此结合的复合体。 所述多层陶瓷电容器包括：第一陶瓷体，其包含电介质层和内部电极，所述内部电极具有介于其间的介质层中的至少一个; 以及设置在第一陶瓷体的第一和第二端部上的第一和第二外部电极。 陶瓷电子部件包括：第二陶瓷体，其与多层陶瓷电容器的下部连接并由陶瓷制成; 以及第一和第二端子电极，其设置在第二陶瓷体的第一和第二端部并且连接到第一和第二外部电极，并且多层陶瓷电容器和陶瓷电子部件具有不同的长度。

    Non-uniform dielectric layer capacitor for vibration and acoustics improvement
    16.
    发明授权
    Non-uniform dielectric layer capacitor for vibration and acoustics improvement 有权
    用于振动和声学改进的非均匀介质层电容器

    公开(公告)号：US09330849B2

    公开(公告)日：2016-05-03

    申请号：US14285461

    申请日：2014-05-22

    Applicant: Apple Inc.

    Inventor： Zhong-Qing Gong ,  Kevin R. Richardson ,  Yanchu Xu ,  Connor R. Duke ,  Benjamin A. Bard

    IPC: H01G4/30 ,  H01G4/12 ,  H05K1/18 ,  H01G4/255 ,  H01G4/005 ,  H05K3/34

    CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/12 ,  H01G4/255 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611 ,  Y10T29/435

    Abstract: A Non-Uniform Dielectric Layer, Multi-Layer-Ceramic-Capacitor (MLCC) has upper and lower dielectric layers separating upper and lower electrode layers, where the lower dielectric layers have a greater vertical thickness than the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces on a printed circuit board (PCB) on which the capacitor is mounted. Such an MLCC may include an upper set of dielectric layers that separate adjacent pairs of upper electrode layers in a top portion of the MLCC, and a lower set of dielectric layers that separate adjacent pairs of lower electrode layers in a bottom portion of the MLCC. A bottom portion of the MLCC may be mounted on a PCB. The thickness of the lower dielectric layers may be between 1.5 and 3.5 times greater than the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces in the audio range of human hearing.

    Abstract translation: 非均匀电介质层，多层陶瓷电容器（MLCC）具有分隔上下电极层的上下电介质层，其中下电介质层具有比上电介质层更大的垂直厚度，以减少压电效应驱动 在其上安装电容器的印刷电路板（PCB）上的电容器反作用力。 这样的MLCC可以包括在MLCC的顶部分隔相邻的上电极层对的上部介电层和在MLCC的底部分隔相邻的下电极层对的下组电介质层。 MLCC的底部可以安装在PCB上。 下电介质层的厚度可以是上电介质层的1.5至3.5倍，以减少在人类听觉的音频范围内的压电效应驱动的电容器反作用力。

    SURFACE MOUNTABLE, TOROID MAGNETIC DEVICE
    17.
    发明申请
    SURFACE MOUNTABLE, TOROID MAGNETIC DEVICE 有权
    表面安装，电极磁性装置

    公开(公告)号：US20160118176A1

    公开(公告)日：2016-04-28

    申请号：US14852094

    申请日：2015-09-11

    Applicant: ROLLS-ROYCE CONTROLS AND DATA SERVICES LIMITED

    Inventor： David BROOKES

    IPC: H01F27/22 ,  H01F27/24

    CPC classification number: H01F27/22 ,  H01F27/06 ,  H01F27/24 ,  H01F27/2895 ,  H01F30/16 ,  H01F2027/065 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10568 ,  H05K2201/2045

    Abstract: A surface mountable, toroid magnetic device is provided, the device having a potting filling the central hole of the toroid. The potting extends axially beyond the base of the toroid to form a contact surface which, in use, contacts a mounting body for the device. Heat generated by the device flows by conduction through walls of the toroid defining the central hole into the potting and thence through the contact surface into the mounting body.

    Abstract translation: 提供了可表面安装的环形磁性装置，该装置具有填充环形磁芯的中心孔的灌封装置。 该灌封器轴向延伸超过环形线圈的基部，以形成在使用中接触该装置的安装体的接触表面。 由装置产生的热量通过导电通过限定中心孔的环形面的壁传导到灌封中，从而通过接触表面流入安装体。

    Multilayer ceramic capacitor and board having the same mounted thereon
    18.
    发明授权
    Multilayer ceramic capacitor and board having the same mounted thereon 有权
    多层陶瓷电容器及其上安装的电路板

    公开(公告)号：US09326381B2

    公开(公告)日：2016-04-26

    申请号：US14259011

    申请日：2014-04-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Byoung Hwa Lee ,  Heung Kil Park ,  Kyo Kwang Lee ,  Young Ghyu Ahn ,  Sang Soo Park ,  Soon Ju Lee

    IPC: H01G4/30 ,  H05K1/11 ,  H01G4/232 ,  H05K3/34 ,  H01G4/12

    CPC classification number: H05K1/111 ,  H01G4/12 ,  H01G4/1209 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3442 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611

    Abstract: A multilayer ceramic capacitor may include: a ceramic body including dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; an active layer configured to form capacitance by including first and second internal electrodes facing each other with one dielectric layer therebetween and alternately exposed to the first or second side surface; upper and lower cover layers disposed on and below the active layer; and a first external electrode disposed on the first side surface and a second external electrode disposed on the second side surface. Thickness T and width W of the ceramic body satisfy 0.75W≦T≦1.25W, gap G between the first and second external electrodes satisfies 30 μm≦G≦0.9W, and an average number of dielectric grains in a single dielectric layer in a thickness direction thereof is 2 or greater.

    Abstract translation: 多层陶瓷电容器可以包括：陶瓷体，其包括电介质层，并且具有彼此相对的第一和第二主表面，彼此相对的第一和第二侧表面以及彼此相对的第一和第二端面; 有源层，被配置为通过包括彼此面对的第一和第二内部电极并且在其间具有一个介电层并交替地暴露于第一或第二侧表面而形成电容; 设置在有源层上和下面的上和下覆盖层; 以及设置在第一侧表面上的第一外部电极和设置在第二侧表面上的第二外部电极。 陶瓷体的厚度T和宽度W满足0.75W＆nlE; T＆nlE; 1.25W，第一和第二外部电极之间的间隙G满足30μm＆lt; NlE; G＆nlE; 0.9W，以及单个介电层中的平均电介质颗粒数 厚度方向为2以上。

    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME
    19.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME 有权
    多层陶瓷电容器及具有相同功能的板

    公开(公告)号：US20160086734A1

    公开(公告)日：2016-03-24

    申请号：US14663426

    申请日：2015-03-19

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Kil PARK ,  Sang Soo PARK

    IPC: H01G4/30 ,  H01G2/06 ,  H05K1/18 ,  H01G4/008

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/0085 ,  H01G4/1227 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10946 ,  H05K2201/2045 ,  Y02P70/613

    Abstract: A multilayer ceramic capacitor and a board having the same are provided. The multilayer ceramic capacitor includes a ceramic body including internal electrodes and having lead-out portions exposed to end surfaces thereof, and external electrodes disposed on portions of the end surfaces of the ceramic body to be connected to the lead-out portions of the internal electrodes, terminal electrodes coupled to both end portions of the ceramic body and including horizontal portions disposed below the ceramic body and vertical portions spaced apart from the end surfaces of the ceramic body and connected to the external electrodes.

    Abstract translation: 提供了一种多层陶瓷电容器和具有该多层陶瓷电容器的电路板。 多层陶瓷电容器包括陶瓷体，该陶瓷体包括内部电极并且具有暴露于其端面的引出部分，以及设置在陶瓷体端部的与内部电极的引出部分连接的部分上的外部电极 ，连接到陶瓷体的两端部的端子电极，并且包括设置在陶瓷体下方的水平部分和与陶瓷体的端面间隔开并连接到外部电极的垂直部分。

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