PAINTING SYSTEM AND METHOD OF PAINTING

    公开(公告)号:US20220008947A1

    公开(公告)日:2022-01-13

    申请号:US17368191

    申请日:2021-07-06

    Abstract: A painting system includes painting unit including a first painting robot and a second painting robot, a cartridge carrier, and a cleaning tank. The painting robots each include a robot arm including a painting machine. The cartridge carrier includes a cartridge grip part. A first region is a region where a movable region of the painting machine of the first painting robot overlaps with a movable region of the cartridge grip part. A second region is a region where the movable region of the painting machine of the second painting robot overlaps with the movable region of the cartridge grip part. The cleaning tank is provided in a position including at least a part of the first region and at least a part of the second region.

    ELECTROSTATIC COATING APPARATUS
    14.
    发明申请

    公开(公告)号:US20210283641A1

    公开(公告)日:2021-09-16

    申请号:US17222046

    申请日:2021-04-05

    Applicant: ABB Schweiz AG

    Abstract: Disclosed is an electrostatic coating apparatus comprising: an atomizing head cleaning flow path (13) which is disposed at a coating machine (3) and through which a cleaning fluid for cleaning a rotary atomizing head (6) and a front end of a feed tube (8C) of a cartridge (8) flows; a cleaning fluid flow path (14) connecting a cleaning fluid supply source (15) with the atomizing head cleaning flow path (13); a cleaning fluid valve (16) disposed in the cleaning fluid flow path (14) and configured to open and close the cleaning fluid flow path (14); a discharge air flow path (17) connected to the atomizing head cleaning flow path (13) and through which the discharge air flows; a cleaning fluid discharge flow path (20) connected to the cleaning fluid flow path (14) at a connection point (D) located between the atomizing head cleaning flow path (13) and the cleaning fluid valve (16); a discharge air switching valve (21) disposed in the atomizing head cleaning flow path (13) and configured to open and close the atomizing head cleaning flow path (13); and a cleaning fluid discharge valve (22) disposed in the cleaning fluid discharge flow path (20) and configured to open and close the cleaning fluid discharge flow path (20).

    DEPOSITION OF PARTICLES AT DESIRED LOCATIONS USING PLASMONIC ENHANCEMENT

    公开(公告)号:US20190184413A1

    公开(公告)日:2019-06-20

    申请号:US15846257

    申请日:2017-12-19

    Abstract: Plasmonically enhanced electric fields are used to deposit particles at selected locations through decomposition or electron transfer reactions with precursor molecules in gas or liquid phase. The location of the enhanced electric fields is controlled through a combination of plasmonic substrate structure shape, material, incident light wavelength and polarization. The particles are deposited at designated locations only, whereby no deposition occurs at locations lacking enhanced electric fields. Many reaction variables can be used to change the rate of particle deposition such as precursor molecules, exposure time, precursor concentration, and temperature making for a highly customizable reaction space.

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