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公开(公告)号:US12249482B2
公开(公告)日:2025-03-11
申请号:US17873532
申请日:2022-07-26
Applicant: FEI Company
Inventor: Thomas Gary Miller , Jason Arjavac , Brian Routh, Jr. , Mark Biedrzycki
IPC: H01J37/30 , H01J37/147 , H01J37/28 , H01J37/305
Abstract: Methods and apparatus are disclosed for integration of image-based metrology into a milling workflow. A first ion beam milling operation is performed to an edge at a distance from a final target position on a sample. An SEM image of the sample is used to determine a distance between the milled edge and a reference structure on the sample. Based on the determined distance, the ion beam is adjusted to perform a second milling operation to shift the milled edge to the final target position. Extensions to iterative procedures are disclosed. Various geometric configurations and corrections are disclosed. Manufacturing and analytic applications are disclosed in a variety of fields, including read-write head manufacture and TEM sample preparation. Other combinations of imaging and milling tools can be used.
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公开(公告)号:US12249478B2
公开(公告)日:2025-03-11
申请号:US17546952
申请日:2021-12-09
Applicant: Carl Zeiss MultiSEM GmbH
Inventor: Hans Fritz , András G. Major , Dirk Zeidler , Arne Thoma , Joerg Jacobi
IPC: H01J37/147 , H01J37/09 , H01J37/28
Abstract: A particle beam system includes a multi-beam particle source and a magnetic multi-deflector array. The magnetic multi-deflector array includes a coil that is arranged such that, during use of the particle beam system, a multiplicity of individual particle beams substantially passes through the first coil so that they are deflected in an azimuthal direction to correct an azimuthal telecentricity error of the particle beam system so that the individual particle beams telecentrically impinge on an object plane of the particle beam system.
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公开(公告)号:US20250076038A1
公开(公告)日:2025-03-06
申请号:US18458929
申请日:2023-08-30
Applicant: FEI Company
Inventor: Stefano Vespucci , Wouter René J. Van den Broek
IPC: G01B15/06 , H01J37/244 , H01J37/26 , H01J37/28
Abstract: In some embodiments, a scientific instrument includes an electron-beam column configured to scan an electron beam across a sample and a segmented electron detector configured to receive diffracted beams produced by diffraction of the electron beam in the sample. The segmented electron detector has a plurality of segments arranged in a two-dimensional array, with each of the segments being configured to generate a respective output signal representing a respective integrated flux of electrons received thereat. The scientific instrument also includes an electronic controller configured to receive a set of frames from the segmented electron detector, each of the frames representing a respective set of output signals generated by the segments in response to an electron diffraction pattern projected onto the segmented electron detector, and further configured to communicate with a computing device programmed to generate a strain map of the sample based on the set of frames.
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公开(公告)号:US12243711B2
公开(公告)日:2025-03-04
申请号:US17855888
申请日:2022-07-01
Applicant: Hitachi High-Tech Corporation
Inventor: Takahiro Nishihata , Yuji Takagi , Takuma Yamamoto , Yasunori Goto , Yasutaka Toyoda
IPC: H01J37/22 , G01N23/2251 , H01J37/28
Abstract: A method, an apparatus, and a program for more appropriately determining a condition for appropriately recognizing a semiconductor pattern are provided. A method for determining a condition related to a captured image of a charged particle beam apparatus including: acquiring, by a processor, a plurality of captured images, each of the captured images being an image generated by irradiating a pattern formed on a wafer with a charged particle beam, and detecting electrons emitted from the pattern, each of the captured images being an image captured according to one or more imaging conditions, the method further including: acquiring teaching information for each of the captured images; acquiring, by the processor, one or more feature determination conditions; calculating, by the processor, a feature for each of the captured images based on each of the feature determination conditions, at least one of the imaging condition and the feature determination condition being plural.
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公开(公告)号:US20250069843A1
公开(公告)日:2025-02-27
申请号:US18943131
申请日:2024-11-11
Applicant: Fractilia, LLC
Inventor: Chris Mack , Jonathan Yannuzzi
IPC: H01J37/22 , G01Q30/02 , G01Q30/06 , G06T5/70 , G06T7/13 , G06T7/40 , G06T7/42 , G06T7/49 , H01J37/28
Abstract: Methods, systems, and computer-readable mediums for configuring a lithography tool to manufacture a semiconductor device. The method includes selecting a first variable, selecting a second variable, selecting at least one response variable that is a function of the first variable and second variable, determining a measurement uncertainty for each response variable, determining, based on a measurement of the response variable, and the measurement uncertainty for the response variable, a plurality of probabilities representing a plurality of indications of whether a plurality of points associated with a lithography process meet a specification requirement for each response variable, wherein the plurality of probabilities represent a process window, and configuring, based on the process window, a lithography tool to manufacture a semiconductor device.
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公开(公告)号:US12230469B2
公开(公告)日:2025-02-18
申请号:US17566518
申请日:2021-12-30
Applicant: ASML NETHERLANDS B.V.
Inventor: Albertus Victor Gerardus Mangnus , Maikel Robert Goosen
IPC: H01J37/153 , H01J37/28
Abstract: Disclosed among other aspects is a charged particle inspection system including a phaseplate configured and arranged to modify the local phase of charged particles in a beam to reduce the effects of lens aberrations. The phaseplate is made up of an array of apertures with the voltage and/or a degree of obscuration of the apertures being controlled individually or in groups.
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公开(公告)号:US12217927B2
公开(公告)日:2025-02-04
申请号:US17633556
申请日:2020-08-04
Applicant: ASML NETHERLANDS B.V.
Inventor: Jian Zhang , Ning Ye , Zhiwen Kang , Yixiang Wang
Abstract: A system and a method for manipulating a beam of an Advanced Charge Controller module in different planes in an e-beam system are provided. Some embodiments of the system include a lens system configured to manipulate a beam in the tangential plane and the sagittal plane such that the beam spot is projected onto the wafer with high luminous energy. Some embodiments of the system include a lens system comprising at least two cylindrical lens.
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公开(公告)号:US20250037966A1
公开(公告)日:2025-01-30
申请号:US18910626
申请日:2024-10-09
Applicant: ASML Netherlands B.V.
Inventor: Jinmei YANG , Jian ZHANG , Zhiwen KANG , Yixiang WANG
IPC: H01J37/28 , G01N23/2251 , H01J37/26
Abstract: A sensor may be used to measure a degree of tilt of a sample. The sensor may include an apparatus having a light source, first, second, and third optical elements, a lens, and an aperture. The first optical element may supply light from the light source toward the sample, and may supply light input into the first optical element from the sample toward the second optical element. The second optical element may supply light toward first and second sensing elements. An aperture may be arranged on a focal plane of the lens. A light beam incident on the first sensing element may be a reference beam.
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公开(公告)号:US12196692B2
公开(公告)日:2025-01-14
申请号:US17769690
申请日:2020-09-30
Applicant: ASML NETHERLANDS B.V.
Inventor: Weiming Ren , Xuedong Liu , Zhong-wei Chen , Xiaoyu Ji , Xiaoxue Chen , Weimin Zhou , Frank Nan Zhang
IPC: G01N23/2202 , G01N1/44 , G01N23/2251 , H01J37/02 , H01J37/244 , H01J37/28
Abstract: Systems and methods of providing a probe spot in multiple modes of operation of a charged-particle beam apparatus are disclosed. The method may comprise activating a charged-particle source to generate a primary charged-particle beam and selecting between a first mode and a second mode of operation of the charged-particle beam apparatus. In the flooding mode, the condenser lens may focus at least a first portion of the primary charged-particle beam passing through an aperture of the aperture plate to form a second portion of the primary charged-particle beam, and substantially all of the second portion is used to flood a surface of a sample. In the inspection mode, the condenser lens may focus a first portion of the primary charged-particle beam such that the aperture of the aperture plate blocks off peripheral charged-particles to form the second portion of the primary charged-particle beam used to inspect the sample surface.
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公开(公告)号:US20250014859A1
公开(公告)日:2025-01-09
申请号:US18687252
申请日:2021-09-01
Applicant: HITACHI HIGH-TECH SCIENCE CORPORATION
Inventor: Ayana MURAKI , Tatsuya ASAHATA , Satoshi TOMIMATSU , Makoto SATO
IPC: H01J37/302 , H01J37/28
Abstract: The present invention provides a computer, a program, and a charged particle beam processing system, with which it is possible to reduce adjustment and setting work of conditions for observation or machining by an operator in an FIB-SEM composite device. This computer comprises: an information acquisition unit that acquires information related to a recipe to be executed by a charged particle beam device provided with a charged particle irradiation optical system; and an information management unit that generates recipe management information based on the information acquired by the information acquisition unit and stores the recipe management information in a storage unit.
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