公开(公告)号：US20110284272A1

公开(公告)日：2011-11-24

申请号：US13197912

申请日：2011-08-04

Applicant: MING-CHUN CHENG

Inventor： MING-CHUN CHENG

IPC: H05K7/20

CPC classification number: H05K1/0201 ,  H05K1/0209 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0373 ,  H05K2201/09781 ,  H05K2203/043

Abstract: A printed circuit board includes an insulated base sheet, a heat-conducting layer, an insulated layer, a plurality of heat-conducting blocks, and a plurality of bonding pads. The heat-conducting layer is disposed on the insulated base sheet. The insulated layer is partially coated on the heat-conducting layer, leaving a plurality of exposed zones remaining thereon. The heat-conducting blocks are correspondingly formed on the exposed zones. The bonding pads are positioned on the heat-conducting layer for soldering circuit elements.

Abstract translation: 印刷电路板包括绝缘基片，导热层，绝缘层，多个导热块和多个接合焊盘。 导热层设置在绝缘基片上。 绝缘层部分涂覆在导热层上，留下多个暴露区域。 导热块相应地形成在暴露的区域上。 接合焊盘位于导热层上，用于焊接电路元件。

公开(公告)号：US08058566B2

公开(公告)日：2011-11-15

申请号：US12163579

申请日：2008-06-27

Applicant: Shih-Ping Hsu

Inventor： Shih-Ping Hsu

IPC: H05K1/00 ,  H05K3/42

CPC classification number: H05K1/116 ,  H05K3/421 ,  H05K3/423 ,  H05K3/465 ,  H05K2201/0373 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  Y10T29/49165

Abstract: A packaging substrate structure includes a dielectric layer with a plurality of dielectric pillars disposed on a portion of a large-dimension opening area of the dielectric layer; and a first circuit layer with a plurality of first circuits disposed on a portion of the dielectric layer, and a conductive block disposed in the large-dimension opening area of the dielectric layer having the dielectric pillars. The dielectric pillars reduce the difference of the electrical current density distribution between the large-dimension opening area and small-dimension opening areas during electroplating, thereby overcoming the conventional drawback of insufficient thickness or a hollow center of the conductive block that results in an uneven thickness of the circuit layer. The invention further provides a method of manufacturing the packaging substrate structure.

Abstract translation: 封装基板结构包括具有设置在电介质层的大尺寸开口区域的一部分上的多个介电柱的电介质层; 以及第一电路层，其具有布置在电介质层的一部分上的多个第一电路，以及布置在具有介电柱的电介质层的大尺寸开口区域中的导电块。 电介质柱减小电镀期间大尺寸开口面积与小尺寸开口面积之间的电流密度分布差异，从而克服导电块厚度不足或中空中心的常规缺点，这导致厚度不均匀 的电路层。 本发明还提供一种制造包装衬底结构的方法。

公开(公告)号：US08044501B2

公开(公告)日：2011-10-25

申请号：US12051982

申请日：2008-03-20

Applicant: Hideyuki Ebine

Inventor： Hideyuki Ebine

IPC: H01L23/48

CPC classification number: G02F1/13452 ,  H05K1/111 ,  H05K3/244 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0373

Abstract: A contact that takes a structure to laminate a protective conductive film over a metal film has a high hardness of the protective conductive film; therefore, a damage of contact surface made by contacting with an electrode of an inspection apparatus can be prevented in an inspection before boding FPC. However, the protective conductive film has higher resistivity compared to the metal film; therefore, contact resistivity with FPC gets higher, and power consumption gets bigger in the condition of using the display device. The present invention provides a contact structure, wherein a structure of FPC contact is formed of a layered film of the metal film and the protective conductive film, and a conductive particle included in an anisotropic conductive film is formed of the protective conductive film in a slit shape having a space wider than a width necessary for an electrical connection with the metal film and a space narrower than a width of an electrode of an inspection apparatus and can be electrically connected with the FPC in both of the protective conductive film and the metal film, and a display device having the contact structure.

Abstract translation: 在金属膜上层叠保护性导电膜的结构的接触具有高硬度的保护性导电膜; 因此，在对FPC进行FPC检查之前，可以防止与检查装置的电极接触而形成的接触面的损伤。 然而，与金属膜相比，保护性导电膜具有更高的电阻率; 因此，在使用显示装置的情况下，与FPC的接触电阻率变高，功耗变大。 本发明提供一种接触结构，其中FPC接触的结构由金属膜和保护性导电膜的层状膜形成，并且各向异性导电膜中包括的导电颗粒由狭缝中的保护性导电膜形成 形状具有比与金属膜的电连接所需的宽度宽的空间和比检查装置的电极的宽度窄的空间，并且可以与FPC在保护导电膜和金属膜两者中电连接 以及具有接触结构的显示装置。

公开(公告)号：US07968803B2

公开(公告)日：2011-06-28

申请号：US11658877

申请日：2006-07-07

Applicant: Hideki Higashitani

Inventor： Hideki Higashitani

IPC: H05K1/11

CPC classification number: H05K3/4069 ,  H05K3/0032 ,  H05K3/06 ,  H05K3/384 ,  H05K3/4614 ,  H05K3/465 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0373 ,  H05K2201/09827 ,  H05K2203/025 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/1461 ,  Y10T29/49124

Abstract: A wiring substrate of the invention comprises an electrical insulation substrate (1), a through-hole (3) formed in the electrical insulation substrate, electrically conductive paste (4) filled inside the through-hole, and wiring traces (11) formed on one or both surfaces of the electrical insulation substrate and electrically connected with the electrically conductive paste, wherein interfaces of the wiring traces in contact with the electrically conductive paste have at least one of an asperate surface and a smooth surface, and a plurality of granular bumps (14) formed further thereon.

Abstract translation: 本发明的布线基板包括电绝缘基板（1），形成在电绝缘基板中的通孔（3），填充在通孔内部的导电浆料（4）和形成在通孔 电绝缘基板的一个或两个表面并与导电浆料电连接，其中与导电浆料接触的布线迹线的界面具有平坦表面和光滑表面中的至少一个，以及多个颗粒凸块 （14）。

公开(公告)号：US07914296B1

公开(公告)日：2011-03-29

申请号：US12652685

申请日：2010-01-05

Applicant: Robert P. Howell

Inventor： Robert P. Howell

IPC: H01R12/00

CPC classification number: H01R12/62 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06738 ,  G01R1/07378 ,  H01L24/72 ,  H01L2924/01033 ,  H01L2924/14 ,  H05K3/4092 ,  H05K2201/0221 ,  H05K2201/0373 ,  H05K2201/10378 ,  H05K2203/068

Abstract: The invention provides an interconnecting assembly including a main structure having first and second portions, an inner terminal on the main structure, a support film having first and second portions, an inner contact and outer terminal formed on opposing sides of the support film, a conductive lever portion on the support film and connecting the inner contact and outer terminal, wherein the inner contact contacts the inner terminal and the first portions are moved relatively towards one another so that the second portion of the film is pivoted together with the conductive lever portion and the outer terminal away from the second portion of the main structure, the outer terminal being depressible towards the main structure from a first position to a second position and returning to the first position when a force depressing the outer terminal is removed.

Abstract translation: 本发明提供了一种互连组件，其包括具有第一和第二部分的主结构，主结构上的内部端子，具有第一和第二部分的支撑膜，形成在支撑膜的相对侧上的内部触点和外部端子，导电 杠杆部分在支撑膜上并且连接内接触件和外端子，其中内触头接触内端子，并且第一部分相对于彼此移动，使得膜的第二部分与导电杆部分一起枢转，并且 所述外端子远离所述主结构的第二部分，所述外端子从所述第一位置向第二位置朝向所述主结构压下，并且当去除所述外端子的力时返回到所述第一位置。

公开(公告)号：US20110053319A1

公开(公告)日：2011-03-03

申请号：US12850374

申请日：2010-08-04

Applicant: Olaf Hohlfeld ,  Jens Goerlich ,  Reinhold Bayerer

Inventor： Olaf Hohlfeld ,  Jens Goerlich ,  Reinhold Bayerer

IPC: H01L21/58

CPC classification number: H01L23/3735 ,  H01L23/24 ,  H01L23/49811 ,  H01L24/28 ,  H01L24/29 ,  H01L24/39 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/8584 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/12043 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/2076 ,  H05K1/0203 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/0373 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/37099

Abstract: A power semiconductor module is fabricated by providing a circuit substrate with a metal surface and an insulating substrate comprising an insulation carrier featuring a bottom side provided with a bottom metallization layer. An anchoring structure is provided comprising a plurality of oblong pillars each featuring a first end facing away from the insulation carrier, at least a subset of the pillars being distributed over the anchoring structure in its entirety, it applying for each of the pillars of the subset that from a sidewall thereof no or a maximum of three elongated bonding webs each extend to a sidewall of another pillar where they are bonded thereto. The anchoring structure is positioned between the insulation carrier and metal surface, after which the metal surface is soldered to the bottom metallization layer and anchoring structure by means of a solder packing all interstices between the metal surface and bottom metallization layer with the solder.

Abstract translation: 通过为电路基板提供金属表面和绝缘基板来制造功率半导体模块，所述绝缘基板包括具有设置有底部金属化层的底侧的绝缘载体。 提供了一种锚固结构，其包括多个长方形支柱，每个长方形支柱具有背离绝缘载体的第一端，所述支柱的至少一部分整体分布在锚固结构上，它应用于子集的每个柱 从其侧壁没有或最多三个细长的粘合幅材每个延伸到另一个柱的侧壁，在其另一个柱的侧壁上。 锚固结构位于绝缘载体和金属表面之间，之后通过焊料将金属表面焊接到底部金属化层和锚定结构，所述金属表面与金属表面和底部金属化层之间的所有间隙都与焊料焊接。

公开(公告)号：US20110048782A1

公开(公告)日：2011-03-03

申请号：US12547495

申请日：2009-08-26

Applicant: Jun-Chung Hsu

Inventor： Jun-Chung Hsu

IPC: H05K1/11 ,  B44C1/22

CPC classification number: H05K1/111 ,  H01L2224/05557 ,  H05K3/062 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/0338 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09745 ,  H05K2201/099 ,  H05K2203/1184 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49156

Abstract: A solder pad structure with a high bondability to a solder ball is provided. The present invention provides a larger contact area with the solder ball so as to increase the bondability according to the principle that the bondability is positive proportional with the contact area therebetween. The solder pad structure includes a circuit board having a solder pad opening defined by a solder resist layer surrounding a circuit layer. The circuit layer within the solder pad opening is defined as a solder pad. In such a way, after filling the solder ball into the solder pad opening, besides walls of the solder pad opening, there are an extra contact area provided by a geometric shape of the solder pad for further improving the bondability of the solder pad and the solder ball.

Abstract translation: 提供了与焊球具有高粘合性的焊盘结构。 本发明提供了一种与焊球相比较大的接触面积，以便根据粘合性与它们之间的接触面积成正比的原理提高粘接性。 焊盘结构包括具有由围绕电路层的阻焊层限定的焊盘开口的电路板。 焊盘开口内的电路层被定义为焊盘。 以这种方式，在将焊球填充到焊盘开口中之后，除了焊盘开口的壁之外，还存在由焊料焊盘的几何形状提供的额外的接触面积，用于进一步提高焊盘和焊盘的焊接性 焊球

公开(公告)号：US20100327443A1

公开(公告)日：2010-12-30

申请号：US12918326

申请日：2009-02-19

Applicant: Sung-Wook Kim

Inventor： Sung-Wook Kim

IPC: H01L23/488 ,  H01L21/71

CPC classification number: H01L21/50 ,  H01L23/10 ,  H01L24/83 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K2201/0373

Abstract: The present invention concerns a joining structure and a substrate-joining method using the same. The joining structure comprises a substrate, and comprises a plurality of joining patterns which are located on the said substrate and which are spaced apart from each other. The substrate-joining method using the joining structure can comprise: a stage involving the formation of a plurality of joining patterns which are spaced apart from each other on a first substrate; and a stage of joining a second substrate on the plurality of joining patterns. When the said joining structure is employed, it is possible to reduce or prevent damage due to spreading of the joining substance during joining of the two substrates.

Abstract translation: 本发明涉及使用该结构的接合结构和基板接合方法。 接合结构包括基板，并且包括位于所述基板上并且彼此间隔开的多个接合图案。 使用接合结构的基板接合方法可以包括：在第一基板上形成彼此间隔开的多个接合图案的台阶; 以及在所述多个接合图案上接合第二基板的阶段。 当使用所述接合结构时，可以减少或防止由于在两个基板的接合期间接合物质的扩散而造成的损坏。

公开(公告)号：US07821130B2

公开(公告)日：2010-10-26

申请号：US12059188

申请日：2008-03-31

Applicant: Olaf Hohlfeld ,  Reinhold Bayerer

Inventor： Olaf Hohlfeld ,  Reinhold Bayerer

IPC: H01L23/52 ,  H01L21/44

CPC classification number: B23K35/262 ,  H01L23/049 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/488 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/8384 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12043 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2203/0307 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00015

Abstract: A module includes a metallized substrate including a metal layer, a base plate, and a joint joining the metal layer to the base plate. The joint includes solder contacting the base plate and an inter-metallic zone contacting the metal layer and the solder. The inter-metallic zone has spikes up to 100 μm and a roughness (Rz) of at least 20 μm.

Abstract translation: 模块包括金属化基板，其包括金属层，基板和将金属层连接到基板的接头。 接头包括焊接接触基板和与金属层和焊料接触的金属间区域。 金属间区域的峰值高达100μm，粗糙度（Rz）至少为20μm。

公开(公告)号：US20100085715A1

公开(公告)日：2010-04-08

申请号：US12247150

申请日：2008-10-07

Applicant: Steven M. Scheifers ,  Hope W. Chik ,  Andrew F. Skipor

Inventor： Steven M. Scheifers ,  Hope W. Chik ,  Andrew F. Skipor

IPC: H05K3/22 ,  H05K1/14

CPC classification number: H05K3/321 ,  H01L21/4867 ,  H01L23/498 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/225 ,  H05K3/3463 ,  H05K2201/0257 ,  H05K2201/0373 ,  H05K2201/10628 ,  H05K2203/176 ,  Y10T29/49004 ,  H01L2924/00

Abstract: A manufacturing method and manufacturing system for creating a modular electronic assembly are disclosed. The manufacturing system 300 may position a contact terminal 202 of a printed electronic component module 102 relative to a contact pad 204 of a printed electronic substrate 112. The manufacturing system 300 may connect the contact terminal 202 to the contact pad 204 using a conductive adhesive connection 116.

Abstract translation: 公开了一种用于创建模块化电子组件的制造方法和制造系统。 制造系统300可以相对于印刷电子基板112的接触垫204定位印刷电子部件模块102的接触端子202.制造系统300可以使用导电粘合剂连接将接触端子202连接到接触垫204 116。