公开(公告)号：US07254008B2

公开(公告)日：2007-08-07

申请号：US11089338

申请日：2005-03-25

Applicant: Jun Xie ,  Jason Shih ,  Yu-Chong Tai

Inventor： Jun Xie ,  Jason Shih ,  Yu-Chong Tai

IPC: H01G7/00

CPC classification number: G01N27/226 ,  B81B7/02 ,  B81B2201/0292 ,  B81B2201/058 ,  G01L9/0042 ,  G01L9/0072

Abstract: A microfluidic device and method for capacitive sensing. The device includes a fluid channel including an inlet at a first end and an outlet at a second end, a cavity region coupled to the fluid channel, and a polymer based membrane coupled between the fluid channel and the cavity region. Additionally, the device includes a first capacitor electrode coupled to the membrane, a second capacitor electrode coupled to the cavity region and physically separated from the first capacitor electrode by at least the cavity region, and an electrical power source coupled between the first capacitor electrode and the second capacitor electrode and causing an electric field at least within the cavity region. The polymer based membrane includes a polymer.

Abstract translation: 用于电容感测的微流体装置和方法。 该装置包括流体通道，其包括在第一端处的入口和在第二端处的出口，耦合到流体通道的空腔区域以及耦合在流体通道和腔区域之间的基于聚合物的膜。 另外，该器件包括耦合到膜的第一电容器电极，耦合到空腔区域的第二电容器电极，并且至少通过腔区域与第一电容器电极物理分离;以及电源，耦合在第一电容器电极和 所述第二电容器电极至少在所述腔区域内引起电场。 基于聚合物的膜包括聚合物。

公开(公告)号：US07253488B2

公开(公告)日：2007-08-07

申请号：US11031320

申请日：2005-01-05

Applicant: Changqing Zhan ,  Michael Barrett Wolfson ,  John W. Hartzell

Inventor： Changqing Zhan ,  Michael Barrett Wolfson ,  John W. Hartzell

IPC: H01L27/14

CPC classification number: B81B3/0021 ,  B81B2201/0292 ,  B81B2203/0118 ,  B81C1/00246 ,  B81C2203/075 ,  C30B1/02 ,  C30B29/00 ,  G01L1/044 ,  G01L9/0042 ,  G01P15/0802 ,  G01P15/124 ,  G01P2015/0828 ,  H01L27/12 ,  H01L29/66757 ,  H04R17/02 ,  H04R31/006

Abstract: A piezo-TFT cantilever microelectromechanical system (MEMS) and associated fabrication processes are provided. The method comprises: providing a substrate, such as glass for example; forming thin-films overlying the substrate; forming a thin-film cantilever beam; and simultaneously forming a TFT within the cantilever beam. The TFT is can be formed least partially overlying a cantilever beam top surface, at least partially overlying a cantilever beam bottom surface, or embedded within the cantilever beam. In one example, forming thin-films on the substrate includes: selectively forming a first layer with a first stress level; selectively forming a first active Si region overlying the first layer; and selectively forming a second layer overlying the first layer with a second stress level. The thin-film cantilever beam is formed from the first and second layers, while the TFT source/drain (S/D) and channel regions are formed from the first active Si region.

Abstract translation: 提供了压电TFT悬臂微机电系统（MEMS）及相关制造工艺。 该方法包括：提供例如玻璃等基板; 形成覆盖衬底的薄膜; 形成薄膜悬臂梁; 并且同时在悬臂梁内形成TFT。 TFT可以形成为最少部分地覆盖在悬臂梁顶表面上，至少部分地覆盖悬臂梁底表面或嵌入在悬臂梁内。 在一个示例中，在衬底上形成薄膜包括：选择性地形成具有第一应力水平的第一层; 选择性地形成覆盖在第一层上的第一有源Si区; 以及以第二应力水平选择性地形成覆盖所述第一层的第二层。 薄膜悬臂梁由第一和第二层形成，而TFT源极/漏极（S / D）和沟道区域由第一有源Si区形成。

公开(公告)号：US07239219B2

公开(公告)日：2007-07-03

申请号：US10607931

申请日：2003-06-27

Applicant: Elliott R. Brown ,  John D. Evans ,  Christopher A. Bang ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley ,  Morton Grosser

Inventor： Elliott R. Brown ,  John D. Evans ,  Christopher A. Bang ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley ,  Morton Grosser

IPC: H01P9/00 ,  H01P3/00 ,  H01P3/06

CPC classification number: B81C1/00126 ,  B33Y70/00 ,  B33Y80/00 ,  B81B2201/0292 ,  B81C2201/0109 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H01P11/007 ,  H01Q3/40 ,  H01Q21/0006 ,  H01Q21/065 ,  H05K3/4647

Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).

Abstract translation: 提供RF和微波辐射引导或控制部件，其可以是单片的，其可以由多个电沉积操作和/或从多个沉积的材料层形成，其可以包括开关，电感器，天线，传输线，滤波器 ，混合耦合器，天线阵列和/或其他主动或无源部件。 部件可以包括用于将牺牲材料与结构材料分离的非辐射入口和非辐射出口通道。 优选的形成方法使用电化学制造技术（例如包括选择性沉积，体积沉积，蚀刻操作和平坦化操作）和后沉积工艺（例如选择性蚀刻操作和/或反向填充操作）。

公开(公告)号：US20070138581A1

公开(公告)日：2007-06-21

申请号：US10588838

申请日：2004-12-20

Applicant: Hans-Peter Baer ,  Araim Hoechst

Inventor： Hans-Peter Baer ,  Araim Hoechst

IPC: H01L29/82

CPC classification number: B81C1/00182 ,  B81B2201/0292 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/0353 ,  B81C2201/0178

Abstract: A micromechanical sensor and a method for manufacturing same are described. A secure diaphragm restraint, independent of fluctuations in the cavern etching process due to the process technology, and a free design of the diaphragm are made possible by designing a suitable connection of the diaphragm in an oxide layer created by local oxidation. The micromechanical sensor includes, for example, a substrate, an external oxide layer formed in a laterally external area in the substrate, a diaphragm having multiple perforation holes formed in a laterally internal diaphragm area, a cavern etched in the substrate beneath the diaphragm, whereby the diaphragm is suspended in a suspension area of the external oxide layer which tapers toward connecting points of the diaphragm and the diaphragm is situated in its vertical height between a top side and a bottom side of the external oxide layer.

Abstract translation: 描述了一种微机械传感器及其制造方法。 通过设计通过局部氧化产生的氧化物层中的隔膜的适当连接，可以实现由于工艺技术而独立于洞穴蚀刻工艺的波动和隔膜的自由设计的安全膜片约束。 微机械传感器包括例如基板，形成在基板的横向外部区域中的外部氧化物层，具有形成在横向内部隔膜区域中的多个穿孔的隔膜，在隔膜下方的基板中蚀刻的基底，由此 隔膜悬挂在外部氧化物层的悬垂区域中，该外部氧化物层朝向隔膜的连接点逐渐变细，并且隔膜位于外部氧化物层的顶侧和底侧之间的垂直高度。

公开(公告)号：US07213465B2

公开(公告)日：2007-05-08

申请号：US10958014

申请日：2004-10-04

Applicant: Hubert Benzel ,  Frank Schaefer ,  Christoph Schelling

Inventor： Hubert Benzel ,  Frank Schaefer ,  Christoph Schelling

IPC: G01F9/00

CPC classification number: B81C1/00246 ,  B81B2201/0292 ,  B81C2203/0778 ,  G01K7/015 ,  G01L9/0054 ,  G01L19/147 ,  G01P1/023 ,  G01P15/08 ,  G01P15/0802 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73257 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A micromechanical sensor, and a method for manufacturing a micromechanical sensor, featuring, in addition to a sensor element, at least a part of an evaluation circuit. In this context, the micromechanical sensor contains at least a first structural element made of a first material. The first structural element houses at least one sensor region and a part of an evaluation circuit, at least one sensor element being located in the sensor region. Moreover, at least one first and one second side are to be distinguished from one another in the first structural element. The first side of the first structural element features at least the sensor element, while the second side of the first structural element features at least a part of the evaluation circuit. At least parts of the sensor region and/or of the evaluation circuit are formed from the first material by micromechanical processing.

Abstract translation: 微机械传感器和微机械传感器的制造方法，除传感器元件之外，还具有评估电路的至少一部分。 在本文中，微机械传感器至少包含由第一材料制成的第一结构元件。 第一结构元件容纳至少一个传感器区域和评估电路的一部分，至少一个传感器元件位于传感器区域中。 此外，在第一结构元件中至少一个第一和第二侧面将彼此区分开。 第一结构元件的第一侧至少具有传感器元件，而第一结构元件的第二侧具有评估电路的至少一部分。 传感器区域和/或评估电路的至少一部分通过微机械处理由第一材料形成。

公开(公告)号：US07126255B2

公开(公告)日：2006-10-24

申请号：US11089113

申请日：2005-03-24

Applicant: Hirofumi Yamaguchi ,  Takatoshi Nehagi ,  Kunihiko Yoshioka

Inventor： Hirofumi Yamaguchi ,  Takatoshi Nehagi ,  Kunihiko Yoshioka

IPC: H01L41/047

CPC classification number: B81B3/0086 ,  B81B2201/0292 ,  G01N9/002 ,  G01N9/36 ,  G01N11/16 ,  H01L41/0973

Abstract: A piezoelectric/electrostrictive film-type device is provided which includes a ceramic substrate having a thin diaphragm portion and a peripheral thick portion, a lower electrode, an auxiliary electrode, a piezoelectric/electrostrictive film, and an upper electrode. The lower electrode, the auxiliary electrode, the piezoelectric/electrostrictive film, and the upper electrode are layered in that order on the ceramic substrate. The upper electrode has a length of 30 to 70% relative to the length of the thin diaphragm portion, and preferably has a width of 70% or more relative to the width of the thin diaphragm portion.

Abstract translation: 提供一种压电/电致伸缩膜型器件，其包括具有薄膜部分和外围厚部分的陶瓷基底，下电极，辅助电极，压电/电致伸缩膜和上电极。 在陶瓷基板上依次层叠下电极，辅助电极，压电/电致伸缩膜和上电极。 上电极相对于薄膜部分的长度具有30至70％的长度，并且优选地具有相对于薄膜部分的宽度为70％或更大的宽度。

公开(公告)号：US20050252293A1

公开(公告)日：2005-11-17

申请号：US11029006

申请日：2005-01-05

Applicant: Jong-hwa Won ,  Hyung Choi ,  Kwon Kim ,  Oh-myoung Kwon

Inventor： Jong-hwa Won ,  Hyung Choi ,  Kwon Kim ,  Oh-myoung Kwon

IPC: G01P3/44 ,  B81B3/00 ,  B81B5/00 ,  B81B7/02 ,  F16C39/06 ,  G01B7/00 ,  G01B7/30 ,  G01C5/00 ,  G01C19/06 ,  G01C19/16 ,  G01C19/42 ,  G01C19/56 ,  G01D5/245 ,  G01D11/02 ,  G01L1/12 ,  G01P3/486 ,  G01P3/488 ,  G01P15/08 ,  G01P15/125 ,  G01V7/00 ,  H02N15/00 ,  H02K7/09 ,  H02N10/00

CPC classification number: G01P15/0802 ,  B81B3/0021 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2201/0292 ,  G01P3/486 ,  G01P3/488 ,  G01P15/08 ,  G01P15/125

Abstract: A microelectromechanical system (MEMS) sensor and method for measuring the motion of an intermediate member and a method for making the MEMS sensor. The MEMS sensor includes a substrate, a lower magnetic member disposed on the substrate, a layer disposed over the substrate, an upper magnetic member disposed at a side of the layer facing the lower magnetic member, an intermediate magnetic member magnetically levitated between the lower magnetic member and upper magnetic member; and a component measuring at least one of motion, forces acting on, and a displacement of the intermediate magnetic member.

Abstract translation: 一种微机电系统（MEMS）传感器和用于测量中间构件的运动的方法和用于制造MEMS传感器的方法。 MEMS传感器包括基板，设置在基板上的下磁性部件，设置在基板上的层，设置在面向下磁性部件的一侧的上部磁性部件，磁性悬浮在下部磁性体 构件和上磁性构件; 以及测量作用于中间磁性构件的运动，作用力和位移之中的至少一个的部件。

公开(公告)号：US20050243500A1

公开(公告)日：2005-11-03

申请号：US11089338

申请日：2005-03-25

Applicant: Jun Xie ,  Jason Shih ,  Yu-Chong Tai

Inventor： Jun Xie ,  Jason Shih ,  Yu-Chong Tai

IPC: G01N27/22 ,  G01N27/447 ,  H01G9/00

CPC classification number: G01N27/226 ,  B81B7/02 ,  B81B2201/0292 ,  B81B2201/058 ,  G01L9/0042 ,  G01L9/0072

Abstract: A microfluidic device and method for capacitive sensing. The device includes a fluid channel including an inlet at a first end and an outlet at a second end, a cavity region coupled to the fluid channel, and a polymer based membrane coupled between the fluid channel and the cavity region. Additionally, the device includes a first capacitor electrode coupled to the membrane, a second capacitor electrode coupled to the cavity region and physically separated from the first capacitor electrode by at least the cavity region, and an electrical power source coupled between the first capacitor electrode and the second capacitor electrode and causing an electric field at least within the cavity region. The polymer based membrane includes a polymer.

公开(公告)号：US20050115321A1

公开(公告)日：2005-06-02

申请号：US10958014

申请日：2004-10-04

Applicant: Hubert Benzel ,  Frank Schaefer ,  Christoph Schelling

Inventor： Hubert Benzel ,  Frank Schaefer ,  Christoph Schelling

IPC: G01K7/01 ,  G01L9/00 ,  G01P1/02 ,  G01P15/08 ,  G01N25/00 ,  G01N7/00 ,  H01L21/461

CPC classification number: B81C1/00246 ,  B81B2201/0292 ,  B81C2203/0778 ,  G01K7/015 ,  G01L9/0054 ,  G01L19/147 ,  G01P1/023 ,  G01P15/08 ,  G01P15/0802 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73257 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A micromechanical sensor, and a method for manufacturing a micromechanical sensor, featuring, in addition to a sensor element, at least a part of an evaluation circuit. In this context, the micromechanical sensor contains at least a first structural element made of a first material. The first structural element houses at least one sensor region and a part of an evaluation circuit, at least one sensor element being located in the sensor region. Moreover, at least one first and one second side are to be distinguished from one another in the first structural element. The first side of the first structural element features at least the sensor element, while the second side of the first structural element features at least a part of the evaluation circuit. At least parts of the sensor region and/or of the evaluation circuit are formed from the first material by micromechanical processing.

Abstract translation: 微机械传感器和微机械传感器的制造方法，除传感器元件之外，还具有评估电路的至少一部分。 在本文中，微机械传感器至少包含由第一材料制成的第一结构元件。 第一结构元件容纳至少一个传感器区域和评估电路的一部分，至少一个传感器元件位于传感器区域中。 此外，在第一结构元件中至少一个第一和第二侧面将彼此区分开。 第一结构元件的第一侧至少具有传感器元件，而第一结构元件的第二侧具有评估电路的至少一部分。 传感器区域和/或评估电路的至少一部分通过微机械处理由第一材料形成。

公开(公告)号：US06450025B1

公开(公告)日：2002-09-17

申请号：US09499020

申请日：2000-02-04

Applicant: Hiroyuki Wado ,  Yoshinori Otsuka ,  Eishi Kawasaki

Inventor： Hiroyuki Wado ,  Yoshinori Otsuka ,  Eishi Kawasaki

IPC: G01F168

CPC classification number: B81B3/0072 ,  B81B2201/0292 ,  B81C2201/0169 ,  B81C2201/019 ,  G01F1/6845 ,  H05B3/12 ,  H05B3/28 ,  H05B2203/013 ,  H05B2203/017

Abstract: An airflow sensor including a micro-heater having a film structure, which can reduce a warpage of the film structure even when a thick ness of the film structure to improve a mechanical strength thereof. An airflow sensor is provided with a monocrystalline silicon substrate having a hollow portion therein; a thin film heater portion as a micro-heater arranged above the hollow portion; and a temperature sensor. The thin film heater portion has a laminated structure of a lower thin film, a heater layer, and an upper thin film. The lower and the upper thin film respectively have a tensile stress film and a compressive stress film laminated with the tensile stress film, and are symmetry laminated with respect to the heater layer. The tensile stress film is made up of a Si3N4 film having a great moisture-proof characteristic; and the compressive stress film is made up of a SiO2 film having a great adhesion. Since these stress films cancel their internal stress each other, the internal stress can be released, and a warpage moment can be cancelled so that a warpage of the whole film structure can be restricted. Therefore, the mechanical strength can be improved even if the thickness of the film is increased.

Abstract translation: 一种气流传感器，包括具有膜结构的微加热器，即使当膜结构的厚度提高时，也能够减小膜结构的翘曲，从而提高其机械强度。 气流传感器设置有在其中具有中空部分的单晶硅衬底; 作为布置在中空部分上方的微加热器的薄膜加热器部分; 和温度传感器。 薄膜加热器部分具有下薄膜，加热器层和上薄膜的层压结构。 下薄膜和上薄膜分别具有拉伸应力膜和与拉伸应力膜层压的压缩应力膜，并且相对于加热器层对称地层压。 拉伸应力膜由具有良好防潮特性的Si 3 N 4膜构成; 并且压应力膜由具有很大粘附性的SiO 2膜构成。 由于这些应力膜相互抵消其内部应力，因此可以解除内部应力，并且可以消除翘曲力矩，从而可以限制整个膜结构的翘曲。 因此，即使膜的厚度增加，也可以提高机械强度。