中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

713 records (took 0.02 seconds)

    WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
    201.
    发明申请
    WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE 有权
    接线基板和半导体器件

    公开(公告)号：US20140146503A1

    公开(公告)日：2014-05-29

    申请号：US14087350

    申请日：2013-11-22

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Teruaki CHINO

    IPC: H05K1/11

    CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K3/3436 ,  H05K3/3473 ,  H05K2201/0338 ,  H01L2924/00

    Abstract: There is provided a wiring substrate. The wiring substrate includes: a wiring pattern of an outermost layer; a solder resist layer having an opening portion therein, wherein a portion of the wiring pattern is exposed through the opening portion, and the exposed portion of the wiring pattern is defined as a connection pad; and a solder bump on the connection pad. The connection pad includes: a solder layer; and a metal post that is entirely covered by the solder layer, wherein a portion of the solder layer is interposed between the connection pad and the metal post.

    Abstract translation: 提供了布线基板。 布线基板包括：最外层的布线图案; 其中具有开口部分的阻焊层，其中所述布线图案的一部分通过所述开口部露出，并且所述布线图案的所述露出部分被定义为连接垫; 和连接焊盘上的焊料凸块。 连接焊盘包括：焊料层; 以及完全被焊料层覆盖的金属柱，其中焊料层的一部分插入在连接焊盘和金属柱之间。

    Wire bonding joint structure of joint pad, and method for preparing the same
    202.
    发明授权
    Wire bonding joint structure of joint pad, and method for preparing the same 有权
    接头垫的接合接头结构及其制备方法

    公开(公告)号：US08729395B2

    公开(公告)日：2014-05-20

    申请号：US13472281

    申请日：2012-05-15

    Applicant: Dong Jun Lee

    Inventor： Dong Jun Lee

    IPC: H01B5/00 ,  H05K1/03 ,  H05K1/11 ,  H05K7/10 ,  H01R43/04

    CPC classification number: H05K3/244 ,  H01L23/49866 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48455 ,  H01L2224/85444 ,  H01L2924/01029 ,  H05K2201/0338 ,  H05K2203/049 ,  Y10T29/49124 ,  Y10T29/49181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00015

    Abstract: A wire bonding joint structure of a joint pad in which electroless surface treatment plating layers of joint pads configured by a nickel layer/a palladium layer/a gold layer are connected to each other by a metal wire and when the metal wire is joined to the electroless surface treatment plating layer, a depth of the wire bonding pad formed by wedge deformation is 1.0 m or more.The electroless surface treatment layer of the joint pad can lower strength and hardness of the wire bonding pad of which the surface is treated to improve follow-up capability between a gold wire and the bonding pad, such that a joint area between the gold and the bonding pad is maximized, thereby increasing joinability at the wire bonding finish process by wedge pressure and greatly improving wire bonding workability.

    Abstract translation: 接合垫的线接合结构，其中由镍层/钯层/金层构成的接合垫的无电解表面处理镀层通过金属线彼此连接，并且当金属线接合到 无电解表面处理镀层，由楔形变形形成的导线焊盘的深度为1.0μm以上。 接合垫的无电解表面处理层可以降低处理表面的引线接合焊盘的强度和硬度，以提高金线和焊盘之间的跟随能力，使得金和焊盘之间的接合面积 焊盘最大化，从而通过楔形压力提高了引线接合处理过程中的接合性，并大大提高了引线接合可加工性。

    Circuit structure and manufacturing method thereof
    206.
    发明授权
    Circuit structure and manufacturing method thereof 有权
    电路结构及其制造方法

    公开(公告)号：US08552303B2

    公开(公告)日：2013-10-08

    申请号：US13160501

    申请日：2011-06-14

    Applicant: Ching-Sheng Chen

    Inventor： Ching-Sheng Chen

    IPC: H05K1/00

    CPC classification number: H01L21/7685 ,  B82Y10/00 ,  H05K3/062 ,  H05K2201/0338

    Abstract: A manufacturing method of a circuit structure is provided. A metal layer having an upper surface is provided. A surface passivation layer is formed on the metal layer. The surface passivation layer exposes a portion of the upper surface of the metal layer, and a material of the metal layer is different from a material of the surface passivation layer. The metal layer and the surface passivation layer are dipped into a modifier, and the modifier is selectively absorbed and attached to the surface passivation layer, so as to form a covering layer. The covering layer has a plurality of nanoparticles and covers the surface passivation layer.

    Abstract translation: 提供一种电路结构的制造方法。 提供具有上表面的金属层。 在金属层上形成表面钝化层。 表面钝化层暴露金属层的上表面的一部分，并且金属层的材料不同于表面钝化层的材料。 将金属层和表面钝化层浸入改性剂中，并且改性剂被选择性地吸收并附着到表面钝化层，以形成覆盖层。 覆盖层具有多个纳米颗粒并覆盖表面钝化层。

    Display device
    207.
    发明授权
    Display device 有权
    显示设备

    公开(公告)号：US08466470B2

    公开(公告)日：2013-06-18

    申请号：US12870019

    申请日：2010-08-27

    Applicant: Jung-Min Lee ,  Choong-Ho Lee

    Inventor： Jung-Min Lee ,  Choong-Ho Lee

    IPC: H01L27/14

    CPC classification number: H01L27/3276 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0221 ,  H05K2201/0338 ,  H05K2201/10674

    Abstract: A display device includes a wire substrate including a wire unit for driving the display device, an integrated circuit chip mounted at the wire substrate, and a pad unit extended from the wire unit to be disposed between the wire substrate and the integrated circuit chip. The pad unit is connected to the integrated circuit chip. The pad unit includes a first conductive layer extended from the wire unit, and a second conductive layer disposed on the first conductive layer. The hardness of the second conductive layer is less than the hardness of the first conductive layer.

    Abstract translation: 显示装置包括：线基板，包括用于驱动显示装置的线单元，安装在线基板上的集成电路芯片;以及从布线单元延伸以设置在线基板和集成电路芯片之间的焊盘单元。 焊盘单元连接到集成电路芯片。 焊盘单元包括从导线单元延伸的第一导电层和设置在第一导电层上的第二导电层。 第二导电层的硬度小于第一导电层的硬度。

    TRANSPARENT CONDUCTIVE FILM AND TOUCH PANEL USING THE SAME
    208.
    发明申请
    TRANSPARENT CONDUCTIVE FILM AND TOUCH PANEL USING THE SAME 审中-公开
    透明导电薄膜和触控面板

    公开(公告)号：US20130048349A1

    公开(公告)日：2013-02-28

    申请号：US13340134

    申请日：2011-12-29

    Applicant: MING-TIEN LIN ,  PO-SHENG SHIH

    Inventor： MING-TIEN LIN ,  PO-SHENG SHIH

    IPC: H05K1/03 ,  H05K1/02

    CPC classification number: G06F3/044 ,  H05K3/027 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2203/107

    Abstract: A transparent conductive film includes at least one continuous transparent conductive layer and a number of transparent conductive stripes spaced from each other and extending substantially along a low impedance direction. The transparent conductive stripes are disposed on and electrically contact a surface of the at least one transparent conductive layer. A resistivity of the transparent conductive film in the low impedance direction is less than the resistivity in any other direction. A touch panel includes the transparent conductive film.

    Abstract translation: 透明导电膜包括至少一个连续的透明导电层和多个彼此间隔开并且沿着低阻抗方向延伸的透明导电条。 所述透明导电条布置在所述至少一个透明导电层的表面上并与所述至少一个透明导电层的表面电接触。 透明导电膜在低阻抗方向的电阻率小于任何其它方向的电阻率。 触摸面板包括透明导电膜。

    WIRE BONDING JOINT STRUCTURE OF JOINT PAD, AND METHOD FOR PREPARING THE SAME
    209.
    发明申请
    WIRE BONDING JOINT STRUCTURE OF JOINT PAD, AND METHOD FOR PREPARING THE SAME 有权
    接头线的接合接头结构及其制备方法

    公开(公告)号：US20130000966A1

    公开(公告)日：2013-01-03

    申请号：US13472281

    申请日：2012-05-15

    Applicant: Dong Jun LEE

    Inventor： Dong Jun LEE

    IPC: H05K1/11 ,  H01B5/14 ,  H05K3/00

    CPC classification number: H05K3/244 ,  H01L23/49866 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48455 ,  H01L2224/85444 ,  H01L2924/01029 ,  H05K2201/0338 ,  H05K2203/049 ,  Y10T29/49124 ,  Y10T29/49181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00015

    Abstract: A wire bonding joint structure of a joint pad in which electroless surface treatment plating layers of joint pads configured by a nickel layer/a palladium layer/a gold layer are connected to each other by a metal wire and when the metal wire is joined to the electroless surface treatment plating layer, a depth of the wire bonding pad formed by wedge deformation is 1.0 m or more.The electroless surface treatment layer of the joint pad can lower strength and hardness of the wire bonding pad of which the surface is treated to improve follow-up capability between a gold wire and the bonding pad, such that a joint area between the gold and the bonding pad is maximized, thereby increasing joinability at the wire bonding finish process by wedge pressure and greatly improving wire bonding workability.

    Abstract translation: 接合垫的线接合结构，其中由镍层/钯层/金层构成的接合垫的无电解表面处理镀层通过金属线彼此连接，并且当金属线接合到 无电解表面处理镀层，由楔形变形形成的导线焊盘的深度为1.0μm以上。 接合垫的无电解表面处理层可以降低处理表面的引线接合焊盘的强度和硬度，以提高金线和焊盘之间的跟踪能力，使得金和焊盘之间的接合面积 焊盘最大化，从而通过楔形压力提高了引线接合处理过程中的接合性，并大大提高了引线接合可加工性。

Patent Agency Ranking