公开(公告)号：US5824964A

公开(公告)日：1998-10-20

申请号：US834480

申请日：1997-04-11

Applicant: Yoshiji Kasai ,  Kaoru Hara ,  Misao Aruga

Inventor： Yoshiji Kasai ,  Kaoru Hara ,  Misao Aruga

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/367 ,  H01L25/065 ,  H05K3/00 ,  H05K1/00

CPC classification number: H01L24/32 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3675 ,  H01L24/97 ,  H01L25/0655 ,  H05K3/0052 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/97 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09827 ,  H05K3/0061 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: In the circuit board of the present invention, a base board has a first face and a second face, in which a plurality of sets of wire patterns, to which semiconductor chips are respectively connected, are printed on the first face. A metal plate for radiating heat is fixed on the second face of the base board. The base board includes a V-notch being formed along a border between the sets of wire patterns, and the metal plate includes a V-notch being formed to correspond to the V-notch of the base board, whereby the circuit board is divided into a plurality of circuit units, which are mutually connected by a thin section corresponding to the V-notches of the metal plate.

Abstract translation: 在本发明的电路板中，基板具有第一面和第二面，其中在第一面上印刷有分别连接有半导体芯片的多组线图案。 用于散热的金属板固定在基板的第二面上。 基板包括沿着线图案组之间的边界形成的V形凹口，并且金属板包括形成为对应于基板的V形凹口的V形凹口，由此将电路板分成 多个电路单元，其通过与金属板的V形凹口对应的薄部分相互连接。

公开(公告)号：US5767576A

公开(公告)日：1998-06-16

申请号：US858452

申请日：1997-05-19

Applicant: Takatoshi Kobayashi ,  Toshifusa Yamada

Inventor： Takatoshi Kobayashi ,  Toshifusa Yamada

IPC: C04B37/02 ,  H01L23/13 ,  H01L25/07 ,  H01L25/18 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K3/00 ,  H05K3/20 ,  H05K3/40 ,  H01L23/34

CPC classification number: H05K3/0052 ,  H01L24/49 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/142 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09827 ,  H05K3/0061 ,  H05K3/4092

Abstract: A semiconductor module includes a ceramic substrate for mounting plural semiconductor chips. Even if cracks and cleavages are formed in the ceramic substrate, further damages, such as lowering dielectric or insulation strength is prevented. The semiconductor module includes IGBTs arranged on one ceramic substrate soldered to a metal base plate, and the upper surface of the ceramic substrate is divided into zones. On each zone, a copper foil with one IGBT is mounted. A snap line is formed between the zones to localize the cracks and cleavages formed by bending stress to the snap line. The copper foils on the zones are connected to each other by a conductor bridge disposed over the snap line.

Abstract translation: 半导体模块包括用于安装多个半导体芯片的陶瓷基板。 即使在陶瓷基板中形成裂纹和裂纹，也可以防止诸如降低电介质或绝缘强度的损害。 半导体模块包括布置在焊接到金属基板的一个陶瓷基板上的IGBT，并且陶瓷基板的上表面被分成多个区域。 在每个区域上安装一个带有一个IGBT的铜箔。 在这些区域之间形成卡扣线，以将由弯曲应力形成的裂纹和裂缝定位到卡扣线。 区域上的铜箔通过布置在卡扣线上的导体桥彼此连接。

公开(公告)号：US5493769A

公开(公告)日：1996-02-27

申请号：US284150

申请日：1994-08-02

Applicant: Norio Sakai ,  Kenji Kubota

Inventor： Norio Sakai ,  Kenji Kubota

IPC: H01F17/00 ,  H01C1/14 ,  H01G4/232 ,  H01G4/30 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46 ,  H01R43/00

CPC classification number: H01G4/232 ,  H01C1/14 ,  H01L23/49805 ,  H01L23/49822 ,  H05K3/403 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/0919 ,  H05K3/0052 ,  Y10T29/435 ,  Y10T29/49004 ,  Y10T29/4902 ,  Y10T29/49169

Abstract: A method of manufacturing a multilayer electronic component having one major surface which can be completely used as a mounting surface for another electronic component to form a composite component includes the steps of forming a groove in the mother laminate along a cutting line, forming external electrodes on side surfaces of the groove and then dividing the mother laminate along the cutting line to divide the groove thereby forming a plurality of multilayer electronic components that are independent of each other. The method of forming the electronic components allows for measuring electrical characteristics of the individual multilayer electronic components while the components are still part of the mother laminate.

Abstract translation: 一种具有一个主表面的多层电子部件的制造方法，其可以完全用作另一电子部件的安装面以形成复合部件，包括以下步骤：沿着切割线在母体层叠体中形成凹槽，形成外部电极 然后沿着切割线分割母体层叠体以分割凹槽，从而形成彼此独立的多个多层电子部件。 形成电子部件的方法允许测量各个多层电子部件的电特性，同时部件仍然是母层压板的一部分。

公开(公告)号：US5459640A

公开(公告)日：1995-10-17

申请号：US311336

申请日：1994-09-23

Applicant: Michael F. Moutrie ,  Andrew I. Whitmore ,  David M. Hess ,  John C. Laugal ,  Steven M. Mina ,  Matthew J. Boler

Inventor： Michael F. Moutrie ,  Andrew I. Whitmore ,  David M. Hess ,  John C. Laugal ,  Steven M. Mina ,  Matthew J. Boler

IPC: H01L23/40 ,  H05K3/30 ,  H05K7/20

CPC classification number: H05K3/301 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H05K2201/0909 ,  H05K2201/10393 ,  Y10T29/49133 ,  Y10T29/49144

Abstract: An electrical module (125) is for mounting upon a circuit board (104). During circuit assembly, the electrical module (125) is placed upon a breakaway portion (117) of the circuit board (104) and a bracket assembly (103) is mounted to the circuit board (104) so as to position the electrical module (125). At the conclusion of circuit assembly, final assembly is initiated and the breakaway portion (117) is removed and the circuit board (104) is mounted into a housing (105). Preferably, the electrical module (125) is in direct contact with the housing (105) so as to maximize heat transfer.

Abstract translation: 电气模块（125）用于安装在电路板（104）上。 在电路组装期间，电气模块（125）被放置在电路板（104）的分离部分（117）上，并且支架组件（103）安装到电路板（104），以便定位电气模块 125）。 在电路组装结束时，开始最终组装，并且拆卸部分（117）被移除并且电路板（104）被安装到壳体（105）中。 优选地，电气模块（125）与壳体（105）直接接触，以便最大限度地传热。

公开(公告)号：US5427641A

公开(公告)日：1995-06-27

申请号：US139629

申请日：1993-10-19

Applicant: Eiji Muramatsu ,  Masaru Kamimura

Inventor： Eiji Muramatsu ,  Masaru Kamimura

IPC: H01L23/00 ,  H01L21/60 ,  H05K1/00 ,  H05K3/00 ,  H05K3/36 ,  H05K13/00 ,  H05K13/04 ,  B32B31/00

CPC classification number: H05K3/0097 ,  H01L24/50 ,  H05K13/003 ,  H05K13/0417 ,  H01L2924/14 ,  H05K1/0393 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10136 ,  H05K2203/0191 ,  H05K2203/1545 ,  H05K3/0052 ,  H05K3/361 ,  Y10T156/1052 ,  Y10T156/1054 ,  Y10T156/1056 ,  Y10T156/1059 ,  Y10T156/12 ,  Y10T156/1734 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/49144 ,  Y10T29/49147

Abstract: A tape carrier for electronic components is provided with enlarged regions along cut out lines defining the boundaries of the electronic component mount area. Provision is made for temporarily maintaining the cut out mount area substantially coplanar with remaining portions of the tape carrier. In the preferred embodiment, this is accomplished by way of an adhesive tape bridging the enlarged openings or by tabs or micro connectors bridging the enlarged openings. Thereafter, the mounts can be totally removed from the carrier film by severing the tape or the tabs. The enlarged regions facilitate the severance of the tape or tabs in an automated assembly line environment.

Abstract translation: 用于电子部件的带载体沿着限定电子部件安装区域的边界的切割线设置有放大区域。 规定了临时保持切割安装区域与带载体的剩余部分基本共面。 在优选实施例中，这通过桥接扩大的开口的粘合带或桥接扩大的开口的接头或微型连接器来实​​现。 此后，通过切断带子或突片，可以将托架从载体膜完全移除。 扩大的区域有助于在自动装配线环境中的带或突片的切断。

公开(公告)号：US5387126A

公开(公告)日：1995-02-07

申请号：US106670

申请日：1993-08-16

Applicant: Michael M. Austin ,  Steven R. Fischl ,  Mark S. Bresin ,  Alay Mehta ,  Raymond J. Kleinert, III ,  Willard F. Amero, Jr.

Inventor： Michael M. Austin ,  Steven R. Fischl ,  Mark S. Bresin ,  Alay Mehta ,  Raymond J. Kleinert, III ,  Willard F. Amero, Jr.

IPC: H05K1/02 ,  H05K1/00

CPC classification number: H05K1/0293 ,  H05K1/029 ,  H05K1/0393 ,  H05K2201/09081 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09781 ,  H05K2203/175

Abstract: A configurable flexible circuit substrate (100) is disclosed. The substrate (100) has an electrical circuit pattern (120) and an integral separable segment (130) containing a portion (132) of the circuit pattern (120). The substrate (100) also includes an integral extraction initiator portion (132), which is pivotable between a first position substantially planar with the surface of the substrate (100), and a second position away from the surface of the substrate (100). The extraction initiator portion (132) develops stress raisers (137) when pivoted toward the second position, and the extraction initiator portion (132) also effects a removal of the separable segment (130) from the substrate (100) when the extraction initiator portion (132) is pulled across the separable segment (130).

Abstract translation: 公开了一种可配置的柔性电路基板（100）。 基板（100）具有电路图案（120）和包含电路图案（120）的一部分（132）的整体可分段（130）。 衬底（100）还包括可在与衬底（100）的表面基本上平面的第一位置和离开衬底（100）的表面的第二位置之间枢转的整体提取引发部分（132）。 当提取引发剂部分（132）向第二位置转动时，提取引发剂部分（132）产生应力提升器（137），并且当提取引发剂部分（132）从底物（100）移除时，提取引发剂部分（132） （132）被拉过可分离段（130）。

公开(公告)号：US5335553A

公开(公告)日：1994-08-09

申请号：US791249

申请日：1991-11-13

Applicant: Takashi Ueki ,  Katsuhito Sakai ,  Koichi Kanda ,  Hideo Kamiya

Inventor： Takashi Ueki ,  Katsuhito Sakai ,  Koichi Kanda ,  Hideo Kamiya

IPC: G01F1/32 ,  G01F1/684 ,  G01F7/00 ,  H05K1/14 ,  H05K3/00 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36

CPC classification number: G01F7/00 ,  G01F1/3227 ,  G01F1/684 ,  H05K1/148 ,  H05K3/306 ,  H05K1/14 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/0909 ,  H05K2201/105 ,  H05K2201/10863 ,  H05K3/0052 ,  H05K3/3447 ,  H05K3/361 ,  Y10T29/49139

Abstract: A fluidic gas meter including a flow path structure provided with a fluidic element, a cut-off valve, a pressure switch, a flow sensor, a piezoelectric film sensor, an electronic circuit unit, and a wiring board serving as a mother board and having a function of lead wires. Each of the cut-off valve, the pressure switch, the flow sensor and the piezoelectric film sensor are fixed to the flow path structure. The electronic circuit unit is made up of a counter board and a control circuit board. The counter board is mounted with an electronic circuit for counting up flow-rate signals from the flow sensor and the piezoelectric film sensor and a liquid crystal display device for displaying the amount of gas consumed. The control circuit board is mounted with a control circuit for controlling the cut-off valve, wherein each of the cut-off valve, the pressure switch, the flow sensor, the piezoelectric film sensor and the electronic circuit unit is provided with a plurality of terminals extending perpendicularly to the wiring board. The wiring board is provided with a printed circuit for the interconnection among the terminals. The wiring board has a plurality of V-shaped guide grooves formed therein for receiving the terminals and guiding the terminals to through holes formed at an apex of the V-shape of the guide grooves, wherein the terminals form an electrical connection with the printed circuit of the circuit board, thereby avoiding wiring errors.

Abstract translation: 一种流体式气体计，包括设有流体元件的流路结构，截止阀，压力开关，流量传感器，压电膜传感器，电子电路单元和用作母板的布线板，并具有 引线功能。 截止阀，压力开关，流量传感器和压电膜传感器中的每一个固定在流路结构上。 电子电路单元由计数器板和控制电路板构成。 计数器板安装有用于对来自流量传感器和压电膜传感器的流量信号进行计数的电子电路和用于显示消耗的气体量的液晶显示装置。 控制电路板安装有用于控制截止阀的控制电路，其中截止阀，压力开关，流量传感器，压电膜传感器和电子电路单元中的每一个设置有多个 端子垂直于接线板延伸。 布线板设置有用于端子之间的互连的印刷电路。 布线板具有形成在其中的多个V形引导槽，用于容纳端子并将端子引导到形成在导槽的V形顶点的通孔，其中端子与印刷电路形成电连接 的电路板，从而避免接线错误。

公开(公告)号：US5277596A

公开(公告)日：1994-01-11

申请号：US991700

申请日：1992-12-16

Applicant: Dirk R. Dixon

Inventor： Dirk R. Dixon

IPC: H01R12/71 ,  H01R43/20 ,  H05K3/00 ,  H05K3/34 ,  H01R23/70

CPC classification number: H05K3/3405 ,  H01R12/721 ,  H01R43/205 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/10189 ,  H05K3/0052 ,  Y10S439/937 ,  Y10T29/49149

Abstract: This invention is directed to a method of aligning an electrical receptacle assembly having plural electrical terminals projecting therefrom along only one side of the assembly to the edge of a substantially rectangular, planar conductive panel formed of a dielectric material, such as a printed circuit board (PCB), where such terminals are to be reflow soldered to electrically conductive paths on the surface of said planar conductive panel. The method includes the steps of (a) preparing a conductive panel joined on at least one side thereof with a carrier support portion secured to the conductive panel by plural frangible webs which may be readily severed after the soldering of the contacts to the conductive paths, (b) selecting an electrical receptacle assembly comprising an elongated housing having plural cavities, where each cavity includes an electrical terminal mounted therein, with the ends of the terminals aligned within a plane, and a pair of oppositely disposed tabs extending from the housing, (c) providing an elongated opening within the carrier support portion adjacent to the edge of the conductive panel and of a size to receive the elongated housing, where the tabs are adapted to lie upon the surface of said carrier support portion, and thereafter (d) seating the electrical receptacle assembly within the opening whereby the electrical receptacle assembly is aligned with the conductive paths on the planar conductive panel, and each terminal end contacts a corresponding conductive path on the surface of the planar conductive panel.

Abstract translation: 本发明涉及一种将具有多个电端子的电插座组件对准的方法，该电插座组件仅沿着组件的一侧向其突出到由电介质材料（例如印刷电路板）形成的大致矩形的平面导电板的边缘 PCB），其中这些端子将被回流焊接在所述平面导电板的表面上的导电路径上。 该方法包括以下步骤：（a）制备在其至少一侧上连接有导电板的载体支撑部分，该载体支撑部分通过多个易破碎的网状物固定到导电板上，所述多个易碎网可以在将触点焊接到导电路径之后容易地切断， （b）选择包括具有多个空腔的细长壳体的电插座组件，其中每个空腔包括安装在其中的电端子，端子的端部在平面内对准，以及从壳体延伸的一对相对设置的突出部（ c）在所述载体支撑部分内邻近所述导电板的边缘提供细长的开口，并且具有接纳所述细长壳体的尺寸，其中所述突片适于位于所述载体支撑部分的表面上，此后（d） 将电插座组件安置在开口内，由此电插座组件与平面导管上的导电路径对齐 并且每个终端接触平面导电板的表面上的对应导电路径。

公开(公告)号：US5205041A

公开(公告)日：1993-04-27

申请号：US796656

申请日：1991-11-25

Applicant: Gianni Brosadola

Inventor： Gianni Brosadola

IPC: B26B15/00 ,  B23D27/02 ,  H05K3/00

CPC classification number: B23D27/02 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/0195

Abstract: A device (10) for removing a connecting peduncle (28) passing through a separation slot (42) between two printed circuit boards (26, 27) includes a reciprocating moving element (13) having a cutting face (14) thereon formed on a undersurface of a projection projecting from a shank (2) slidable between a pair of bucking elements (17, 18) facing each other to provide at least in an initial section thereof a seat in which the shank (2) is insertable without play. The transverse dimension of the moving element (13) is such as to be received in a sliding manner guided in the slot (42) to receive the peduncle between its cutting face (14) and the edges of the bucking elements. The inner end of the shank (2) is connected to a reciprocating part of a motor device (11) so that upon operation of the motor device (11) the moving element (13) cuts the peduncle while the bucking elements (17, 18) engage with their bucking surfaces (15, 16 ) at the sides of the peduncle to avoid transmission of transverse strains in the printed circuit boards to be separated.

公开(公告)号：US4977042A

公开(公告)日：1990-12-11

申请号：US446762

申请日：1989-12-06

Applicant: Masanobu Chiyajo ,  Toshio Kuroki ,  Eiji Sakata

Inventor： Masanobu Chiyajo ,  Toshio Kuroki ,  Eiji Sakata

IPC: B26B19/28 ,  B26B19/38 ,  H01M2/10 ,  H01M2/20 ,  H01M2/34 ,  H01M10/46 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/18 ,  B26B19/286 ,  B26B19/3853 ,  B26B19/3873 ,  H01M10/46 ,  H01M2/1055 ,  H01M2/20 ,  H05K1/0293 ,  H05K1/117 ,  H01M2/34 ,  H05K1/0292 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/094 ,  H05K2201/10037 ,  H05K2201/10295 ,  H05K2201/10606 ,  H05K2201/10689 ,  H05K2201/2036 ,  H05K2203/175 ,  H05K2203/176 ,  H05K3/3447

Abstract: A rechargeable type small electric appliance including a rechargeable battery having negative and positive terminals, the negative and positive terminals being, respectively, connected to a wiring board by a pair of lead members, in which at least one of the lead members is bent in an inverse U-shape so as to have first and second pieces and a bent portion connecting the first and second pieces, the first piece being secured to the wiring board, while the second piece is clamped, at a clamp portion thereof, to a corresponding one of the negative and positive terminals, the bent portion projecting outwardly beyond the clamp portion of the second piece in a radial direction of the rechargeable battery.