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    Method for manufacturing a substrate for mounting a semiconductor element
    231.
    发明申请
    Method for manufacturing a substrate for mounting a semiconductor element 审中-公开
    制造用于安装半导体元件的基板的方法

    公开(公告)号：US20090114345A1

    公开(公告)日：2009-05-07

    申请号：US12289473

    申请日：2008-10-28

    Applicant: Hiroki Nakayama ,  Juntarou Mikami

    Inventor： Hiroki Nakayama ,  Juntarou Mikami

    IPC: B29C63/00

    CPC classification number: H01L21/4846 ,  H01L2224/48247 ,  H05K1/09 ,  H05K3/062 ,  H05K3/284 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2203/1184 ,  Y10T156/11

    Abstract: A method for manufacturing a substrate for mounting a semiconductor element includes: a step for forming a predetermined resist pattern by affixing resists on both faces of a base material including a metallic thin plate and using the resist of one of the faces as a masking for plating; a step for performing an etching of a predetermined position on a base material exposed from the resist pattern; a step for forming a plating layer having at least three layers including a lower, a middle, and an upper layer on the etched base material; a step for separating the resists affixed to both faces of a base material; and a step for performing an etching of the middle plating layer to make the middle plating layer narrower than the upper and lower plating layers.

    Abstract translation: 一种用于安装半导体元件的基板的制造方法包括：通过在包括金属薄板的基材的两面上固定抗蚀剂并使用其中一个表面的抗蚀剂作为电镀掩模来形成预定抗蚀剂图案的步骤 ; 在从抗蚀剂图案曝光的基材上进行预定位置的蚀刻的步骤; 在蚀刻后的基材上形成具有下层，中层和上层的至少3层的镀层的工序; 分离固定在基材两面上的抗蚀剂的工序; 以及进行中间镀层的蚀刻以使中间镀层比上，下镀层窄的工序。

    LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
    233.
    发明申请
    LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS 有权
    激光加工方法和激光加工设备

    公开(公告)号：US20090057284A1

    公开(公告)日：2009-03-05

    申请号：US12257760

    申请日：2008-10-24

    Applicant: Naoaki Fukuda ,  Kazuyoshi Kunishio ,  Shigeaki Nakayama

    Inventor： Naoaki Fukuda ,  Kazuyoshi Kunishio ,  Shigeaki Nakayama

    IPC: B23K26/00

    CPC classification number: B23K26/0604 ,  B23K26/0006 ,  B23K26/0608 ,  B23K26/0676 ,  B23K2101/42 ,  B23K2103/00 ,  B23K2103/56 ,  H05K3/0026 ,  H05K3/027 ,  H05K2201/0338 ,  H05K2203/108

    Abstract: The present invention provides a method and an apparatus for efficiently processing in patterning of an electronic circuit board even when laser beams of differing intensities and wavelengths are irradiated in multiple stages. A laser processing apparatus is provided with first and second laser oscillators for emitting laser beams of which at least the wavelength or the intensities are different from each other; a stage apparatus for moving a workpiece to be processed; and optical systems for guiding the laser beams to prescribed positions of the workpiece. The optical systems can be moved by means of an adjusting device according to the relative moving direction of the laser beams and the workpiece to permit the prescribed position of the subject to be irradiated with laser beams in that order so that the workpiece can be processed by the laser beams. Thus, efficient laser processing can be performed without limiting the relative moving direction of the laser beams and the workpiece and without unnecessary movement.

    Abstract translation: 本发明提供了即使在多个阶段照射不同强度和波长的激光束时，也能够有效地处理电子电路板的图形化的方法和装置。 激光处理装置设置有第一和第二激光振荡器，用于发射至少波长或强度彼此不同的激光束; 用于移动待处理的工件的平台装置; 以及用于将激光束引导到工件的规定位置的光学系统。 光学系统可以根据激光束和工件的相对移动方向通过调节装置移动，以允许受试者的规定位置依次用激光束照射，使得工件可以由 激光束。 因此，可以在不限制激光束和工件的相对移动方向并且没有不必要的移动的情况下执行高效的激光加工。

    Semiconductor device
    234.
    发明申请
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US20080291636A1

    公开(公告)日：2008-11-27

    申请号：US12154592

    申请日：2008-05-23

    Applicant: Shogo Mori ,  Akiko Kumano

    Inventor： Shogo Mori ,  Akiko Kumano

    IPC: H05K7/20 ,  H01L21/50

    CPC classification number: H01L23/473 ,  H01L23/3735 ,  H01L23/5386 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/0338 ,  H01L2924/00

    Abstract: The semiconductor device includes a circuit board. The circuit board has an insulating substrate, a metal circuit fixed on a first side of the insulating substrate, and a metal plate fixed on a second side of the insulating substrate. The semiconductor device further has a semiconductor element mounted on the metal circuit, a stress reducing member fixed on the metal plate, and a heat sink fixed on the stress reducing member. The stress reducing member is plate-shaped and has round-shaped corners.

    Abstract translation: 半导体器件包括电路板。 电路板具有绝缘基板，固定在绝缘基板的第一面上的金属电路和固定在绝缘基板的第二面上的金属板。 半导体器件还具有安装在金属电路上的半导体元件，固定在金属板上的应力消除部件和固定在减压部件上的散热片。 减压构件是板形的并且具有圆形的角部。

    Apparatus And Method For Manufacturing Stress-Free Flexible Printed Circuit Board
    237.
    发明申请
    Apparatus And Method For Manufacturing Stress-Free Flexible Printed Circuit Board 有权
    用于制造无应力柔性印刷电路板的装置和方法

    公开(公告)号：US20080202919A1

    公开(公告)日：2008-08-28

    申请号：US12034707

    申请日：2008-02-21

    Applicant: Jeon Geon Han ,  Kab Seog Kim ,  Yong Mo Kim

    Inventor： Jeon Geon Han ,  Kab Seog Kim ,  Yong Mo Kim

    IPC: C23C14/35

    CPC classification number: C23C14/352 ,  C23C14/20 ,  C23C14/562 ,  H01J37/3277 ,  H01J37/3405 ,  H05K1/028 ,  H05K1/09 ,  H05K3/16 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2203/1476 ,  H05K2203/1545

    Abstract: An apparatus and method for manufacturing a highly efficient flexible thin metal film-laminated strip by improves adhesiveness between a polyimide strip and a thin metal film, and removes stress from thin films laminated through magnetron sputtering, which is a dry deposition process. The stress-free flexible circuit board manufacturing method includes the steps of: a) depositing a seed layer on the substrate using the magnetron deposition source; b) depositing a compressive thin film using the single magnetron deposition source arranged next to the magnetron deposition source; c) depositing tensile thin film using the dual magnetron deposition source arranged next to the single magnetron deposition source; and d) repeating the steps b) and c) so as to sequentially and alternately deposit compressive thin films and tensile thin films thereby obtaining a thick film with a desired thickness.

    Abstract translation: 通过改善聚酰亚胺条和薄金属膜之间的粘合性，并且通过作为干沉积工艺的磁控溅射层叠的薄膜来消除应力，从而制造高效率的柔性薄金属膜层叠带的装置和方法。 无应力柔性电路板的制造方法包括以下步骤：a）使用磁控管沉积源将种子层沉积在基板上; b）使用布置在磁控管沉积源旁边的单个磁控管沉积源沉积压缩薄膜; c）使用布置在单个磁控管沉积源旁边的双重磁控管沉积源沉积拉伸薄膜; 以及d）重复步骤b）和c），以顺序和交替地沉积压缩薄膜和拉伸薄膜，从而获得具有所需厚度的厚膜。

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