公开(公告)号：US3398232A

公开(公告)日：1968-08-20

申请号：US49765765

申请日：1965-10-19

Applicant: AMP INC

Inventor： EDWIN HOFFMAN NORMAN

IPC: H01R12/50 ,  H05K1/00 ,  H05K1/02 ,  H05K3/10 ,  H05K3/36 ,  H05K7/18

CPC classification number: H05K7/18 ,  H05K1/0206 ,  H05K1/0221 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0298 ,  H05K3/107 ,  H05K3/36 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K2203/0733

公开(公告)号：US3324269A

公开(公告)日：1967-06-06

申请号：US50584565

申请日：1965-11-01

Applicant: HOLLANDSE SIGNAALAPPARATEN BV

Inventor： LA ROY DICK

IPC: C25D5/02 ,  C25D5/44 ,  C25D7/00 ,  C25D11/12 ,  G03F7/00 ,  H01H1/02 ,  H01H1/021 ,  H01H19/58 ,  H05K1/05 ,  H05K1/09 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/44

CPC classification number: H05K3/107 ,  C25D5/02 ,  C25D5/44 ,  C25D7/00 ,  C25D11/12 ,  G03F7/00 ,  H01H1/02 ,  H01H1/021 ,  H01H19/585 ,  H05K1/053 ,  H05K1/09 ,  H05K3/002 ,  H05K3/184 ,  H05K3/243 ,  H05K3/44 ,  H05K2201/0376 ,  H05K2201/09554 ,  H05K2203/0315

公开(公告)号：US3247573A

公开(公告)日：1966-04-26

申请号：US20162662

申请日：1962-06-11

Applicant: RCA CORP

Inventor： NOACK ROBERT L

IPC: H01B3/00 ,  H01F41/16 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  H05K3/20

CPC classification number: H05K1/09 ,  H01B3/004 ,  H01F41/16 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/1216 ,  H05K3/205 ,  H05K2201/0376 ,  H05K2201/083 ,  Y10T29/49014 ,  Y10T29/4902 ,  Y10T29/49099 ,  Y10T29/49158

公开(公告)号：US2972003A

公开(公告)日：1961-02-14

申请号：US56696256

申请日：1956-02-21

Applicant: ROGERS CORP

Inventor： GREENMAN NORMAN L ,  ZAGUSTA JOHN A ,  ANDERSON PAUL L

IPC: H05K3/00 ,  H05K3/04 ,  H05K3/10 ,  H05K3/38

CPC classification number: H05K3/0014 ,  H05K3/041 ,  H05K3/107 ,  H05K3/386 ,  H05K2201/0376 ,  H05K2201/09118 ,  H05K2203/0108 ,  H05K2203/0278

公开(公告)号：US2938939A

公开(公告)日：1960-05-31

申请号：US61085056

申请日：1956-09-19

Applicant: MALCOLM ROBERT J

Inventor： MALCOLM ROBERT J

IPC: H05K3/00 ,  H05K3/04 ,  H05K3/06 ,  H05K3/10 ,  H05K3/20 ,  H05K3/22 ,  H05K3/28 ,  H05K3/38

CPC classification number: H05K3/22 ,  H05K3/0044 ,  H05K3/04 ,  H05K3/06 ,  H05K3/107 ,  H05K3/20 ,  H05K3/28 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09881 ,  H05K2203/0278 ,  H05K2203/063 ,  H05K2203/1105

公开(公告)号：US2861911A

公开(公告)日：1958-11-25

申请号：US47611654

申请日：1954-12-20

Applicant: MOLDED FIBER GLASS BODY COMPAN

Inventor： MORGAN MARTIN ,  BOJANOWSKI CLEMENT J

IPC: H05K3/10 ,  H05K3/14 ,  H05K3/20

CPC classification number: H05K3/20 ,  H05K3/107 ,  H05K3/14 ,  H05K3/143 ,  H05K2201/0317 ,  H05K2201/0376 ,  H05K2201/09118 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/0557 ,  H05K2203/104 ,  H05K2203/1344 ,  Y10S264/53 ,  Y10S425/811 ,  Y10T29/4916 ,  Y10T29/49984

公开(公告)号：US2724674A

公开(公告)日：1955-11-22

申请号：US32274252

申请日：1952-11-26

Applicant: NATHAN PRITIKIN

Inventor： NATHAN PRITIKIN

IPC: H05K1/03 ,  H05K1/09 ,  H05K3/10 ,  H05K3/20

CPC classification number: H05K3/207 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/092 ,  H05K3/102 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/1131 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T428/22

公开(公告)号：US2599710A

公开(公告)日：1952-06-10

申请号：US68890046

申请日：1946-08-07

Applicant: HATHAWAY ALBERT M

Inventor： HATHAWAY ALBERT M

IPC: H05K3/00 ,  H05K3/10 ,  H05K3/14

CPC classification number: H05K3/0044 ,  H05K3/107 ,  H05K3/143 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2203/025 ,  H05K2203/1344 ,  Y10T29/49155

公开(公告)号：US20230309240A1

公开(公告)日：2023-09-28

申请号：US17955855

申请日：2022-09-29

Applicant: Zhuhai ACCESS Semiconductor Co., Ltd

Inventor： Xianming CHEN ,  Xiaowei XU ,  Gao HUANG ,  Benxia HUANG

IPC: H05K3/06 ,  H05K3/00 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K3/064 ,  H05K3/0044 ,  H05K3/4647 ,  H05K1/0298 ,  H05K2203/025 ,  H05K2203/061 ,  H05K2203/143 ,  H05K2203/1446 ,  H05K2201/0376 ,  H05K2201/08

Abstract: A manufacturing method for a conductive substrate with a filtering function includes preparing a core layer and forming first and second conductive holes in the core layer, forming a sacrificial copper layer on the first conductive hole and on the core layer, forming a metal layer on the second conductive hole, forming a metal post in the first conductive hole, forming a lower insulating layer on the core layer, forming a lower insulative post in the second conductive hole, forming a magnet wrapping around the metal post to obtain a first conductive post, forming an upper insulating layer on the core layer, forming an upper insulative post in the second conductive hole to obtain a second conductive post, removing the upper insulating layer, the lower insulating layer, and the remaining sacrificial copper post layer, followed by flattening.

公开(公告)号：US20190239349A1

公开(公告)日：2019-08-01

申请号：US16381823

申请日：2019-04-11

Applicant: Sierra Circuits, Inc.

Inventor： Kenneth S. BAHL ,  Konstantine KARAVAKIS

IPC: H05K1/03 ,  H05K3/42 ,  H05K3/18 ,  H05K1/02 ,  H05K1/09 ,  H05K3/38 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/0313 ,  H05K1/0296 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/09 ,  H05K1/115 ,  H05K3/18 ,  H05K3/181 ,  H05K3/182 ,  H05K3/387 ,  H05K3/422 ,  H05K3/429 ,  H05K3/4632 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0242 ,  H05K2201/0376 ,  H05K2203/0716

Abstract: A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.