Abstract:
An electrode element using a silver nano-wire and a manufacturing method thereof are provided, according to which the electrode element has reinforced bonding of wire unit structures with low-temperature heat treatment and easily applicable as a polymer substrate, while improving haze phenomenon, deteriorating adhesion force of silver nano-wire layer, surface roughness and changing resistance over time. The manufacturing method of electrode element includes steps of forming a silver nano-wire layer on a substrate, coating an organo-metal (OM) compound solution on top of the silver nano-wire layer, reinforcing bonding of junctions formed between wire unit structures with a thermal energy locally generated at the junctions by surface Plasmon, by irradiating light onto the silver nano-wire layer with the OM compound coated thereon, and treating surface by applying sol-gel solution on the silver nano-wire layer treated by the Plasmon.
Abstract:
A portable electronic device includes at least one energy module which further included thermoelectric materials which may convert heat to electric power. A plurality of heat removers selectively thermal contact to at least one wall of an enclosure of the portable electronic device depended on the configuration of the portable electronic device.
Abstract:
The display device includes: a flexible display panel including a display portion in which scanning lines and signal lines cross each other; a supporting portion for supporting an end portion of the flexible display panel; a signal line driver circuit for outputting a signal to the signal line, which is provided for the supporting portion; and a scanning line driver circuit for outputting a signal to the scanning line, which is provided for a flexible surface of the display panel in a direction which is perpendicular or substantially perpendicular to the supporting portion.
Abstract:
A circuit unit is provided in which it is possible to connect circuit board to a terminal using a simple operation without removing a passivation film from above the terminal. A metal electrode which conducts with a circuit element is formed above a substrate. Multiple column shaped insulation films are each formed at a uniform pitch in two intersecting directions above the surface of the metal electrode. A metal electrode is formed above the metal electrode including the insulation film. A passivation film is formed on a surface of the metal electrode. Conductive beads are stuck between pairs of projection structured bodies formed on a surface of the passivation film, the passivation film on a side surface of the projection structure is scraped whereby the conductive beads conduct simultaneously with the metal electrode and an electrode formed on the circuit board.
Abstract:
An assembly apparatus for a display device includes a panel support member for supporting a display panel; a tape attaching module for attaching a cover panel tape to the display panel; and a pocket member holding a connector of a flexible printed circuit board attached to the cover panel tape.
Abstract:
An electrostatic-capacitance touch panel includes of X electrodes which are formed above a front surface of the electrostatic-capacitance touch panel, Y electrodes which intersect with the X electrodes, a back-surface electrode which is formed above a back surface of the electrostatic-capacitance touch panel, X-electrode signal lines which supply signals to the X electrodes from both ends of each X electrode, Y-electrode signal lines which supply signals to the Y electrodes from both ends of each Y electrode, a flexible printed circuit board connected to the X-electrode signal lines and the Y-electrode signal lines at a connection portion, intersecting portions where the X electrodes and the Y electrodes overlap with each other, and electrode portions each of which is formed between two intersecting portions. A back-surface-connection-use terminal is formed outside of the connection portion, and the back-surface-connection-use terminal and the back-surface electrode are connected to each other using a conductive member.
Abstract:
A flexible chip on film includes a base insulating layer, a metal layer disposed on an upper surface of the base insulating layer and including a circuit pattern, an integrated circuit chip disposed on an upper surface of the metal layer and electrically connected to the metal layer, a solder resist layer disposed on the metal layer and insulated from the integrated circuit chip, and a reinforcing layer disposed on an upper surface of the solder resist layer. When the chip on film COF is bent, a neutral surface, in which a vector sum of a tensile force and a compressive force becomes substantially zero, is placed in the metal layer.
Abstract:
A display device includes a substrate and a flexible circuit having one of its ends bonded to the substrate. The substrate comprises a pixel array. A driver integrated circuit (IC) is mounted on the flexible circuit. The flexible circuit is bonded to the substrate without protruding beyond an edge of the substrate. One end of the flexible circuit faces toward an inside of the substrate when the flexible circuit is flatly placed on or over the substrate, and the other end of the flexible circuit is bonded to the edge of the substrate.
Abstract:
Provided is a carbon nanotube (CNT) transparent conductive layer having a loop pattern in which a plurality of loops are at least partially connected to one another, and a fabrication method thereof. The loops in the pattern are generated by a spray-coating method and partially connected with one anther, and thus improving transparency and conductivity of the CNT transparent conductive layer. In Addition, the CNT transparent conductive layer has conductivity and sheet resistance highly suitable for a transparent electrode.
Abstract:
In an aspect, a touch screen panel including a sensing region and a peripheral region, a plurality of first sensing patterns located in the sensing region, a plurality of second sensing patterns arranged in an intersected direction with the first sensing patterns connected to each other by a connection part, an insulating layer formed on the first sensing pattern, the second sensing pattern, and the connection part, and patterned to expose both side of the first sensing pattern, at least one bridge located to intersect with the connection part on the insulating layer; and a plurality of wires located on a peripheral region and connected to the first sensing pattern and the second sensing pattern are provided.