公开(公告)号：US08215965B2

公开(公告)日：2012-07-10

申请号：US12741108

申请日：2009-04-24

Applicant: Masanori Mizoguchi

Inventor： Masanori Mizoguchi

IPC: H01R12/00

CPC classification number: H05K3/326 ,  H01R12/718 ,  H05K1/118 ,  H05K1/147 ,  H05K3/306 ,  H05K3/363 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/091 ,  H05K2201/0949 ,  H05K2201/10378 ,  H05K2201/1059

Abstract: A female connector which is useful for space saving and height reduction of a connector connection portion is a female connector including: an insulating film having flexibility; a plurality of pad portions formed at predetermined positions on one face of the insulating film in an arranged manner; female terminal portions composed of openings formed at one lateral portions within faces of the pad portions so as to extend up to the other face of the insulating film; and spacer bumps formed at positions corresponding to the other lateral positions within the faces of the pad portions in a standing manner within the other face of the insulating film, proximal portions of the spacer bumps being electrically connected to the pad portions.

Abstract translation: 用于连接器连接部分的节省空间和降低高度的阴连接器是阴连接器，包括：具有柔性的绝缘膜; 以排列的方式形成在所述绝缘膜的一个表面上的预定位置处的多个焊盘部分; 阴端子部分由形成在焊盘部分的表面内的一个侧部处的开口组成，以延伸到绝缘膜的另一个面; 以及在所述绝缘膜的另一个表面内以垂直方式形成在与所述焊盘部分的所述表面内的其它侧向位置对应的位置处的间隔凸块，所述间隔件凸块的近侧部分电连接到所述焊盘部分。

公开(公告)号：US08125341B2

公开(公告)日：2012-02-28

申请号：US12329213

申请日：2008-12-05

Applicant: Seth Strauser ,  Charles Iacono ,  Gary Mazoki ,  Anthony Piccoli ,  Hideki Imaichi

Inventor： Seth Strauser ,  Charles Iacono ,  Gary Mazoki ,  Anthony Piccoli ,  Hideki Imaichi

IPC: G08B13/14

CPC classification number: G08B13/2437 ,  G08B13/242 ,  G08B13/2445 ,  H05K1/0293 ,  H05K3/4084 ,  H05K2201/091 ,  H05K2201/2009 ,  H05K2203/105 ,  H05K2203/173

Abstract: A resonant circuit for use with a radio-wave detection system for the prevention of shoplifting or the like, which is formed on a flexible substrate and has a coil and capacitor circuit whereby the capacitor has an indented area in the dielectric of the capacitor to promote disablement of the circuit when exposed to a strong electromagnetic field. Upon exposure to a strong electromagnetic field, an electrical short forms across the dielectric of capacitor in the indented area. Because the short is fragile and can be opened by flexure of the circuit, an island of reinforcing material is formed in the indented area, such that when the substrate is flexed, the indented area remains rigid to protect the short. The indented area can be further stress-relieved by introducing a gap in the conductors forming the capacitor plates.

Abstract translation: 一种用于防止商店盗窃等的无线电波检测系统的谐振电路，其形成在柔性基板上并具有线圈和电容器电路，由此电容器在电容器的电介质中具有缩进区域以促进 暴露于强电磁场时电路的禁用。 在暴露于强电磁场时，在缩进区域中的电容器的电介质上形成电短路。 由于短路是易碎的并且可以通过电路的弯曲而打开，所以在凹陷区域中形成增强材料岛，使得当基板弯曲时，凹入区域保持刚性以保护短路。 通过在形成电容器板的导体中引入间隙，可以进一步减压凹陷区域。

公开(公告)号：US08115108B2

公开(公告)日：2012-02-14

申请号：US12291892

申请日：2008-11-14

Applicant: Nobuyuki Sakai

Inventor： Nobuyuki Sakai

IPC: H05K1/11

CPC classification number: H05K3/0061 ,  H05K1/0393 ,  H05K1/056 ,  H05K3/005 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4084 ,  H05K3/44 ,  H05K2201/091 ,  H05K2201/09554 ,  H05K2203/063 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: The insulation base side of single-sided FPC is turned to the die side, and the mounting surface side of ground circuit is turned to the upper side, and the FPC is placed on die (a). When the portion of ground circuit where the conduction is realized and metal reinforcing plate are punched by punch of which the clearance dimension is made to be 50 to 95% of the thickness of the material to be punched, hole sagging will be formed (b). The insulation base 1 side is turned up, electrically conductive adhesive and metal reinforcing plate are laminated in this order, heating pressing is performed with the press apparatus for metal reinforcing plate to be laminated (c). Thereby, laminated FPC is formed (d). At this time, since electrically conductive adhesive is injected into hole sagging by press pressing, the electrical connection of metal reinforcing plate and ground circuit can be attained by the interlaminar conduction by means of electrically conductive adhesive, and there is also no residual air.

Abstract translation: 单面FPC的绝缘基底侧向模具侧转动，接地电路的安装面侧向上侧转动，将FPC放置在模具（a）上。 当实现导通的接地电路的部分和金属加强板用冲孔冲压成冲孔材料厚度的50％至95％时，将形成孔下垂（b） 。 将绝缘基体1侧翻转，依次层压导电性粘合剂和金属加强板，用层叠（c）的金属加强板用加压装置进行加压加压。 由此形成层叠FPC（d）。 此时，由于通过压制将导电性粘合剂注入到孔下垂中，所以可以通过导电性粘合剂进行层间导电，可以实现金属加强板与接地电路的电连接，也不会有残留空气。

公开(公告)号：US20110277322A1

公开(公告)日：2011-11-17

申请号：US13187995

申请日：2011-07-21

Applicant: Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Masakazu Aoyama

IPC: H01K3/10

CPC classification number: H05K3/4691 ,  H05K1/0366 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/1536

Abstract: A wiring board and method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.

Abstract translation: 布线基板及布线基板的形成方法。 布线板包括第一基板和具有比第一基板的安装面积小的安装面积的第二基板。 基底衬底层压在第一衬底和第二衬底之间，使得第一衬底延伸超过第二衬底的边缘，以及形成在第一衬底或第二衬底中的至少一个衬底中的至少一个通孔。 夹在第一基板和第二基板之间的基底基板的一部分的厚度大于未被夹在第一基板和第二基板之间的基底部分的厚度。

公开(公告)号：US20110124155A1

公开(公告)日：2011-05-26

申请号：US13015739

申请日：2011-01-28

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: H01L21/50

CPC classification number: H05K1/147 ,  H01L23/13 ,  H01L23/5385 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/19107 ,  H05K1/142 ,  H05K3/4611 ,  H05K2201/058 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/0919 ,  H05K2201/09481 ,  Y10T29/417 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T428/24322 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first metal layer connects with a border district of the corresponding first dielectric layer. The border districts are separated from adjacent first metal layers and adjacent first dielectric layers. The second multi-layer substrate stacks up second metal layers and second dielectric layers alternately. A border district of a second metal layer connects with a border district of the corresponding second dielectric layer. The border districts are separated from adjacent second metal layers and adjacent second dielectric layers. The VIAs are located at the border districts of the first dielectric layers and each VIA has electric conductor therein to connect one first metal layer with one second metal layer.

Abstract translation: 多层基板的混合结构包括第一多层基板和第二多层基板。 第一多层基板交替地堆叠第一金属层，第一介电层并具有VIA。 第一金属层的边界区域与相应的第一介电层的边界区域连接。 边界区域与相邻的第一金属层和相邻的第一介电层分离。 第二多层基板交替堆叠第二金属层和第二电介质层。 第二金属层的边界区域与相应的第二电介质层的边界区域连接。 边界区域与相邻的第二金属层和相邻的第二介电层分离。 VIA位于第一电介质层的边界区，并且每个VIA具有导电体，以将一个第一金属层与一个第二金属层连接。

公开(公告)号：US20110048619A1

公开(公告)日：2011-03-03

申请号：US12823946

申请日：2010-06-25

Applicant: Erwin Rinaldo Meinders ,  Gerwin Hermanus Gelinck

Inventor： Erwin Rinaldo Meinders ,  Gerwin Hermanus Gelinck

IPC: B32B38/00 ,  B32B38/10

CPC classification number: H05K3/4638 ,  H05K1/0393 ,  H05K3/4069 ,  H05K3/4635 ,  H05K2201/051 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2203/0108 ,  H05K2203/0228 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T156/1039

Abstract: The invention relates to a method of aligning a flexible foil sheet having a general first foil sheet length direction to form stacked foil sheet layers on a reel having a reel diameter. The method comprises providing multiple alignment markers in the foil sheet. distanced conform the reel diameter and each having an mark length direction transverse to the first foil sheet length direction, to form protrusions and corresponding recesses on opposite faces of the foil sheet; winding the foil sheet on the reel in the first foil sheet length direction of the foil sheet; and co-aligning the alignment markers to have protrusions of one mark matching with a recess of another mark, so as to block relative movement of the stacked foil sheet layers in the first foil sheet length direction. Preferably, the foil sheet layers are provided with device functionality to form a stacked foil sheet layered device.

Abstract translation: 本发明涉及一种对准具有一般第一箔片长度方向的柔性箔片的方法，以在具有卷轴直径的卷轴上形成叠层的箔片层。 该方法包括在箔片中提供多个对准标记。 间距适应卷轴直径并且每个具有横向于第一箔片长度方向的标记长度方向，以在箔片的相对面上形成突起和相应的凹槽; 在箔片的第一箔片长度方向上将箔片卷绕在卷轴上; 并且使对准标记共同对准具有与另一标记的凹部匹配的一个标记的突起，以阻止层叠的箔片层在第一箔片长度方向上的相对移动。 优选地，箔片层具有器件功能以形成层叠的箔片层状器件。

公开(公告)号：US07896470B2

公开(公告)日：2011-03-01

申请号：US11952194

申请日：2007-12-07

Applicant: John Doran

Inventor： John Doran

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/17546 ,  B41J2/1753 ,  B41J2/1755 ,  B41J2/17553 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0064 ,  H05K2201/091 ,  H05K2203/163 ,  Y10T29/49401

Abstract: An assembly includes a flexible electrical circuit and a housing having a support surface configured to receive the flexible electrical circuit. A plurality of three-dimensional impressions are symmetrically positioned across the support surface and extending below the support surface. The plurality of three-dimensional impressions are deformed when the flexible circuit is joined to the support surface.

Abstract translation: 组件包括柔性电路和具有构造成接收柔性电路的支撑表面的壳体。 多个三维印模被对称地定位在支撑表面上并延伸到支撑表面下方。 当柔性电路连接到支撑表面时，多个三维印模变形。

公开(公告)号：US20100233916A1

公开(公告)日：2010-09-16

申请号：US12308323

申请日：2007-06-12

Applicant: Peter Kimmich

Inventor： Peter Kimmich

IPC: H01R4/48

CPC classification number: H05K3/326 ,  H01R12/62 ,  H01R13/24 ,  H05K1/0313 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/091

Abstract: An electrical contacting device, e.g., for electronic circuits, has an electrically non-conductive substrate on which at least one electrically conductive contact element is situated. The contacting device is designed as a touch contacting device, while the substrate is made of or has an elastically resilient material for applying a contact pressure.

Abstract translation: 例如用于电子电路的电接触装置具有非导电衬底，至少一个导电接触元件位于其上。 接触装置设计为触摸接触装置，而基底由用于施加接触压力的弹性材料制成或具有弹性弹性材料。

公开(公告)号：US07785113B2

公开(公告)日：2010-08-31

申请号：US11885262

申请日：2006-10-27

Applicant: Masanori Mizoguchi

Inventor： Masanori Mizoguchi

IPC: H01R12/00

CPC classification number: H01R12/592 ,  H01R12/58 ,  H01R12/613 ,  H01R12/62 ,  H01R12/777 ,  H01R12/778 ,  H01R12/78 ,  H01R12/79 ,  H05K1/118 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/0969 ,  H05K2201/1059 ,  H05K2201/209

Abstract: An electrical connection structure allowing reduction in height and easy disassembly, wherein a first connecting member comprises a flexible substrate comprising a flexible insulating film, at least one conductive pad formed on at least one side thereof, a conductive circuit pattern extending from the rim of the pad, a through-hole formed through the thickness thereof at a planar position within the pad, and a small aperture formed at a planar position within the pad and communicating with the through-hole, and a second connecting member comprises a conductive projection formed at least one side thereof and electrically connected with a conductive circuit pattern formed inside or on the second connecting member, where the electrical connection is formed in the manner such that the conductive projection of the second connecting member is inserted in the through-hole of the first connecting member, through the small aperture in the pad, bending the pad and the portion of the insulating film under the pad, along the direction of insertion of the conductive projection, so that the pad is pressed onto the conductive projection due to elastic force of the pad and the insulating film bent.

Abstract translation: 一种电连接结构，其允许降低高度并易于拆卸，其中第一连接构件包括柔性基底，该柔性基底包括柔性绝缘膜，至少一个导电垫在其至少一侧上形成，导电电路图案从 衬垫，在衬垫内的平面位置处形成通过其厚度的通孔，以及形成在衬垫内的平面位置并与通孔连通的小孔，第二连接构件包括形成在 至少一个侧面，与形成在第二连接构件的内部或第二连接构件上的导电电路图案电连接，其中电连接形成为使得第二连接构件的导电突起插入第一连接构件的通孔中 连接构件，通过垫中的小孔，弯曲垫和绝缘f的部分 沿着导电突起的插入方向在衬垫下面，使得由于焊盘的弹性力和绝缘膜弯曲而将焊盘压在导电突起上。

公开(公告)号：US20100147573A1

公开(公告)日：2010-06-17

申请号：US12717171

申请日：2010-03-04

Applicant: Yutaka FUKUDA

Inventor： Yutaka FUKUDA

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/30 ,  H05K3/42

CPC classification number: H05K1/183 ,  H01L21/481 ,  H01L21/4853 ,  H01L23/13 ,  H01L23/16 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/245 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4697 ,  H05K2201/0367 ,  H05K2201/091 ,  H05K2203/0278 ,  H05K2203/308 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49165 ,  Y10T156/10 ,  Y10T156/1052 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A thin circuit substrate and a circuit module are arranged such that the circuit module includes an IC mounted on a circuit substrate, the IC includes an IC body and an solder bump located on a mounting surface of the IC body, and the circuit substrate includes a substrate including a recess formed by recessing a portion of a mounting surface of the substrate on which the IC is to be mounted, and a terminal protruding from the mounting surface of the substrate. The terminal is to be electrically connected to the solder bump.

Abstract translation: 薄电路基板和电路模块被布置成使得电路模块包括安装在电路基板上的IC，该IC包括位于IC体的安装表面上的IC体和焊料凸块，并且电路基板包括： 基板，其包括通过凹入其上将要安装IC的基板的安装表面的一部分而形成的凹部和从基板的安装表面突出的端子。 端子将电连接到焊料凸块。