公开(公告)号：US08760234B2

公开(公告)日：2014-06-24

申请号：US13550950

申请日：2012-07-17

Applicant: Shogo Inaba

Inventor： Shogo Inaba

IPC: H03B5/30

CPC classification number: H03H9/2457 ,  B81B3/007 ,  B81B2201/014 ,  H03H3/0072 ,  H03H2009/02283 ,  H03H2009/02456 ,  H03H2009/02511

Abstract: A MEMS vibrator includes: a substrate; a first electrode disposed above the substrate; and a second electrode disposed in a state where at least one portion of the second electrode has a space between the first electrode and the second electrode, and having a beam portion capable of vibrating, in the thickness direction of the substrate, with electrostatic force and a supporting portion supporting one edge of the beam portion and disposed above the substrate, wherein a supporting side face of the supporting portion supporting the one edge has a bending portion which bends in plan view from the thickness direction of the substrate, and the one edge is supported by the supporting side face including the bending portion.

Abstract translation: MEMS振动器包括：基板; 设置在所述基板上方的第一电极; 以及第二电极，其设置在所述第二电极的至少一部分具有在所述第一电极和所述第二电极之间的空间的状态下，并且具有能够在所述基板的厚度方向上以静电力振动的光束部分， 支撑部分，其支撑梁部分的一个边缘并且设置在基板上方，其中支撑所述一个边缘的支撑部分的支撑侧面具有从基板的厚度方向在平面图中弯曲的弯曲部分，并且所述一个边缘 由包括弯曲部的支撑侧面支撑。

公开(公告)号：US20140166463A1

公开(公告)日：2014-06-19

申请号：US14184950

申请日：2014-02-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Christopher V. JAHNES ,  Anthony K. STAMPER

IPC: H01H1/00

CPC classification number: B81B3/0072 ,  B81B3/0021 ,  B81B2201/01 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00365 ,  B81C1/00476 ,  B81C1/00619 ,  B81C1/00626 ,  B81C1/00666 ,  B81C2201/0109 ,  B81C2201/013 ,  B81C2201/0167 ,  B81C2201/017 ,  B81C2203/0136 ,  B81C2203/0172 ,  G06F17/5068 ,  G06F17/5072 ,  H01H1/0036 ,  H01H57/00 ,  H01H59/0009 ,  H01H2057/006 ,  H01L41/1136 ,  H01L2924/0002 ,  Y10S438/937 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49105 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/5313 ,  H01L2924/00

Abstract: A method of forming a Micro-Electro-Mechanical System (MEMS) includes forming a lower electrode on a first insulator layer within a cavity of the MEMS. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode. The forming of the lower electrode and the upper electrode includes adjusting a metal volume of the lower electrode and the upper electrode to modify beam bending.

Abstract translation: 形成微机电系统（MEMS）的方法包括在MEMS的空腔内的第一绝缘体层上形成下电极。 该方法还包括在下部电极的顶部上形成上部电极，该上部电极至少部分地与下部电极接触。 下电极和上电极的形成包括调节下电极和上电极的金属体积以改变光束弯曲。

公开(公告)号：US20140034465A1

公开(公告)日：2014-02-06

申请号：US13961279

申请日：2013-08-07

Applicant: OMRON Corporation

Inventor： Takahiro Masuda ,  Naoki Yoshitake ,  Kenichi Hinuma ,  Junya Yamamoto ,  Takashi Fujisawa ,  Takeshi Fujiwara

IPC: H01H1/06

CPC classification number: H01H1/06 ,  B81B2201/014 ,  B81C1/00166 ,  B81C2201/0177 ,  B81C2201/0181 ,  B81C2201/0184 ,  H01H1/0036 ,  H01H2001/0052 ,  Y10T29/49105

Abstract: A switch and a relay include a contact with a smooth contacting surface. A side surface of a fixed contact faces a side surface of a movable contact. The fixed contact has an insulating layer and a base layer stacked on a fixed contact substrate, and a first conductive layer formed thereon through electrolytic plating. The side surface of the first conductive layer that faces the movable contact becomes the fixed contact (contacting surface). The movable contact has an insulating layer and a base layer stacked on the movable contact substrate, and a movable contact formed thereon through electrolytic plating. A side surface of a second conductive layer that faces the fixed contact becomes the movable contact (contacting surface). The fixed contact and the movable contact have surfaces that contact the side surfaces of the mold portion when growing the first and second conductive layers through electrolytic plating.

Abstract translation: 开关和继电器包括具有光滑接触表面的触点。 固定触点的侧表面面对活动触点的侧表面。 固定触点具有层叠在固定接触基板上的绝缘层和基层，以及通过电解电镀形成在其上的第一导电层。 第一导电层的面对可动触点的侧表面成为固定触点（接触面）。 可动触头具有堆叠在可动触点基板上的绝缘层和基极层，以及通过电解电镀形成的可动触点。 面对固定触点的第二导电层的侧表面成为可动触头（接触面）。 固定触点和可动触点具有通过电解电镀生长第一和第二导电层时与模具部分的侧表面接触的表面。

公开(公告)号：US08587106B2

公开(公告)日：2013-11-19

申请号：US11761108

申请日：2007-06-11

Applicant: Carl O. Bozler ,  Jeremy Muldavin ,  Peter W. Wyatt ,  Craig L. Keast ,  Steven Rabe

Inventor： Carl O. Bozler ,  Jeremy Muldavin ,  Peter W. Wyatt ,  Craig L. Keast ,  Steven Rabe

IPC: H01L23/02

CPC classification number: H01P3/08 ,  B81B7/0064 ,  B81B2201/014 ,  B81B2207/07 ,  B81C2203/0109 ,  B81C2203/036 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A device includes a device wafer having a circuit component formed thereon and having vias formed therein and a cap wafer bonded to the device wafer. The cap wafer has a cavity therein. The cavity has a post formed therein, and the post is positioned to mechanically support the vias formed in the device wafer. The cavity has a volume, the volume substantially enclosing the circuit component formed on the device wafer. The cavity has a width and height such that an impedance of a transmission line is dependent upon the width and height of the cavity, or the impedance of a transmission line is dependent upon the width of a center conductor within the cavity.

Abstract translation: 一种器件包括具有形成在其上的电路部件并且具有形成在其中的通孔的器件晶片和结合到器件晶片的帽晶片。 盖晶片在其中具有空腔。 空腔具有形成在其中的柱，并且柱被定位成机械地支撑形成在器件晶片中的通孔。 空腔具有体积，该体积基本上包围形成在器件晶片上的电路部件。 空腔具有宽度和高度，使得传输线的阻抗取决于空腔的宽度和高度，或者传输线的阻抗取决于腔内的中心导体的宽度。

公开(公告)号：US08570705B2

公开(公告)日：2013-10-29

申请号：US13007255

申请日：2011-01-14

Applicant: Dana DeReus

Inventor： Dana DeReus

IPC: H01G7/00 ,  H01G7/06

CPC classification number: H01G5/18 ,  B81B3/007 ,  B81B2201/014 ,  H02N1/006

Abstract: The present subject matter relates to MEMS tunable capacitors and methods for operating such capacitors. The tunable capacitor can feature a primary stationary actuator electrode on a substrate, a secondary stationary actuator electrode on the substrate, a stationary RF signal capacitor plate electrode on the substrate, a sprung cantilever disposed over the substrate, a beam anchor connecting a first end of the sprung cantilever to the substrate, and one or more elastic springs or other biasing members connecting a second end of the sprung cantilever to the substrate, the second end being located distally from the first end. The spring cantilever can be movable between an OFF state defined by the potential difference between the stationary and moveable actuator electrodes being zero, and an ON state defined by a non-zero potential difference between the stationary and moveable actuator electrodes.

Abstract translation: 本主题涉及MEMS可调电容器和用于操作这种电容器的方法。 可调谐电容器可以在基板上具有主固定致动器电极，在基板上具有次级固定致动器电极，在基板上具有固定RF信号电容器板电极，设置在基板上的弹簧悬臂梁，连接第一端 弹簧悬臂连接到基板，以及一个或多个弹簧或其他偏置构件，将弹簧悬臂的第二端连接到基板，第二端位于远离第一端的位置。 弹簧悬臂可以在由静止和可动执行器电极之间的电位差为零定义的OFF状态和由固定和可动执行器电极之间的非零电位差限定的ON状态之间移动。

公开(公告)号：US08564387B1

公开(公告)日：2013-10-22

申请号：US13707084

申请日：2012-12-06

Applicant: RF Micro Devices, Inc.

Inventor： Jonathan H. Hammond

IPC: H01H51/22

CPC classification number: B81B7/0019 ,  B81B2201/014 ,  H01H59/0009 ,  H01H2001/0084 ,  Y10T29/49105

Abstract: A micro-electromechanical systems (MEMS) includes a substrate onto which a first conductive pad and a second conductive pad are formed. A conductive anchor coupled to the first conductive pad is a semi-circular frame that includes a first radial tab and a second radial tab. A conductive cantilever disc has a first end portion, a middle portion, and a second end portion. The first end portion of the conductive cantilever disc is coupled to the first radial tab and the second radial tab of the conductive anchor. The second end portion of the conductive cantilever disc is suspended over the second conductive pad with the middle portion being between the first end portion and the second end portion. A conductive actuator plate is formed onto the substrate at a location beneath the middle portion of the cantilever disc and between the first conductive pad and the second conductive pad.

公开(公告)号：US20130234265A1

公开(公告)日：2013-09-12

申请号：US13868147

申请日：2013-04-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Anthony K. Stamper ,  John G. Twombly

IPC: B81B3/00 ,  G06F17/50

CPC classification number: B81B3/0072 ,  B81B3/0021 ,  B81B2201/01 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00365 ,  B81C1/00476 ,  B81C1/00619 ,  B81C1/00626 ,  B81C1/00666 ,  B81C2201/0109 ,  B81C2201/013 ,  B81C2201/0167 ,  B81C2201/017 ,  B81C2203/0136 ,  B81C2203/0172 ,  G06F17/5068 ,  G06F17/5072 ,  H01H1/0036 ,  H01H57/00 ,  H01H59/0009 ,  H01H2057/006 ,  H01L41/1136 ,  H01L2924/0002 ,  Y10S438/937 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49105 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/5313 ,  H01L2924/00

Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.

Abstract translation: 形成至少一个微电子机械系统（MEMS）的方法包括：对布线层进行图案化以形成至少一个固定板并在布线层上形成牺牲材料。 该方法还包括在至少一个固定板上形成一层或多层薄膜的绝缘体层，以及下层衬底的暴露部分，以防止在布线层和牺牲材料之间形成反应产物。 该方法还包括形成至少一个可在该至少一个固定板上移动的MEMS光束。 该方法还包括排出或剥离牺牲材料以形成至少第一腔。

公开(公告)号：US20130154033A1

公开(公告)日：2013-06-20

申请号：US13758447

申请日：2013-02-04

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Brian M. CZABAJ ,  David A. DeMUYNCK ,  Anthony K. STAMPER

IPC: H01L29/84 ,  G06F17/50

CPC classification number: H01L29/84 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2207/015 ,  B81C1/0015 ,  B81C1/00246 ,  G06F17/5068 ,  H01H2057/006

Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes layering metal and insulator materials on a sacrificial material formed on a substrate. The method further includes masking the layered metal and insulator materials. The method further includes forming an opening in the masking which overlaps with the sacrificial material. The method further includes etching the layered metal and insulator materials in a single etching process to form the beam structure, such that edges of the layered metal and insulator material are aligned. The method further includes forming a cavity about the beam structure through a venting.

公开(公告)号：US20130032570A1

公开(公告)日：2013-02-07

申请号：US13195949

申请日：2011-08-02

Applicant: John E. Rogers

Inventor： John E. Rogers

IPC: H05K3/46 ,  H01H11/00

CPC classification number: B81C1/00714 ,  B81B2201/014 ,  B81B2203/0109 ,  B81B2207/03 ,  B81B2207/99 ,  B81C1/00341 ,  B81C2201/0143 ,  B81C2203/037 ,  H01H1/0036 ,  H01H59/0009 ,  H01H2001/0073

Abstract: A method for manufacturing a micro electro-mechanical system (MEMS) switch system (600, 700) includes etching each of a plurality of base circuit layers (425) and a plurality of passive component substrate layers (412, 418, 42, 426). The method continues with laser milling of a first dielectric film (406) to create a spacer layer (405). A metal cladding (402, 403) formed on a flexible dielectric film layer 404 is etched so as to form a plurality of switch component features. Further laser milling is performed with respect to the flexible dielectric film layer to form at least one switch structure (448, 450). Thereafter, a stack (400) is assembled which is comprised of the spacer layer disposed between the flexible dielectric film layer and the plurality of base circuit layers. Additional layers can also be included in the stack. When the stack is completed, heat and pressure are applied to join the various layers forming the stack.

Abstract translation: 一种用于制造微机电系统（MEMS）开关系统（600,700）的方法包括蚀刻多个基极电路层（425）和多个无源部件衬底层（412,418,42,426）中的每一个， 。 该方法继续激光研磨第一介电膜（406）以产生间隔层（405）。 形成在柔性电介质膜层404上的金属覆层（402,403）被蚀刻以形成多个开关元件特征。 相对于柔性电介质膜层进行激光研磨以形成至少一个开关结构（448,450）。 此后，组装叠层（400），其由设置在柔性电介质膜层和多个基极电路层之间的间隔层组成。 堆栈中还可以包含附加层。 当堆叠完成时，施加热和压力以连接形成堆叠的各种层。

公开(公告)号：US08354901B1

公开(公告)日：2013-01-15

申请号：US12709979

申请日：2010-02-22

Applicant: Jonathan Hale Hammond

Inventor： Jonathan Hale Hammond

IPC: H01H51/22

CPC classification number: B81B7/0019 ,  B81B2201/014 ,  H01H59/0009 ,  H01H2001/0084 ,  Y10T29/49105

Abstract: A micro-electromechanical systems (MEMS) includes a substrate onto which a first conductive pad and a second conductive pad are formed. A conductive anchor coupled to the first conductive pad is a semi-circular frame that includes a first radial tab and a second radial tab. A conductive cantilever disc has a first end portion, a middle portion, and a second end portion. The first end portion of the conductive cantilever disc is coupled to the first radial tab and the second radial tab of the conductive anchor. The second end portion of the conductive cantilever disc is suspended over the second conductive pad with the middle portion being between the first end portion and the second end portion. A conductive actuator plate is formed onto the substrate at a location beneath the middle portion of the cantilever disc and between the first conductive pad and the second conductive pad.

Abstract translation: 微机电系统（MEMS）包括其上形成有第一导电焊盘和第二导电焊盘的基板。 耦合到第一导电焊盘的导电锚固体是包括第一径向突片和第二径向突片的半圆形框架。 导电悬臂盘具有第一端部，中间部分和第二端部。 导电悬臂盘的第一端部分耦合到导电锚的第一径向突片和第二径向突片。 导电悬臂盘的第二端部悬挂在第二导电垫上，中间部位在第一端部和第二端部之间。 导电致动器板在悬臂盘的中间部分下方的位置和第一导电焊盘与第二导电焊盘之间的位置处形成在基板上。