公开(公告)号：US07227432B2

公开(公告)日：2007-06-05

申请号：US11172143

申请日：2005-06-30

Applicant: Markus Lutz ,  Aaron Partridge ,  Zhiyu Pan

Inventor： Markus Lutz ,  Aaron Partridge ,  Zhiyu Pan

IPC: H03H9/46

CPC classification number: H03H9/2405 ,  H03H3/0076 ,  H03H9/02338 ,  H03H9/02448 ,  H03H9/2431 ,  H03H9/462 ,  H03H9/505 ,  H03H2009/02354 ,  H03H2009/0244 ,  H03H2009/02496 ,  H03H2009/02503 ,  H03H2009/02511 ,  H03H2009/02527

Abstract: A plurality of mechanically coupled MEMS resonators that are arranged in an N×M MEMS array structure. Each MEMS resonators includes a plurality of straight (or substantially straight) elongated beam sections that are connected by curved/rounded sections. Each elongated beam section is connected to another elongated beam section at a distal end via the curved/rounded sections thereby forming a geometric shape (e.g., a rounded square). Further, each resonator is mechanically coupled to at least one other adjacent resonator of the array via a resonator coupling section. The resonator coupling sections may be disposed between elongated beam sections of adjacent resonators. The resonators, when induced, oscillate at the same or substantially the same frequency. The resonators oscillate in a combined elongating (or breathing) mode and bending mode; that is, the beam sections exhibit an elongating-like (or breathing-like) motion and a bending-like motion. The one or more of the resonators of the array structure may include one or more nodal points or areas (i.e., portions of the resonator that are stationary, experience little movement, and/or are substantially stationary during oscillation of the resonator/array) in one or more portions or areas of the curved sections of the structure. The nodal points are suitable and/or preferable locations to anchor the resonator/array to the substrate.

公开(公告)号：US20070013464A1

公开(公告)日：2007-01-18

申请号：US11182299

申请日：2005-07-15

Applicant: Zhiyu Pan ,  Rob Candler ,  Markus Lutz ,  Aaron Partridge ,  Volker Materna ,  Gary Yama ,  Wilhelm Frey

Inventor： Zhiyu Pan ,  Rob Candler ,  Markus Lutz ,  Aaron Partridge ,  Volker Materna ,  Gary Yama ,  Wilhelm Frey

IPC: H03H9/24

CPC classification number: H03H9/505 ,  H03H9/0023 ,  H03H9/02338 ,  H03H9/2468 ,  H03H2009/02496

Abstract: There are many inventions described and illustrated herein, as well as many aspects and embodiments of those inventions. In one aspect, the present invention is directed to a resonator architecture including a plurality of in-plane vibration microelectromechanical resonators (for example, 2 or 4 resonators) that are mechanically coupled to provide, for example, a differential signal output. In one embodiment, the present invention includes four commonly shaped microelectromechanical tuning fork resonators (for example, tuning fork resonators having two or more rectangular-shaped or square-shaped tines). Each resonator is mechanically coupled to another resonator of the architecture. For example, each resonator of the architecture is mechanically coupled to another one of the resonators on one side or a corner of one of the sides. In this way, all of the resonators, when induced, vibrate at the same frequency.

Abstract translation: 这里描述和示出了许多发明，以及这些发明的许多方面和实施例。 在一个方面，本发明涉及一种包括机械耦合以提供例如差分信号输出的多个平面内振动微机电谐振器（例如，2或4个谐振器）的谐振器结构。 在一个实施例中，本发明包括四个通常形状的微机电音叉谐振器（例如，具有两个或更多个矩形或正方形形状的叉的音叉谐振器）。 每个谐振器机械耦合到该架构的另一谐振器。 例如，该架构的每个谐振器在其中一个侧面的一侧或拐角上机械耦合到另一个谐振器。 以这种方式，所有谐振器在被感应时以相同的频率振动。

公开(公告)号：US06952041B2

公开(公告)日：2005-10-04

申请号：US10627237

申请日：2003-07-25

Applicant: Markus Lutz ,  Aaron Partridge ,  Silvia Kronmueller

Inventor： Markus Lutz ,  Aaron Partridge ,  Silvia Kronmueller

IPC: B81B3/00 ,  G01P15/00 ,  H01L20060101 ,  H01L21/00 ,  H01L27/01 ,  H01L29/82 ,  H01L29/84

CPC classification number: B81B3/0054 ,  B81B2203/0307 ,  B81C1/00126

Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised of a material that is relatively unaffected by the release processes of the mechanical structures. In this regard, the etch release process are selective or preferential to the material(s) securing the mechanical structures in relation to the material comprising the anchors. Moreover, the anchors of the present invention are secured to the substrate in such a manner that removal of the insulation layer has little to no affect on the anchoring of the mechanical structures to the substrate.

Abstract translation: 这里描述和说明了许多发明。 一方面，本发明涉及一种MEMS器件，以及制造或制造具有机械结构和固定器的MEMS器件以将机械结构固定到衬底的技术。 本发明的锚固件由相对不受机械结构的释放过程影响的材料构成。 在这方面，蚀刻释放过程是选择性的或优先于相对于包括锚固件的材料固定机械结构的材料。 此外，本发明的锚固件以这样一种方式被固定到基底上，使得绝缘层的去除对机械结构锚固到基底上几乎没有影响。

公开(公告)号：US20050179099A1

公开(公告)日：2005-08-18

申请号：US10777326

申请日：2004-02-12

Applicant: Markus Lutz ,  Aaron Partridge

Inventor： Markus Lutz ,  Aaron Partridge

IPC: B81C1/00 ,  H01L21/00 ,  H01L29/84

CPC classification number: B81B7/0038 ,  B81C1/00269 ,  B81C1/00285 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: There are many inventions described and illustrated herein. In one aspect, present invention is directed to a thin film encapsulated MEMS, and technique of fabricating or manufacturing a thin film encapsulated MEMS including an integrated getter area and/or an increased chamber volume, which causes little to no increase in overall dimension(s) from the perspective of the mechanical structure and chamber. The integrated getter area is disposed within the chamber and is capable of (i) “capturing” impurities, atoms and/or molecules that are out-gassed from surrounding materials and/or (ii) reducing and/or minimizing the adverse impact of such impurities, atoms and/or molecules (for example, reducing the probability of adding mass to a resonator which would thereby change the resonator's frequency). In this way, the thin film wafer level packaged MEMS of the present invention includes a relatively stable, controlled pressure environment within the chamber to provide, for example, a more stable predetermined, desired and/or selected mechanical damping of the mechanical structure.

Abstract translation: 这里描述和说明了许多发明。 一方面，本发明涉及一种薄膜封装的MEMS，以及制造或制造包括集成吸气剂区域和/或增加的室容积的薄膜封装的MEMS的技术，其几乎不会增加整体尺寸（s ）从机械结构和室的角度。 集成的吸气剂区域设置在室内，并且能够（i）“捕获”从周围材料中排出的杂质，原子和/或分子和/或（ii）减少和/或最小化其中的不利影响 杂质，原子和/或分子（例如，降低增加质量到共振器的概率，从而改变谐振器的频率）。 以这种方式，本发明的薄膜晶片级封装MEMS包括室内相对稳定的受控压力环境，以提供例如机械结构的更稳定的预定，期望和/或选择的机械阻尼。

公开(公告)号：US20050162239A1

公开(公告)日：2005-07-28

申请号：US11063794

申请日：2005-02-23

Applicant: Markus Lutz ,  Aaron Partridge

Inventor： Markus Lutz ,  Aaron Partridge

IPC: H01P7/10 ,  H03H20060101 ,  H03H9/00 ,  H03H9/02 ,  H03H9/24 ,  H03H9/50 ,  H03H9/54

CPC classification number: H03H9/02448 ,  B81B3/0072 ,  B81B2201/0271 ,  B81B2203/0118 ,  H03H9/02259 ,  H03H9/02338 ,  H03H9/02417 ,  H03H9/2457 ,  H03H9/2463 ,  H03H2009/02496 ,  H03H2009/02511

Abstract: Thermally induced frequency variations in a micromechanical resonator are actively or passively mitigated by application of a compensating stiffness, or a compressive/tensile strain. Various composition materials may be selected according to their thermal expansion coefficient and used to form resonator components on a substrate. When exposed to temperature variations, the relative expansion of these composition materials creates a compensating stiffness, or a compressive/tensile strain.

Abstract translation: 通过施加补偿刚度或压缩/拉伸应变，微机械谐振器中的热诱导频率变化被主动地或被动地减轻。 可以根据其热膨胀系数选择各种组合物材料，并用于在基底上形成共振器部件。 当暴露于温度变化时，这些组合物材料的相对膨胀产生补偿刚度或压缩/拉伸应变。

公开(公告)号：US20050151592A1

公开(公告)日：2005-07-14

申请号：US10754985

申请日：2004-01-09

Applicant: Aaron Partridge ,  Markus Lutz

Inventor： Aaron Partridge ,  Markus Lutz

IPC: H03B5/04 ,  H03B5/30 ,  H03L1/02 ,  H03L1/04 ,  H03L7/07 ,  H03L7/081 ,  H03L7/197 ,  H03L7/00

CPC classification number: H03L1/022 ,  H03B5/04 ,  H03B5/30 ,  H03L1/026 ,  H03L1/027 ,  H03L1/04 ,  H03L7/07 ,  H03L7/08 ,  H03L7/0812 ,  H03L7/1974

Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a compensated microelectromechanical oscillator, having a microelectromechanical resonator that generates an output signal and frequency adjustment circuitry, coupled to the microelectromechanical resonator to receive the output signal of the microelectromechanical resonator and, in response to a set of values, to generate an output signal having second frequency. In one embodiment, the values may be determined using the frequency of the output signal of the microelectromechanical resonator, which depends on the operating temperature of the microelectromechanical resonator and/or manufacturing variations of the microelectromechanical resonator. In one embodiment, the frequency adjustment circuitry may include frequency multiplier circuitry, for example, PLLs, DLLs, digital/frequency synthesizers and/or FLLs, as well as any combinations and permutations thereof. The frequency adjustment circuitry, in addition or in lieu thereof, may include frequency divider circuitry, for example, DLLS, digital/frequency synthesizers (for example, DDS) and/or FLLs, as well as any combinations and permutations thereof.

Abstract translation: 这里描述和说明了许多发明。 在一个方面，本发明涉及一种补偿的微机电振荡器，其具有产生输出信号和频率调节电路的微机电谐振器，耦合到微机电谐振器以接收微机电谐振器的输出信号，并响应于一组 以产生具有第二频率的输出信号。 在一个实施例中，可以使用取决于微机电谐振器的操作温度和/或微机电谐振器的制造变化的微机电谐振器的输出信号的频率来确定值。 在一个实施例中，频率调整电路可以包括倍频器电路，例如PLL，DLL，数字/频率合成器和/或FLL，以及它们的任何组合和排列。 频率调节电路，除了或代替它，可以包括分频器电路，例如DLLS，数字/频率合成器（例如，DDS）和/或FLL，以及它们的任何组合和排列。

公开(公告)号：US20050095833A1

公开(公告)日：2005-05-05

申请号：US10698258

申请日：2003-10-31

Applicant: Markus Lutz ,  Aaron Partridge

Inventor： Markus Lutz ,  Aaron Partridge

IPC: B62K1/00 ,  B81C1/00 ,  H01L20060101 ,  H01L21/00 ,  H01L21/44 ,  H01L29/82

CPC classification number: B81C1/0096 ,  B81B3/0005 ,  B82Y10/00 ,  B82Y30/00

Abstract: There are many inventions described and illustrated herein. In one aspect, present invention is directed to a thin film or wafer encapsulated MEMS, and technique of fabricating or manufacturing a thin film or wafer encapsulated MEMS employing the anti-stiction techniques of the present invention. In one embodiment, after encapsulation of the MEMS, an anti-stiction channel is formed thereby providing “access” to the chamber containing some or all of the active members or electrodes of the mechanical structures of the MEMS. Thereafter, an anti-stiction fluid (for example, gas or gas-vapor) is introduced into the chamber via the anti-stiction channel. The anti-stiction fluid may deposit on one, some or all of the active members or electrodes of the mechanical structures thereby providing an anti-stiction layer (for example, a monolayer coating or self-assembled monolayer) and/or out-gassing molecules on such members or electrodes. After introduction and/or application of the anti-stiction fluid, the anti-stiction channel may be sealed, capped, plugged and/or closed to define and control the mechanical damping environment within the chamber. In this regard, sealing, capping and/or closing the chamber establishes the environment within the chamber containing and/or housing the mechanical structures. This environment provides the predetermined, desired and/or selected mechanical damping of the mechanical structure as well as suitable hermeticity. The parameters (for example, pressure) of the final encapsulated fluid (for example, a gas or a gas vapor) in which the mechanical structures are to operate may be controlled, selected and/or designed to provide a desired and/or predetermined operating environment.

Abstract translation: 这里描述和说明了许多发明。 一方面，本发明涉及薄膜或晶片封装的MEMS，以及使用本发明的抗静电技术制造或制造薄膜或晶片封装的MEMS的技术。 在一个实施例中，在MEMS的封装之后，形成抗静电通道，从而提供“接入”室，其包含MEMS的机械结构的一些或全部有源部件或电极。 此后，抗静电液体（例如，气体或气体 - 蒸气）经由抗静电通道被引入腔室。 抗静电液体可以沉积在机械结构的一个，一些或所有活性部件或电极上，从而提供抗静电层（例如，单层涂层或自组装单层）和/或排气分子 在这些构件或电极上。 在引入和/或施加抗静电流体之后，防静电通道可被密封，封盖，堵塞和/或关闭以限定和控制室内的机械阻尼环境。 在这方面，腔室的密封，封盖和/或闭合在室内建立包含和/或容纳机械结构的环境。 该环境提供机械结构的预定的，期望的和/或选择的机械阻尼以及合适的气密性。 可以控制，选择和/或设计机械结构将要运行的最终封装流体（例如，气体或气体蒸气）的参数（例如压力），以提供期望的和/或预定的操作 环境。

公开(公告)号：US20050019974A1

公开(公告)日：2005-01-27

申请号：US10627237

申请日：2003-07-25

Applicant: Markus Lutz ,  Aaron Partridge ,  Silvia Kronmueller

Inventor： Markus Lutz ,  Aaron Partridge ,  Silvia Kronmueller

IPC: B81B3/00 ,  G01P15/00 ,  H01L20060101 ,  H01L21/00 ,  H01L27/01 ,  H01L29/82 ,  H01L29/84

CPC classification number: B81B3/0054 ,  B81B2203/0307 ,  B81C1/00126

Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised of a material that is relatively unaffected by the release processes of the mechanical structures. In this regard, the etch release process are selective or preferential to the material(s) securing the mechanical structures in relation to the material comprising the anchors. Moreover, the anchors of the present invention are secured to the substrate in such a manner that removal of the insulation layer has little to no affect on the anchoring of the mechanical structures to the substrate.

公开(公告)号：US06389899B1

公开(公告)日：2002-05-21

申请号：US09321061

申请日：1999-05-27

Applicant: Aaron Partridge ,  Alissa M. Fitzgerald ,  Benjamin W. Chui ,  Jospeh Kurth Reynolds ,  Thomas W. Kenny

Inventor： Aaron Partridge ,  Alissa M. Fitzgerald ,  Benjamin W. Chui ,  Jospeh Kurth Reynolds ,  Thomas W. Kenny

IPC: G01P1512

CPC classification number: G01P15/123 ,  G01P15/0802 ,  G01P2015/0817

Abstract: A micromachined accelerometer for measuring acceleration in a direction parallel with the plane of the accelerometer substrate. The accelerometer has a strain-isolation pedestal, a flexure attached to the pedestal, and a proof mass attached to the flexure. The pedestal is wider than the flexure and does not bend when the device is under acceleration. The pedestal serves to isolate the flexure from substrate strain which may be caused by device packaging or temperature variations. Preferably, the joint between the pedestal and flexure, and the joint between the flexure and proof mass are smoothed to prevent stress concentration. The joints have a radius of curvature of at least 1 micron. A piezoresistor is located in one sidewall of the flexure. Alternatively, two piezoresistors are located on the flexure, with one on each sidewall. In this embodiment, a center-tap connection is provided to the point where the two piezoresistors are connected. The present invention includes devices having two accelerometers with Large proof masses and two reference accelerometers having very small proof masses. The four accelerometers are electrically connected in a wheatstone bridge circuit. Also, in the embodiment having two piezoresistors on one flexure, two accelerometers (with a total of four piezoresistors) are electrically connected in a Wheatstone bridge circuit to provide accurate acceleration sensing.

Abstract translation: 一种微机械加速度计，用于测量与加速度计基板的平面平行的方向上的加速度。 加速度计具有应变隔离基座，附接到基座的挠曲件和附接到挠曲件的检验质量块。 基座比挠曲件宽，当设备处于加速状态时不会弯曲。 基座用于隔离可能由器件封装或温度变化引起的基板应变的挠曲。 优选地，基座和挠曲件之间的接头以及挠曲和检测质量块之间的接头被平滑以防止应力集中。 接头的曲率半径至少为1微米。 压敏电阻位于挠曲件的一个侧壁。 或者，两个压敏电阻位于挠曲件上，每个侧壁上有一个。 在本实施例中，中心抽头连接被提供到两个压敏电阻连接的点。 本发明包括具有两个具有大质量检测质量的加速度计和具有非常小的检验质量的两个参考加速度计的装置。 四个加速度计在惠斯通电桥电路中电连接。 此外，在一个弯曲部上具有两个压敏电阻的实施例中，两个加速度计（总共四个压敏电阻器）在惠斯通电桥电路中电连接以提供精确的加速度感测。

公开(公告)号：US09022644B1

公开(公告)日：2015-05-05

申请号：US13607597

申请日：2012-09-07

Applicant: Carl Arft ,  Aaron Partridge ,  Paul M. Hagelin

Inventor： Carl Arft ,  Aaron Partridge ,  Paul M. Hagelin

IPC: G01K3/00 ,  G01K7/00 ,  G01K1/00 ,  G01K13/02

CPC classification number: G01K7/226 ,  G01K13/02

Abstract: The present inventions, in one aspect, are directed to a temperature sensing apparatus comprising a micromachined thermistor configured to output voltage and/or current signals which are/is correlated to an ambient temperature. The micromachined thermistor includes a micromachined thermistor structure suspended over and released from the substrate, wherein the micromachined thermistor structure includes a temperature dependent characteristic (e.g., resistance to an electrical current), and electrical contacts connected to the micromachined thermistor structure, wherein the electrical contacts are adapted to conduct the voltage and/or current signals. The apparatus, in one aspect, includes measurement circuitry, to generate data which is representative of the ambient temperature using the electrical resistance of the micromachined thermistor structure.

Abstract translation: 本发明在一个方面涉及一种温度感测装置，其包括微加工热敏电阻，其构造成输出与环境温度相关的电压和/或电流信号。 微加工热敏电阻包括悬浮在基板上并从基板释放的微加工热敏电阻结构，其中微加工热敏电阻结构包括温度依赖特性（例如，耐电流），以及连接到微加工热敏电阻结构的电触点，其中电触点 适于传导电压和/或电流信号。 该装置在一个方面包括测量电路，以使用微加工热敏电阻结构的电阻产生代表环境温度的数据。