公开(公告)号：US20050263883A1

公开(公告)日：2005-12-01

申请号：US11134223

申请日：2005-05-20

Applicant: Tong-Hong Wang ,  Yi-Shao Lai ,  Jeng-Da Wu

Inventor： Tong-Hong Wang ,  Yi-Shao Lai ,  Jeng-Da Wu

IPC: H01L23/48 ,  H01L23/485

CPC classification number: H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014

Abstract: An asymmetric bump structure for wafer is provided. First, the wafer includes multi-chip units each of which has an active surface. The asymmetric bump structure includes a conductive surface on the active surface, a conductive structure contacted the portion of the conductive surface and located on the both conductive surface and the active surface, and a conductive material contacted the conductive structure. The conductive material and the conductive structure contacted part of the conductive surface have respective geometric centers which are not on an identical vertical axis.

Abstract translation: 提供了一种用于晶片的不对称凸块结构。 首先，晶片包括各自具有活性表面的多芯片单元。 不对称凸块结构包括在有源表面上的导电表面，导电结构接触导电表面的部分并且位于导电表面和有源表面上，导电材料与导电结构接触。 导电材料和与导电表面接触的部分的导电结构具有不在相同垂直轴上的相应几何中心。

公开(公告)号：US20050224969A1

公开(公告)日：2005-10-13

申请号：US10907400

申请日：2005-03-31

Applicant: Jeng-Da Wu

Inventor： Jeng-Da Wu

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L21/563 ,  H01L23/3128 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A chip package structure comprises a carrier, a chip and an underfill. The chip has an active surface on which a plurality of bumps are formed. The chip is flip-chip bonded onto the carrier with the active surface facing the carrier, and is electrically connected to the carrier through the bumps. The underfill is filled between the chip and the carrier. A portion of the underfill near the chip serves as a first underfill portion. The portion of the underfill near the carrier serves as a second underfill portion. The Young's modulus of the first underfill portion is smaller than the Young's modulus of the second underfill portion. The second underfill portion can be optionally replaced with a selected encapsulation. The selected encapsulation covers the chip and the carrier around the chip.

Abstract translation: 芯片封装结构包括载体，芯片和底部填充物。 芯片具有形成有多个凸起的活性表面。 该芯片以有源表面面向载体的方式倒装芯片结合到载体上，并通过凸块与载体电连接。 底部填充物填充在芯片和载体之间。 芯片附近的一部分底部填充物用作第一底部填充部分。 载体附近的底部填充部分用作第二底部填充部分。 第一底部填充部分的杨氏模量小于第二底部填充部分的杨氏模量。 第二底部填充部分可以任选地用选择的封装代替。 所选择的封装覆盖芯片周围的芯片和载体。

公开(公告)号：US06864168B2

公开(公告)日：2005-03-08

申请号：US10604792

申请日：2003-08-18

Applicant: William Tze-You Chen ,  Ho-Ming Tong ,  Chun-Chi Lee ,  Su Tao ,  Chih-Huang Chang ,  Jeng-Da Wu ,  Wen-Pin Huang ,  Po-Jen Cheng

Inventor： William Tze-You Chen ,  Ho-Ming Tong ,  Chun-Chi Lee ,  Su Tao ,  Chih-Huang Chang ,  Jeng-Da Wu ,  Wen-Pin Huang ,  Po-Jen Cheng

IPC: H01L21/60 ,  H01L23/485 ,  H01L21/447

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05666 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13164 ,  H01L2224/78301 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 μm is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed.

Abstract translation: 接触垫上的凸块结构及其制造方法。 凸块包括球下冶金层，粘结块和焊接块。 在接触焊盘之上形成球下冶金层，通过压接工艺在焊球下方形成粘结物质。 厚度为4〜10μm的接合体由铜等材料制成。 焊接块形成在接合块上，使得接合块的侧壁也被封闭。

公开(公告)号：US07996169B2

公开(公告)日：2011-08-09

申请号：US12124782

申请日：2008-05-21

Applicant: Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

Inventor： Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

IPC: G01R27/02 ,  G01R17/06 ,  G01R27/04 ,  G01N22/00

CPC classification number: G01R27/32 ,  G01R35/00

Abstract: The invention related to a method and circuit that is used to compensate for S-parameters of a passive circuit which do not satisfy passivity. The method includes the following steps: (1) getting S-parameters which do not satisfy passivity, these S-parameters being composed of an S-parameter matrix S; (2) computing matrix [S×S′], wherein matrix S′ is a complex conjugate transposed matrix of the S-parameter matrix S; (3) computing the eigenvalues of the matrix [S×S′], and choosing an eigenvalue Ψ whose real part real(Ψ) is the biggest; (4) computing a compensating value ξ, the compensating value ξ being equal to real(Ψ)1/2×(1+ε), wherein the ε is a very small positive number; and (5) dividing each of the S-parameters by the compensating value ξ to get the compensated S-parameters.

Abstract translation: 本发明涉及一种用于补偿不满足被动无源电路的S参数的方法和电路。 该方法包括以下步骤：（1）获得不满足被动的S参数，这些S参数由S参数矩阵S组成; （2）计算矩阵[S×S']，其中矩阵S'是S参数矩阵S的复共轭转置矩阵; （3）计算矩阵的特征值[S×S']，并选择其实部实数（Ψ）最大的特征值Ψ; （4）计算补偿值＆xgr;补偿值＆xgr; 等于实数（Ψ）1/2×（1 +＆egr）），其中＆ 是一个非常小的正数; 和（5）将每个S参数除以补偿值＆xgr; 以获得补偿的S参数。

公开(公告)号：US07835149B2

公开(公告)日：2010-11-16

申请号：US12341395

申请日：2008-12-22

Applicant: Yang Li ,  Yu-Hsu Lin ,  Jeng-Da Wu ,  Lei Guo ,  Liang-Liang Cao ,  Liang-Qing Shan

Inventor： Yang Li ,  Yu-Hsu Lin ,  Jeng-Da Wu ,  Lei Guo ,  Liang-Liang Cao ,  Liang-Qing Shan

IPC: H05K7/20

CPC classification number: G06F1/20

Abstract: A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.

Abstract translation: 计算机外壳包括其中安装有多个发热部件的机架和气流引导结构。 气流引导结构包括风扇和连接到风扇的管道。 与风扇对准的一对气流出口限定在管道中。 管道包括在气流出口枢转地连接的多个枢转面板。 枢转面板被构造成将来自风扇的气流引导到底盘中的发热部件的不同位置。

公开(公告)号：US07760498B2

公开(公告)日：2010-07-20

申请号：US12137781

申请日：2008-06-12

Applicant: Liang-Qing Shan ,  Yang Li ,  Yu-Hsu Lin ,  Jeng-Da Wu ,  Liang-Liang Cao ,  Lei Guo

Inventor： Liang-Qing Shan ,  Yang Li ,  Yu-Hsu Lin ,  Jeng-Da Wu ,  Liang-Liang Cao ,  Lei Guo

IPC: H05K7/20

CPC classification number: H05K7/20563 ,  H05K7/186

Abstract: An electronic apparatus includes an enclosure (30), a circuit board (40), a fan module (20), and an air guiding element (10) mounted in the enclosure. The circuit board includes at least one heat generating component (41) thereon. The fan module has a fan (22) and an output opening (213) corresponding to the fan. The air guiding element comprises a resisting panel (11) and a guiding panel (12) comprises a free end that extends toward the output opening of the fan module. The at least one heat generating component and the output opening are on the same side of the resisting panel. The guiding panel defines a free end (127) and a connecting end (125) connecting the resisting panel. A plane defined by the ends of the guiding panel is aligned at an angle larger than 90 degrees relative to the resisting panel.

Abstract translation: 电子设备包括外壳（30），电路板（40），风扇模块（20）和安装在外壳中的空气引导元件（10）。 电路板包括至少一个发热部件（41）。 风扇模块具有与风扇对应的风扇（22）和输出开口（213）。 空气引导元件包括阻挡板（11），并且引导板（12）包括朝向风扇模块的输出开口延伸的自由端。 所述至少一个发热部件和所述输出开口位于所述抵抗板的同一侧。 引导板限定了连接抵抗板的自由端（127）和连接端（125）。 由引导板的端部限定的平面相对于电阻板以大于90度的角度排列。

公开(公告)号：US20100165579A1

公开(公告)日：2010-07-01

申请号：US12464560

申请日：2009-05-12

Applicant: QIN LI ,  YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

Inventor： QIN LI ,  YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

IPC: H05K7/20

CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K3/0064 ,  H05K7/205 ,  H05K2201/10409 ,  H05K2201/10734 ,  H05K2201/2009

Abstract: A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies.

Abstract translation: 电路板组件包括其上安装有两个散热组件的电路板和附接到电路板的下侧的L形背板。 每个散热组件在其相对的角部处包括至少一对固定构件。 背板包括第一部分和第二部分，每个部分限定与散热组件的固定部件相对应的至少一对圆形突起。

公开(公告)号：US20100097754A1

公开(公告)日：2010-04-22

申请号：US12341395

申请日：2008-12-22

Applicant: YANG LI ,  YU-HSU LIN ,  JENG-DA WU ,  LEI GUO ,  LIANG-LIANG CAO ,  LIANG-QING SHAN

Inventor： YANG LI ,  YU-HSU LIN ,  JENG-DA WU ,  LEI GUO ,  LIANG-LIANG CAO ,  LIANG-QING SHAN

IPC: H05K7/20

CPC classification number: G06F1/20

Abstract: A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.

Abstract translation: 计算机外壳包括其中安装有多个发热部件的机架和气流引导结构。 气流引导结构包括风扇和连接到风扇的管道。 与风扇对准的一对气流出口限定在管道中。 管道包括在气流出口枢转地连接的多个枢转面板。 枢转面板被构造成将来自风扇的气流引导到底盘中的发热部件的不同位置。

公开(公告)号：US07675753B2

公开(公告)日：2010-03-09

申请号：US12180215

申请日：2008-07-25

Applicant: Yang Li ,  Yu-Hsu Lin ,  Jeng-Da Wu

Inventor： Yang Li ,  Yu-Hsu Lin ,  Jeng-Da Wu

IPC: H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC classification number: G06F1/20 ,  G06F1/183 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A mounting apparatus for mounting a heat sink on a board, includes a first locking hole defined in the heat sink, a second locking hole defined in the board, and a locking member. The locking member includes a base and a rod. The base defines a hole. A bottom of the base forms a pair of separated elastic claws around the hole. The elastic claws are inserted through the first and second locking holes. The rod includes an expanded portion. The rod slides in the hole of the base with the expanded portion located inbetween the claws to expand the claws outwards to be larger than the second locking hole to lock the locking member on the board and to mount the heat sink on the board.

Abstract translation: 一种用于将散热器安装在板上的安装装置，包括限定在散热器中的第一锁定孔，限定在板中的第二锁定孔和锁定构件。 锁定构件包括基座和杆。 基座定义了一个孔。 底部的底部在孔周围形成一对分离的弹性爪。 弹性爪通过第一和第二锁定孔插入。 杆包括扩张部分。 杆在基座的孔中滑动，扩张部分位于爪之间，以将爪向外扩张以比第二锁定孔大，以将锁定构件锁定在板上并将散热器安装在板上。

公开(公告)号：US07663063B2

公开(公告)日：2010-02-16

申请号：US11737147

申请日：2007-04-19

Applicant: Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

Inventor： Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

IPC: H05K1/03

CPC classification number: H05K1/0253 ,  H05K1/0224 ,  H05K2201/09681

Abstract: A circuit board is provided for improving signal quality, including a signal plane for a plurality of signal traces arranged thereon and a ground plane formed by a plurality of tiles connected to each other in an array. Each tile is formed by ground traces. Different line segments of a signal trace mapped on the ground plane cross ground traces of the tiles at similar angles, thereby minimizing interaction between the ground traces and the signal traces to reduce differences in impedances of the signal traces.

Abstract translation: 提供电路板用于改善信号质量，包括布置在其上的多个信号迹线的信号平面和由阵列中彼此连接的多个瓦片形成的接地平面。 每个瓷砖由地面痕迹形成。 映射在接地平面上的信号迹线的不同线段以相似的角度交叉瓦片的接地迹线，从而最小化接地迹线和信号迹线之间的相互作用，以减少信号迹线的阻抗的差异。