公开(公告)号：US08256111B2

公开(公告)日：2012-09-04

申请号：US12645303

申请日：2009-12-22

Applicant: Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

Inventor： Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

IPC: H05K3/02 ,  H05K3/10

CPC classification number: H01L23/50 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0224 ,  H05K1/0253 ,  H05K2201/09281 ,  H05K2201/09681 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A method for laying out a circuit board includes following steps. A substrate board is formed with a plurality of board sides. A ground plane, including a plurality of tiles, is provided. Each ground trace tile is defined by a plurality of ground traces. A signal plane on the substrate board has a plurality of signal traces that comprise of a plurality of straight line segments. Any one ground trace of each tile is arranged at an angle other than zero degrees relative to one determined board side. The straight line segments is applied to be mapped on the ground plane crossing one ground trace of one tile within an angle range determined by the ground traces of the tile and an adjacent diagonal line of the tile. The one ground trace and the straight line segments are applied at an angle movable in a range from 22.5° to 32.5°.

Abstract translation: 布线电路板的方法包括以下步骤。 衬底板形成有多个板侧。 提供包括多个瓦片的接地平面。 每个接地迹线瓦片由多个接地迹线限定。 衬底板上的信号平面具有包括多个直线段的多个信号迹线。 每个瓦片的任何一个接地迹线相对于一个确定的电路板侧以非零度的角度布置。 直线段被施加以映射在跨越由瓦片的接地轨迹和瓦片的相邻对角线确定的角度范围内的一个瓦片的一个接地轨迹的接地平面上。 一个接地迹线和直线段以可在22.5°至32.5°的范围内的角度施加。

公开(公告)号：US07973244B2

公开(公告)日：2011-07-05

申请号：US11765453

申请日：2007-06-20

Applicant: Yu-Hsu Lin ,  Chan-Fei Tai ,  Jeng-Da Wu ,  Chih-Hang Chao

Inventor： Yu-Hsu Lin ,  Chan-Fei Tai ,  Jeng-Da Wu ,  Chih-Hang Chao

IPC: H05K1/03

CPC classification number: H05K1/0248 ,  H05K1/025 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/09227 ,  H05K2201/09281

Abstract: A printed circuit board includes a base formed from a plurality of woven fibers, and signal traces laid on the base. Each of the signal traces includes at least a straight line segment. The signal traces are laid on the base in such a manner that the line segments of the signal traces mapped on the base cross the fibers at angles not equal to zero degrees.

Abstract translation: 印刷电路板包括由多根编织纤维形成的底座和放置在基座上的信号迹线。 每个信号迹线至少包括直线段。 信号迹线以这样的方式铺设在基座上，使得映射在基座上的信号迹线的线段以不等于零度的角度跨越光纤。

公开(公告)号：US07633169B2

公开(公告)日：2009-12-15

申请号：US11679131

申请日：2007-02-26

Applicant: Jeng-Da Wu

Inventor： Jeng-Da Wu

IPC: H01L23/48

CPC classification number: H01L21/563 ,  H01L23/3128 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A chip package structure comprises a carrier, a chip and an underfill. The chip has an active surface on which a plurality of bumps is formed. The chip is flip-chip bonded onto the carrier with the active surface facing the carrier, and is electrically connected to the carrier through the bumps. The underfill is filled between the chip and the carrier. A portion of the underfill near the chip serves as a first underfill portion. The portion of the underfill near the carrier serves as a second underfill portion. The Young's modulus of the first underfill portion is smaller than the Young's modulus of the second underfill portion. The second underfill portion can be optionally replaced with a selected encapsulation. The selected encapsulation covers the chip and the carrier around the chip.

Abstract translation: 芯片封装结构包括载体，芯片和底部填充物。 芯片具有形成多个凸起的活性表面。 该芯片以有源表面面向载体的方式倒装芯片结合到载体上，并通过凸块与载体电连接。 底部填充物填充在芯片和载体之间。 芯片附近的一部分底部填充物用作第一底部填充部分。 载体附近的底部填充部分用作第二底部填充部分。 第一底部填充部分的杨氏模量小于第二底部填充部分的杨氏模量。 第二底部填充部分可以任选地用选择的封装代替。 所选择的封装覆盖芯片周围的芯片和载体。

公开(公告)号：US07447039B2

公开(公告)日：2008-11-04

申请号：US11309887

申请日：2006-10-17

Applicant: Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

Inventor： Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

IPC: H05K1/00

CPC classification number: H05K1/181 ,  H05K1/0203 ,  H05K2201/09418 ,  H05K2201/10522 ,  H05K2201/10598 ,  H05K2201/10734 ,  Y02P70/611

Abstract: A motherboard includes a circuit board, a first chip and a second chip disposed on the circuit board. Four securing holes are defined in the circuit board around the first chip, for mounting a heat dissipating module on the first chip. Two of the securing holes determine a first line, and the other two securing holes determine a second line parallel to the first line. A center of the second chip is located along a centerline between the first and second lines. Should the circuit board suffer from an impact, damage to the chips may be effectively minimized or prevented.

Abstract translation: 主板包括电路板，第一芯片和设置在电路板上的第二芯片。 在第一芯片周围的电路板中定义了四个固定孔，用于将散热模块安装在第一芯片上。 两个固定孔确定第一条线，另外两个固定孔确定与第一条线平行的第二条线。 第二芯片的中心位于第一和第二线之间的中心线处。 如果电路板受到冲击，可以有效地最小化或防止对芯片的损坏。

公开(公告)号：US20080089031A1

公开(公告)日：2008-04-17

申请号：US11309883

申请日：2006-10-17

Applicant: Jeng-Da Wu ,  Chih-Hang Chao ,  Yu-Hsu Lin

Inventor： Jeng-Da Wu ,  Chih-Hang Chao ,  Yu-Hsu Lin

IPC: H05K7/20

CPC classification number: H01L23/4093 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A heat sink assembly includes a printed circuit board, a chip mounted on a top surface of the board, and a heat sink attached onto the chip of the board. The heat sink includes a base, a plurality of fins extending up from the base, and a plurality of legs extending down from the base. The legs of the heat sink contact the top surface of the board to support the heat sink.

Abstract translation: 散热器组件包括印刷电路板，安装在板的顶表面上的芯片和附接到板的芯片上的散热器。 散热器包括基座，从基座向上延伸的多个翅片以及从基座向下延伸的多个腿部。 散热片的腿部接触板的顶面以支撑散热片。

公开(公告)号：US20050230828A1

公开(公告)日：2005-10-20

申请号：US10907780

申请日：2005-04-15

Applicant: Jeng-Da Wu

Inventor： Jeng-Da Wu

IPC: H01L23/498 ,  H01L29/40 ,  H05K1/11 ,  H05K3/34

CPC classification number: H01L23/49838 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09418 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip package structure is provided. The chip package structure has a chip and a carrier, wherein the carrier has a package substrate and a plurality of contacts. The package substrate has a carrying surface and a back surface. The chip is disposed on the carrying surface of the package substrate, and the contacts are disposed on the back surface of the package substrate in a pattern of a plurality of concentric circles. Additionally, the chip package structure can be disposed on a circuit board with solder balls formed on the contacts to form a circuit board package structure. The thermal stress exerted on the solder balls may be uniformly distributed in the carrier, the chip package structure, and the circuit board package structure. The bonding strength between the package substrate and the circuit board is improved.

Abstract translation: 提供了芯片封装结构。 芯片封装结构具有芯片和载体，其中载体具有封装基板和多个触点。 封装衬底具有承载表面和后表面。 芯片设置在封装基板的承载表面上，并且触点以多个同心圆的图案设置在封装基板的背面上。 此外，可以将芯片封装结构设置在电路板上，其中形成在触点上的焊球形成电路板封装结构。 施加在焊球上的热应力可以均匀分布在载体，芯片封装结构和电路板封装结构中。 提高了封装基板与电路基板的接合强度。

公开(公告)号：US08154879B2

公开(公告)日：2012-04-10

申请号：US11849306

申请日：2007-09-03

Applicant: Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

Inventor： Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K1/0271 ,  H05K1/0203 ,  H05K2201/09063 ,  H05K2201/10734

Abstract: A motherboard includes a printed circuit board, a first chip and a second chip arranged on the printed circuit board in parallel. A plurality of securing holes are defined in the printed circuit board around the first chip. At least one isolating hole is defined in the printed circuit board between the second chip and a first line determined by two of the securing holes close to the second chip. Should the printed circuit board suffer an impact, damage to the chips may be effectively minimized or prevented.

Abstract translation: 主板包括平行布置在印刷电路板上的印刷电路板，第一芯片和第二芯片。 在第一芯片周围的印刷电路板中限定多个固定孔。 在第二芯片和由靠近第二芯片的两个固定孔确定的第一线之间的印刷电路板中限定至少一个隔离孔。 如果印刷电路板受到冲击，则可以有效地最小化或防止对芯片的损坏。

公开(公告)号：US08154125B2

公开(公告)日：2012-04-10

申请号：US12138444

申请日：2008-06-13

Applicant: Jeng-Da Wu

Inventor： Jeng-Da Wu

IPC: H01L23/48

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/1148 ,  H01L2224/13022 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A chip package structure including a carrier, a chip, and an underfill layer is disclosed. The carrier has a number of bumps disposed thereon. The chip has an active surface. The chip is flip-chip bonded and electrically connected to the carrier through the bumps such that the active surface of the chip faces the carrier. The underfill layer is disposed on the carrier between the chip and the carrier such that a gap is maintained between the underfill layer and the chip.

Abstract translation: 公开了一种包括载体，芯片和底部填充层的芯片封装结构。 载体上设置有多个凸块。 该芯片具有活性表面。 芯片通过凸块倒装芯片结合并与载体电连接，使得芯片的有源表面面向载体。 底部填充层在芯片和载体之间设置在载体上，使得在底部填充层和芯片之间保持间隙。

公开(公告)号：US07407833B2

公开(公告)日：2008-08-05

申请号：US10908075

申请日：2005-04-27

Applicant: Jeng-Da Wu

Inventor： Jeng-Da Wu

IPC: H01L21/44

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/1148 ,  H01L2224/13022 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A chip package structure comprising a carrier, a chip and an underfill layer is disclosed. The carrier has a plurality of bumps disposed thereon. The chip has an active surface. The chip is flip-chip bonded and electrically connected to the carrier through the bumps such that the active surface of the chip faces the carrier. The underfill layer is disposed on the carrier between the chip and the carrier such that a gap is maintained between the underfill layer and the chip.

Abstract translation: 公开了一种包括载体，芯片和底部填充层的芯片封装结构。 载体具有设置在其上的多个凸块。 该芯片具有活性表面。 芯片通过凸块倒装芯片结合并与载体电连接，使得芯片的有源表面面向载体。 底部填充层在芯片和载体之间设置在载体上，使得在底部填充层和芯片之间保持间隙。

公开(公告)号：US20070202712A1

公开(公告)日：2007-08-30

申请号：US11309868

申请日：2006-10-16

Applicant: Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

Inventor： Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

IPC: H01R12/00

CPC classification number: G11B7/08582

Abstract: An exemplary optical disc drive apparatus includes a guide shaft configured to movably support a pickup head, and an elastically deformable member. The elastically deformable member includes a main body, and a cantilever slanting up from a middle part of a front edge of the main body. The cantilever is broad at a lower portion thereof and narrow at an upper portion thereof, and the cantilever is for resiliently pressing a corresponding end of the guide shaft. The elastically deformable member reduces a stress surface between the cantilever and the guide shaft, and lengthens the life span thereof.

Abstract translation: 一种示例性的光盘驱动装置，包括构造成可移动地支撑拾取头的引导轴和可弹性变形的构件。 弹性变形构件包括主体，并且悬臂从主体的前边缘的中间部分倾斜。 悬臂在其下部较宽，在其上部较窄，并且悬臂用于弹性地按压导向轴的相应端。 可弹性变形的构件减小了悬臂与引导轴之间的应力表面，延长了其使用寿命。