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公开(公告)号：US08633403B2
公开(公告)日：2014-01-21
申请号：US13270421
申请日：2011-10-11
Applicant: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mahammadinia , Ziv Wolkowicki , Amir Salehi
Inventor： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mahammadinia , Ziv Wolkowicki , Amir Salehi
IPC: H05K9/00
CPC classification number: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
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公开(公告)号：US08339798B2
公开(公告)日：2012-12-25
申请号：US12832885
申请日：2010-07-08
Applicant: Jahan Minoo , Anthony P. N. Bidmead , Michael Nikkhoo
Inventor： Jahan Minoo , Anthony P. N. Bidmead , Michael Nikkhoo
CPC classification number: H05K1/183 , H04R1/025 , H04R1/04 , H05K1/02 , H05K1/115 , H05K1/181 , H05K1/185 , H05K2201/0919 , H05K2201/10053 , H05K2201/10083 , H05K2201/10356 , H05K2201/10446
Abstract: Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mounted. Recesses may be provided with solder pads to which the wires may be soldered or attached with conductive adhesive. An integrated switch may be provided in an opening within a printed circuit board substrate. The integrated switch may have a dome switch member that is mounted within the opening. A cover member for the switch may be formed from a flexible layer that covers the dome switch member. Terminals for the integrated switch may be formed from conductive structures in an interior printed circuit board layer. Interconnects may be used to electrically connect embedded components such as switches, integrated circuits, solder pads for wires, and other devices.
Abstract translation: 印刷电路板配有嵌入式组件。 嵌入式部件可以安装在印刷电路板基板的表面中的凹部内。 印刷电路板基板可以具有可以安装电线的凹槽和埋入通道。 凹部可以设置有焊料，焊丝可以焊接或者用导电粘合剂附着。 集成开关可以设置在印刷电路板基板的开口内。 集成开关可以具有安装在开口内的圆顶开关构件。 用于开关的盖构件可以由覆盖圆顶开关构件的柔性层形成。 集成开关的端子可以由内部印刷电路板层中的导电结构形成。 互连可用于电连接嵌入式组件，例如开关，集成电路，电线焊盘和其他设备。
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公开(公告)号：US09837682B1
公开(公告)日：2017-12-05
申请号：US15250628
申请日：2016-08-29
Applicant: Michael Nikkhoo , Vijayasekaran Boovaragavan , Dongli Zeng , Tzu-Yuan Lin , John Christopher Collins
Inventor： Michael Nikkhoo , Vijayasekaran Boovaragavan , Dongli Zeng , Tzu-Yuan Lin , John Christopher Collins
IPC: H01M10/04 , H01M2/20 , H01M2/16 , H01M2/18 , H01M6/02 , H05K5/00 , G06F1/16 , H04M1/02 , H01M4/02
CPC classification number: H01M10/0436 , G06F1/1613 , G06F1/163 , H01M2/1027 , H01M4/78 , H01M6/42 , H01M2004/021 , H01M2004/025 , H01M2220/30 , H04M1/0262 , H05K5/0017 , H05K5/0086
Abstract: Examples are disclosed herein that relate to curved batteries. One example provides a battery comprising an anode arranged on an anode substrate, a cathode arranged on a cathode substrate, the anode substrate being curved at a first curvature and the cathode substrate being curved at a second curvature, and a separator between the anode and the cathode. A thickness of the anode substrate and a thickness of the cathode substrate are determined based on the curvature of the respective substrate, such that the one of the anode substrate and the cathode substrate with a larger curvature has a larger thickness.
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公开(公告)号：US20170343418A1
公开(公告)日：2017-11-30
申请号：US15167888
申请日：2016-05-27
Applicant: Erin Hurbi , Michael Nikkhoo , Igor Markovsky , Shahar Ben-Menahem
Inventor： Erin Hurbi , Michael Nikkhoo , Igor Markovsky , Shahar Ben-Menahem
CPC classification number: G01J5/10 , G01J5/0096 , G01J5/025 , G01J5/061 , G01J5/522 , G01J5/524 , G01J2005/0048 , G01J2005/0077 , G01N21/93 , G01N25/72 , H04N5/33 , H04N17/002
Abstract: An apparatus including a palette body, a plurality of heat distribution plates mounted on the body and positioned adjacent each other, a plurality of insulators positioned intermediate the adjacently positioned heat distribution plates, and a plurality of thermal camera calibration reference swatches including a near-ideal blackbody reference swatch, a diffuse reflective reference swatch, and a first material of the device under testing reference swatch, each reference swatch being mounted on a corresponding one of the heat distribution plates and thermally insulated from other reference swatches by the insulators.
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Patent Agency Ranking
公开(公告)号：US20160212888A1
公开(公告)日：2016-07-21
申请号：US14601088
申请日：2015-01-20
Applicant: Michael Nikkhoo , Erin Hurbi
Inventor： Michael Nikkhoo , Erin Hurbi
CPC classification number: H05K7/20963 , G02B7/008 , G02B27/0176 , G02B2027/0178
Abstract: A metal encased multilayer stack of graphite sheets used as a passive thermal conductor. In the stack, each sheet has a plane high thermal conductivity along a first axis and a plane of lower thermal conductivity along a second axis. The stack is created to have a three-dimensional shape including a length and a width, and the first axis is aligned parallel to said length, the multilayer stack having a height less than the width. A first metal structure surrounds the multilayer stack of graphite sheets, with the metal structure encasing the multilayer stack along the length, width and height of the multilayer stack.
Abstract translation: 用作无源热导体的石墨片的金属封装多层叠层。 在堆叠中，每个片材沿着第一轴线具有平面高热导率，沿着第二轴线具有较低热导率的平面。 该叠层被制造成具有包括长度和宽度的三维形状，并且第一轴线平行于所述长度排列，所述多层堆叠具有小于该宽度的高度。 第一金属结构围绕石墨片的多层堆叠，其中金属结构沿着多层堆叠的长度，宽度和高度包围多层堆叠。
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公开(公告)号：US20160212886A1
公开(公告)日：2016-07-21
申请号：US14600753
申请日：2015-01-20
Applicant: Michael Nikkhoo
Inventor： Michael Nikkhoo
CPC classification number: H05K7/20963 , G02B7/008 , G02B27/0176 , G02B2027/0178
Abstract: The technology provides an optical mounting structure adapted for a head mounted display. The structure is configured to support heat producing electronic components on an interior surface, the structure including frame elements having an exterior surface. At least one bonded graphite layer thermally coupled to the electronic components and at least partially mounted to an exterior surface of the optical mounting structure. The graphite may be adhesively bonded to the surface of the mounting structure. A frame region is adapted to contain heat producing electronic components and first and second structural components extending away from the frame region. First and second graphite layers are thermally coupled to the electronic components, one of said first and second graphite layers bonded to an exterior surface of each structural component. A method of fabricating the structure is also provided.
Abstract translation: 该技术提供适用于头戴式显示器的光学安装结构。 该结构构造成支撑内表面上的发热电子部件，该结构包括具有外表面的框架元件。 至少一个粘合的石墨层热耦合到电子部件并且至少部分地安装到光学安装结构的外表面。 石墨可以粘合到安装结构的表面上。 框架区域适于容纳发热电子部件以及远离框架区域延伸的第一和第二结构部件。 第一和第二石墨层热耦合到电子部件，所述第一和第二石墨层中的一个结合到每个结构部件的外表面。 还提供了一种制造该结构的方法。
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公开(公告)号：US20160209659A1
公开(公告)日：2016-07-21
申请号：US14601093
申请日：2015-01-20
Applicant: Michael Nikkhoo , Erin Hurbi
Inventor： Michael Nikkhoo , Erin Hurbi
IPC: G02B27/01
CPC classification number: G02B27/0176 , G02B7/008 , G02B2027/0152 , G02B2027/0178 , G02C5/18 , G02C11/08 , G02C11/10
Abstract: An optical mount includes a frame adapted to support display optical systems and heat emitting electronic components. The mount includes a first portion housing the electronic components and one or more support components extending away from the electronic components. The one or more support components may include temple arms adapted to support the frame on the head of a wearer of the optical mount. The frame may be comprised of a thermally conductive material coupled to the electronic components. The support components include a first side and a second side, and at least one void positioned between the first side and the second side adapted to convey heat away from the electronic components. The void may define a bifurcated region in the support component.
Abstract translation: 光学座架包括适于支撑显示光学系统和发热电子部件的框架。 安装件包括容纳电子部件的第一部分和远离电子部件延伸的一个或多个支撑部件。 一个或多个支撑部件可以包括适于将框架支撑在光学安装件的佩戴者的头部上的镜腿臂。 框架可以由耦合到电子部件的导热材料构成。 支撑部件包括第一侧和第二侧，以及位于第一侧和第二侧之间的至少一个空隙，其适于将热量从电子部件传送出去。 空隙可以在支撑部件中定义分叉区域。
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公开(公告)号：US20120023743A1
公开(公告)日：2012-02-02
申请号：US13270448
申请日：2011-10-11
Applicant: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
Inventor： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
IPC: H01R43/00
CPC classification number: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
Abstract translation: 这涉及用于屏蔽电子设备的电路区域的干扰（例如，EMI）的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来，可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中，导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中，导电盖可以是在填充物上方熔化的导电片。
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公开(公告)号：US08071893B2
公开(公告)日：2011-12-06
申请号：US12397922
申请日：2009-03-04
Applicant: Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
Inventor： Gloria Lin , Wyeman Chen , Michael Nikkhoo , Michael Rosenblatt , Hammid Mohammadinia , Ziv Wolkowicki , Amir Salehi
CPC classification number: H05K9/0024 , H05K1/0218 , H05K1/095 , H05K3/1241 , H05K3/245 , H05K3/284 , H05K2203/0126 , H05K2203/1476 , Y10T29/49117 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49171
Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.
Abstract translation: 这涉及用于屏蔽电子设备的电路区域的干扰（例如，EMI）的方法和装置。 可以围绕电路区域的外围形成导电阻挡层。 然后可以将非导电或电绝缘填充物施加到坝内的电路区域。 接下来，可以在填充物上方施加导电盖。 盖可以电连接到大坝。 大坝可以包括堆叠在彼此之上的两层或更多层导电材料。 在一些实施例中，导电盖可以在填充物上方被印刷或丝网印刷。 在其他实施例中，导电盖可以是在填充物上方熔化的导电片。
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