公开(公告)号：US20160373800A1

公开(公告)日：2016-12-22

申请号：US15070295

申请日：2016-03-15

Applicant: SunASIC Technologies, Inc.

Inventor： Chi-Chou LIN ,  Zheng-Ping HE

IPC: H04N21/422 ,  G06K9/00 ,  H04N21/4415

CPC classification number: H04N21/42222 ,  G06K9/0002 ,  G06K9/00093 ,  G08C17/02 ,  G08C23/04 ,  G08C2201/30 ,  G08C2201/61 ,  H04N21/4415 ,  H04N21/4751

Abstract: A remote control for a smart TV or a set-top box is disclosed. The remote control includes a capacitive fingerprint sensor, a processor and a wireless transmitter. The present invention takes advantages of the capacitive fingerprint sensor so that every user's personal data and corresponding setting for the smart TV or set-top box are available. Channel (or web-site) content rating can be achieved. Purchasing over TV can be safer than ever.

Abstract translation: 公开了一种用于智能电视或机顶盒的遥控器。 遥控器包括电容式指纹传感器，处理器和无线发射器。 本发明利用电容指纹传感器的优势，使得每个用户的个人数据和智能电视或机顶盒的相应设置都可用。 渠道（或网站）内容评级可以实现。 通过电视采购比以往任何时候都安全。

公开(公告)号：US20160141235A1

公开(公告)日：2016-05-19

申请号：US14543936

申请日：2014-11-18

Applicant: SunASIC Technologies, Inc.

Inventor： Chi-Chou LIN ,  Zheng-Ping HE

IPC: H01L23/498 ,  H05K3/30 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K3/4644 ,  G06K9/0002 ,  H01L23/13 ,  H01L23/142 ,  H01L23/49822 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/0002 ,  H05K1/184 ,  H05K3/321 ,  H05K2201/10151 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed circuit board assembly (PCBA) and a method to assemble the PCBA are disclosed. The PCBA includes a printed circuit board (PCB), an image sensing chip and a protection layer. The PCB includes a first insulation layer, a second insulation layer, a first electrically conductive layer, a second electrically conductive layer, and a third electrically conductive layer. The image sensing chip has a number of bonding pads with a sensor portion facing down through the second opening. The PCBA can function as an image sensing module and make the module have the thinnest thickness.

Abstract translation: 公开了印刷电路板组件（PCBA）和组装PCBA的方法。 PCBA包括印刷电路板（PCB），图像感测芯片和保护层。 PCB包括第一绝缘层，第二绝缘层，第一导电层，第二导电层和第三导电层。 图像感测芯片具有多个接合焊盘，传感器部分通过第二开口面向下。 PCBA可以用作图像感测模块，并使模块具有最薄的厚度。

公开(公告)号：US09305202B2

公开(公告)日：2016-04-05

申请号：US13845237

申请日：2013-03-18

Applicant: SunASIC Technologies, Inc.

Inventor： Chi-Chou Lin

IPC: G06K9/00

CPC classification number: G06K9/00053

Abstract: A portable device having fingerprint recognition function includes an image sensing unit, a microprocessor, a signal transmitting unit, a carrying member, a cleaning unit, and a housing. It is characterized that the cleaning unit removes residual fingerprint from the image sensing unit while the carrying member moves in and out of the housing. The portable device of the present invention is free from fingerprint residue and can reduce security risks.

Abstract translation: 具有指纹识别功能的便携式设备包括图像感测单元，微处理器，信号发送单元，承载构件，清洁单元和外壳。 其特征在于，当携带构件移入和移出壳体时，清洁单元从图像感测单元中去除残留的指纹。 本发明的便携式设备没有指纹残留并且可以降低安全风险。

公开(公告)号：US09281339B1

公开(公告)日：2016-03-08

申请号：US14488814

申请日：2014-09-17

Applicant: SunASIC Technologies, Inc.

Inventor： Chi-Chou Lin ,  Zheng-Ping He

IPC: H01L27/146 ,  H01L21/48 ,  H01L23/538

CPC classification number: H01L27/1469 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L27/146 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/484 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15153

Abstract: A method for mounting a chip on a printed circuit board (PCB) is disclosed. The method includes the steps of: providing a chip having a plurality of bonding pads and a PCB having a recess portion and a plurality of connectors; gluing the recess portion; placing the chip into the recess portion; and forming circuit patterns linking associated bonding pad and connector. A bottom of the recess portion is substantially flat and a shape of the recess portion is similar to that of the chip but large enough so that the chip can be fixed in the recess portion after being glued.

Abstract translation: 公开了一种将芯片安装在印刷电路板（PCB）上的方法。 该方法包括以下步骤：提供具有多个接合焊盘的芯片和具有凹部和多个连接器的PCB; 胶合所述凹部; 将所述芯片放置在所述凹部中; 以及形成连接相关联的焊盘和连接器的电路图案。 凹部的底部基本上是平坦的，并且凹部的形状与芯片的形状相似但足够大，使得芯片可以在胶合之后固定在凹部中。

公开(公告)号：US11659288B2

公开(公告)日：2023-05-23

申请号：US17076908

申请日：2020-10-22

Applicant: SunASIC Technologies, Inc.

Inventor： Chi-Chou Lin ,  Zheng-Ping He

IPC: H04N25/75 ,  G06V40/13 ,  H04N25/42 ,  H04N25/44 ,  H04N25/50 ,  H04N25/57 ,  H04N25/59 ,  H04N25/70 ,  H04N25/40 ,  H04N25/77 ,  H04N25/78 ,  H04N25/51 ,  G06V10/98

CPC classification number: H04N25/44 ,  G06V40/1306 ,  H04N25/40 ,  H04N25/42 ,  H04N25/50 ,  H04N25/51 ,  H04N25/57 ,  H04N25/59 ,  H04N25/70 ,  H04N25/75 ,  H04N25/77 ,  H04N25/78 ,  G06V10/993

Abstract: An image sensing device that can adjust parameters of an image before sending it to a processor for reducing computing power and/or storage requirement is disclosed. The image sensing device includes an array of sensing pixels; an output amplifier; an analog-to-digital converter; a first set of registers and a second set of registers; an activation circuit; and a profiling logic. The profiling logic conducts statistical analysis on output data and adjusts parameters stored in the first set of registers until results of the statistical analysis reaches a target standard, wherein the adjusted parameters are used to generate an output image by each sensing pixel of the array of sensing pixels once the target standard is reached and a notification signal is sent to an external device for notifying the failure of parameter adjustment if the target standard fails to be reached within a predetermined times of adjustment.

公开(公告)号：US10162995B2

公开(公告)日：2018-12-25

申请号：US15488536

申请日：2017-04-17

Applicant: SunASIC Technologies, Inc.

Inventor： Chi Chou Lin ,  Zheng Ping He

IPC: G06K9/00

Abstract: A capacitive image sensor with noise reduction feature and a method operating the capacitive image sensor are provided. The capacitive image sensor includes: a number of capacitive sensing units forming an array, each capacitive sensing unit for transforming a distance between a portion of a surface of an approaching finger and a top surface thereof into an output electric potential, wherein a value of the output electric potential is changed by a driving signal coupled on the finger; at least one sample-and-hold circuit for capturing and retaining different output electric potentials; at least one signal conditioning circuit, each comprising: at least one differential amplifier for amplifying a difference between two electric potentials retained by the sample-and-hold circuit; and a driving source, for providing the driving signal to the finger.

公开(公告)号：US10121043B2

公开(公告)日：2018-11-06

申请号：US14543936

申请日：2014-11-18

Applicant: SunASIC Technologies, Inc.

Inventor： Chi-Chou Lin ,  Zheng-Ping He

IPC: G06K9/00 ,  H01L23/13 ,  H05K3/46 ,  H01L23/14 ,  H05K1/18 ,  H01L23/498 ,  H05K3/32

Abstract: A printed circuit board assembly (PCBA) and a method to assemble the PCBA are disclosed. The PCBA includes a printed circuit board (PCB), an image sensing chip and a protection layer. The PCB includes a first insulation layer, a second insulation layer, a first electrically conductive layer, a second electrically conductive layer, and a third electrically conductive layer. The image sensing chip has a number of bonding pads with a sensor portion facing down through the second opening. The PCBA can function as an image sensing module and make the module have the thinnest thickness.

公开(公告)号：US20180300520A1

公开(公告)日：2018-10-18

申请号：US15488536

申请日：2017-04-17

Applicant: SunASIC Technologies, Inc.

Inventor： Chi Chou LIN ,  Zheng Ping HE

IPC: G06K9/00

CPC classification number: G06K9/0002

Abstract: A capacitive image sensor with noise reduction feature and a method operating the capacitive image sensor are provided. The capacitive image sensor includes: a number of capacitive sensing units forming an array, each capacitive sensing unit for transforming a distance between a portion of a surface of an approaching finger and a top surface thereof into an output electric potential, wherein a value of the output electric potential is changed by a driving signal coupled on the finger; at least one sample-and-hold circuit for capturing and retaining different output electric potentials; at least one signal conditioning circuit, each comprising: at least one differential amplifier for amplifying a difference between two electric potentials retained by the sample-and-hold circuit; and a driving source, for providing the driving signal to the finger.

公开(公告)号：US10078776B2

公开(公告)日：2018-09-18

申请号：US15381182

申请日：2016-12-16

Applicant: SunASIC Technologies, Inc.

Inventor： Chi Chou Lin ,  Zheng Ping He

IPC: G06K9/00 ,  H04N5/365 ,  H03K17/96 ,  H01L27/06

CPC classification number: G06K9/0002 ,  H01L27/0629 ,  H03K17/9622 ,  H04N5/365

Abstract: A capacitive fingerprint sensor which includes capacitive sensing units is disclosed. Each of the capacitive sensing unit includes a sensing electrode; a first switch; a voltage follower; and a reference capacitor. The voltage follower includes an adjustable current source, for providing at least two distinct current levels; and a MOS transistor. The MOS transistor includes a source node, connected to ground via the adjustable current source and serves as an output node of the voltage follower; a gate node, connected to the sensing electrode and serves as an input node of the voltage follower; a drain node, connected to a power source, for providing power to the voltage follower; and a bulk node, connected to the source node.

公开(公告)号：US10037954B2

公开(公告)日：2018-07-31

申请号：US15460482

申请日：2017-03-16

Applicant: SunASIC Technologies, Inc.

Inventor： Chi Chou Lin ,  Zheng Ping He

IPC: H01L23/48 ,  H01L23/00 ,  H01L21/78 ,  H01L23/544 ,  G06K9/00

CPC classification number: H01L24/06 ,  G06F3/044 ,  G06K9/00006 ,  G06K9/00013 ,  G06K9/0004 ,  H01L21/78 ,  H01L23/3171 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L2223/5446 ,  H01L2224/03614 ,  H01L2224/05026 ,  H01L2224/06135 ,  H01L2224/0912

Abstract: A chip with I/O pads on the peripheries and a method making the chip is disclosed. The chip includes: a substrate; a first metal layer, formed above the substrate; an inter-metal dielectric layer, formed above the first metal layer, having concave portions formed along the peripheries of the chip so that a portion of the first metal layer is exposed to form an input-output (I/O) pad in each of the concave portions which are spaced apart from each other; and a passivation layer, formed above the second metal layer without covering the concave portions so that specific circuits are formed by the first metal layer and the second metal layer, respectively. By changing the I/O pad from the top of the chip to the peripheries, the extra thickness of the packaged chip caused by wire bonding in the prior arts can be reduced.