公开(公告)号：US20200152364A1

公开(公告)日：2020-05-14

申请号：US16184024

申请日：2018-11-08

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

IPC: H01F7/06 ,  H01L23/522 ,  H01L27/092 ,  H01F7/14 ,  H01F7/08 ,  H01F7/126 ,  B64C33/02

Abstract: A ferromagnetic actuator is disposed between first and second semiconductor devices that include first and second inductors. Each inductor is disposed on top of a multilevel wiring structure. Current flows through the first inductor to generate a first magnetic field that attracts the ferromagnetic actuator towards the first inductor causing the ferromagnetic actuator to transition from a first state to a second state. In the second state, a portion of the ferromagnetic actuator is disposed closer to the first inductor than it is in the first state. Current flows through the second inductor to generate a second magnetic field that attracts the ferromagnetic actuator towards the second inductor causing the ferromagnetic actuator to transition from the first or second state to a third state. In the third state, a portion of the ferromagnetic actuator is disposed closer to the first inductor than it is in the first state.

公开(公告)号：US10354950B2

公开(公告)日：2019-07-16

申请号：US15053747

申请日：2016-02-25

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies

IPC: C08K3/08 ,  H01L23/29 ,  H01L23/522 ,  H01L49/02 ,  H01L23/528 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  C08K3/22 ,  H01F41/02 ,  H01F41/04 ,  H01L21/321 ,  H01F1/26 ,  H01F1/37 ,  H01F17/00 ,  H01F3/10

Abstract: A magnetic polymer for use in microelectronic fabrication includes a polymer matrix and a plurality of ferromagnetic particles disposed in the polymer matrix. The magnetic polymer can be part of an insulation layer in an inductor formed in one or more backend wiring layers of an integrated device. The magnetic polymer can also be in the form of a magnetic epoxy layer for mounting contacts of the integrated device to a package substrate.

公开(公告)号：US20190182957A1

公开(公告)日：2019-06-13

申请号：US16279574

申请日：2019-02-19

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Joseph Meyer ,  Michael Lekas ,  Ryan Davies ,  David Jew ,  William Lee

IPC: H05K1/18 ,  H05K1/16 ,  H05K1/11 ,  H05K1/02 ,  H01F27/24 ,  H01F27/28 ,  H01F41/02 ,  H01F41/04

Abstract: A switched inductor DC-DC power converter chiplet includes a CMOS power switch, an LC filter, regulation circuitry, feedback control circuitry, and interface control circuitry integrated on a common substrate. The inductor for the LC filter can be formed on the same surface or on opposing surfaces of the substrate as the electrical terminations for the substrate. Another embodiment includes a switched inductor DC-DC power converter chiplet having a first powertrain phase and multiple second powertrain phases. When the load current is less than or equal to a threshold load current, the power conversion efficiency can be improved by only operating the first powertrain phase. When the load current is greater than the threshold load current, the power conversion efficiency can be improved by operating one or more second powertrain phases.

公开(公告)号：US20180182841A1

公开(公告)日：2018-06-28

申请号：US15419562

申请日：2017-01-30

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Hao Wu ,  Michael Lekas

IPC: H01L49/02 ,  H01L23/522 ,  H01L23/528 ,  H01L21/3205 ,  H01L21/288 ,  H01L21/027 ,  H01F27/24 ,  H01F27/28 ,  H01F41/04

CPC classification number: H01L28/10 ,  H01F17/0033 ,  H01F27/2804 ,  H01F41/046 ,  H01F41/26 ,  H01F2027/2809 ,  H01L23/5226 ,  H01L23/5227

Abstract: Methods of manufacturing are disclosed for an inductor that includes a magnetic core lying in a core plane. The magnetic core includes a vertical laminated structure with respect to the core plane of alternating ferromagnetic vertical layers and insulator vertical layers. An easy axis of magnetization can be permanently or semi-permanently fixed in the ferromagnetic vertical layers along a first axis orthogonal to the core plane. A hard axis of magnetization can be permanently or semi-permanently induced in the ferromagnetic vertical layers, the hard axis of magnetization lying in a plane that is orthogonal to the first axis.

公开(公告)号：US20180182530A1

公开(公告)日：2018-06-28

申请号：US15391278

申请日：2016-12-27

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Hao Wu ,  Michael Lekas

IPC: H01F27/25 ,  H01F27/28

CPC classification number: H01F27/25 ,  H01F5/00 ,  H01F17/0033 ,  H01F27/2804 ,  H01F27/2823 ,  H01F41/046

Abstract: An inductor includes a magnetic core lying in a core plane. The magnetic core includes a vertical laminated structure with respect to the core plane of alternating ferromagnetic vertical layers and insulator vertical layers. An easy axis of magnetization can be permanently or semi-permanently fixed in the ferromagnetic vertical layers along an axis orthogonal to the core plane. Methods of manufacturing same are also disclosed.

公开(公告)号：US10002828B2

公开(公告)日：2018-06-19

申请号：US15409697

申请日：2017-01-19

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies

IPC: H01L23/522 ,  H01L49/02 ,  H01L23/528 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  C08K3/22 ,  C08K3/08 ,  H01F41/02 ,  H01F41/04 ,  H01L21/321

CPC classification number: H01L23/5227 ,  C08K3/08 ,  C08K3/22 ,  C08K2003/0843 ,  C08K2003/0856 ,  C08K2003/0862 ,  C08K2003/2265 ,  C08K2003/2289 ,  C08K2003/2293 ,  H01F1/26 ,  H01F1/37 ,  H01F17/0013 ,  H01F41/0206 ,  H01F41/04 ,  H01F41/046 ,  H01F2003/106 ,  H01L21/321 ,  H01L21/563 ,  H01L23/295 ,  H01L23/3142 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/17 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L28/10 ,  H01L2224/13022 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/831 ,  H01L2224/8312 ,  H01L2224/83855 ,  H01L2224/83909 ,  H01L2224/92125 ,  H01L2924/0665 ,  H01L2924/13067 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1425 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/2064 ,  H01L2924/2075 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A magnetic polymer for use in microelectronic fabrication includes a polymer matrix and a plurality of ferromagnetic particles disposed in the polymer matrix. The magnetic polymer can be part of an insulation layer in an inductor formed in one or more backend wiring layers of an integrated device. The magnetic polymer can also be in the form of a magnetic epoxy layer for mounting contacts of the integrated device to a package substrate.

公开(公告)号：US20150171157A1

公开(公告)日：2015-06-18

申请号：US14571649

申请日：2014-12-16

Applicant: Ferric Inc.

Inventor： Noah Andrew Sturcken ,  Ryan Davies

IPC: H01L49/02 ,  H01L23/50

CPC classification number: H01L28/10 ,  H01L21/32051 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/645 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Integrated multi-layer magnetic films for use in passive devices in microelectronic applications and methods of manufacture thereof. Soft ferromagnetic materials exhibiting high permeability and low coercivity are laminated together with insulating layers interposed. Electrical conductors coupled to interconnects are magnetically coupled to magnetic film layers to engender an inductor (self and mutual). Soft ferromagnetic materials are provided in an alternating array of parallel plate capacitors. Each alternating magnetic film is electrically coupled to either a primary or secondary electrical conductor interconnects and separated by an electrically insulating dielectric material. Alternatively, each alternating magnetic layer comprises an induced anisotropy material, which can also be combined with coiled conductor giving rise to a hybrid inductive/capacitive device. Also, soft ferromagnetic material are also selected and tuned to provide for FMR notch filtering.

Abstract translation: 用于微电子应用中的无源器件的集成多层磁性膜及其制造方法。 表现出高磁导率和低矫顽力的软铁磁材料层压在绝缘层上。 耦合到互连的电导体磁耦合到磁膜层以产生电感器（自相互）。 柔性铁磁材料以平行板电容器的交替阵列提供。 每个交替磁性膜电耦合到主电导体互连件或次电导体互连件，并由电绝缘电介质材料隔开。 或者，每个交变磁性层包括感应各向异性材料，其也可以与产生混合电感/电容器件的线圈导体组合。 此外，软铁磁材料也被选择和调谐以提供FMR陷波滤波。

公开(公告)号：US12224091B2

公开(公告)日：2025-02-11

申请号：US17377886

申请日：2021-07-16

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Michael Lekas ,  Ryan Davies ,  Denis Shishkov ,  Matthew Cavallaro

IPC: H01F1/03 ,  H01F1/26 ,  H01F10/32 ,  H01F17/04 ,  H01F27/24 ,  H01F27/28 ,  H01F41/02 ,  H01F41/16 ,  H01L23/522 ,  H01F41/00

Abstract: A ferromagnetic-polymer composite material comprises a polymer and a plurality of ferromagnetic film platelets disposed in the polymer. Each ferromagnetic film platelet comprises first and second insulator layers and a ferromagnetic layer disposed between the first and second insulator layers. The ferromagnetic layer can be magnetically anisotropic in which a hard axis of magnetization is aligned parallel to a plane that passes through and parallel to an interface between the first insulator layer and the ferromagnetic layer. The easy and/or hard axes of magnetization in the ferromagnetic film platelets can be aligned. An inductor can have a core formed of the ferromagnetic-polymer composite material.

公开(公告)号：US12048097B2

公开(公告)日：2024-07-23

申请号：US17358318

申请日：2021-06-25

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/24 ,  H01F41/02 ,  H01F41/04 ,  H01F41/32 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03 ,  H05K1/16

CPC classification number: H05K1/181 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/24 ,  H01F27/2804 ,  H01F41/02 ,  H01F41/041 ,  H01F41/046 ,  H01F41/32 ,  H05K1/0298 ,  H05K1/115 ,  H01F2017/0066 ,  H05K1/0233 ,  H05K1/0306 ,  H05K1/165 ,  H05K2201/086 ,  H05K2201/0929 ,  H05K2201/1003 ,  Y02P70/50 ,  Y10T29/4913

Abstract: A structure comprises a semiconductor integrated circuit, an inductor, and a magnetic flux closure layer. The inductor is integrated into a multilevel wiring network in the semiconductor integrated circuit. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic flux closure layer is disposed within about 100 μm of a face of the planar laminated magnetic core, the face of the planar magnetic core parallel to a principal plane of the planar laminated magnetic core. A second magnetic flux closure layer can be disposed within about 100 μm of an opposing face of the planar laminated magnetic core.

公开(公告)号：US11903130B2

公开(公告)日：2024-02-13

申请号：US17341643

申请日：2021-06-08

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

IPC: H01F7/06 ,  H05K1/18 ,  H01F41/04 ,  H01F41/02 ,  H01F27/28 ,  H01F27/24 ,  H05K1/16 ,  H05K1/02 ,  H05K1/11 ,  H01L49/02 ,  H01F10/26 ,  H01F41/32 ,  H01F17/00 ,  H05K1/03

CPC classification number: H05K1/181 ,  H01F10/265 ,  H01F17/0033 ,  H01F27/24 ,  H01F27/2804 ,  H01F41/02 ,  H01F41/041 ,  H01F41/046 ,  H01F41/32 ,  H01L28/10 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/165 ,  H01F2017/0066 ,  H05K1/0233 ,  H05K1/0306 ,  H05K2201/086 ,  H05K2201/0929 ,  H05K2201/1003 ,  Y02P70/50 ,  Y10T29/4913

Abstract: An inductor includes a planar laminated magnetic core and a conductive winding. The planar magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The non-magnetic layer includes an insulating layer that is disposed between first and second interface layers. The conductive winding turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The inductor can be integrated into a multilevel wiring network in a semiconductor integrated circuit to form a microelectronic device, such as a transformer, a power converter, or a microprocessor.