公开(公告)号：US20220413720A1

公开(公告)日：2022-12-29

申请号：US17359334

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Adwait Purandare ,  Ian Steiner ,  Vasudevan Srinivasan ,  Ankush Varma ,  Nikhil Gupta ,  Stanley Chen

IPC: G06F3/06

Abstract: In an embodiment, a processor includes multiple processing engines and a power control unit. The power control unit is to receive a mapping of multiple virtual partitions to sets of the processing engines, and in response to a receipt of the mapping of multiple of virtual partitions: access a power limit table for the processor, and generate multiple virtual partition power limit tables based on the power limit table for the processor, where each virtual partition power limit table is associated with a different virtual partition. Other embodiments are described and claimed.

公开(公告)号：US20220129031A1

公开(公告)日：2022-04-28

申请号：US17520296

申请日：2021-11-05

Applicant: Intel Corporation

Inventor： Vasudevan Srinivasan ,  Krishnakanth V. Sistla ,  Corey D. Gough ,  Ian M. Steiner ,  Nikhil Gupta ,  Vivek Garg ,  Ankush Varma ,  Sujal A. Vora ,  David P. Lerner ,  Joseph M. Sullivan ,  Nagasubramanian Gurumoorthy ,  William J. Bowhill ,  Venkatesh Ramamurthy ,  Chris MacNamara ,  John J. Browne ,  Ripan Das

IPC: G06F1/08 ,  G06F1/3203 ,  G06F9/30 ,  G06F9/455 ,  G06F1/324

Abstract: A processing device includes a plurality of processing cores, a control register, associated with a first processing core of the plurality of processing cores, to store a first base clock frequency value at which the first processing core is to run, and a power management circuit to receive a base clock frequency request comprising a second base clock frequency value, store the second base clock frequency value in the control register to cause the first processing core to run at the second base clock frequency value, and expose the second base clock frequency value on a hardware interface associated with the power management circuit.

公开(公告)号：US20220100247A1

公开(公告)日：2022-03-31

申请号：US17033753

申请日：2020-09-26

Applicant: Intel Corporation

Inventor： Vivek Garg ,  Ankush Varma ,  Krishnakanth Sistla ,  Nikhil Gupta ,  Nikethan Shivanand Baligar ,  Stephen Wang ,  Nilanjan Palit ,  Timothy Kam ,  Adwait Purandare ,  Ujjwal Gupta ,  Stanley Chen ,  Dorit Shapira ,  Shruthi Venugopal ,  Suresh Chemudupati ,  Rupal Parikh ,  Eric Dehaemer ,  Pavithra Sampath ,  Phani Kumar Kandula ,  Yogesh Bansal ,  Dean Mulla ,  Michael Tulanowski ,  Stephen Haake ,  Andrew Herdrich ,  Ripan Das

IPC: G06F1/28 ,  G06F1/30 ,  G06F13/20

Abstract: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.

公开(公告)号：US11137807B2

公开(公告)日：2021-10-05

申请号：US15938291

申请日：2018-03-28

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Nikhil Gupta ,  Vasudevan Srinivasan

IPC: G06F1/20 ,  G06F1/32 ,  G06F1/324 ,  G06F1/3296

Abstract: In one embodiment, a processor includes a non-volatile storage to store a plurality of configurations for the processor, the non-volatile storage including a plurality of entries to store configuration information for the processor for one of the plurality of configurations, the configuration information including at least one of a guaranteed operating frequency and a core count, at least one of the entries to store the core count. The processor further includes a power controller to control the processor to operate at one of the plurality of configurations based at least in part on a selected thermal set point of a plurality of thermal set points of the processor, each of the plurality of thermal set points associated with one of the configurations. Other embodiments are described and claimed.

公开(公告)号：US20190041967A1

公开(公告)日：2019-02-07

申请号：US16136440

申请日：2018-09-20

Applicant: Intel Corporation

Inventor： Avinash Ananthakrishnan ,  Nikhil Gupta

IPC: G06F1/32 ,  G06F9/48

Abstract: In one embodiment, a processor includes: a plurality of cores to execute instructions, at least some of the plurality of cores to be allocated to a plurality of virtual machines (VMs); and a power controller coupled to the plurality of cores. The power controller may include a power distribution circuit to distribute an energy budget to the at least some of the plurality of cores according to priority information associated with the plurality of VMs. Other embodiments are described and claimed.

公开(公告)号：US12093100B2

公开(公告)日：2024-09-17

申请号：US17033753

申请日：2020-09-26

Applicant: Intel Corporation

Inventor： Vivek Garg ,  Ankush Varma ,  Krishnakanth Sistla ,  Nikhil Gupta ,  Nikethan Shivanand Baligar ,  Stephen Wang ,  Nilanjan Palit ,  Timothy Yee-Kwong Kam ,  Adwait Purandare ,  Ujjwal Gupta ,  Stanley Chen ,  Dorit Shapira ,  Shruthi Venugopal ,  Suresh Chemudupati ,  Rupal Parikh ,  Eric Dehaemer ,  Pavithra Sampath ,  Phani Kumar Kandula ,  Yogesh Bansal ,  Dean Mulla ,  Michael Tulanowski ,  Stephen Paul Haake ,  Andrew Herdrich ,  Ripan Das ,  Nazar Syed Haider ,  Aman Sewani

IPC: G06F1/28 ,  G06F1/30 ,  G06F13/20

CPC classification number: G06F1/28 ,  G06F1/30 ,  G06F13/20 ,  G06F2213/40

Abstract: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.

公开(公告)号：US11703906B2

公开(公告)日：2023-07-18

申请号：US17520296

申请日：2021-11-05

Applicant: Intel Corporation

Inventor： Vasudevan Srinivasan ,  Krishnakanth V. Sistla ,  Corey D. Gough ,  Ian M. Steiner ,  Nikhil Gupta ,  Vivek Garg ,  Ankush Varma ,  Sujal A. Vora ,  David P. Lerner ,  Joseph M. Sullivan ,  Nagasubramanian Gurumoorthy ,  William J. Bowhill ,  Venkatesh Ramamurthy ,  Chris MacNamara ,  John J. Browne ,  Ripan Das

IPC: G06F1/08 ,  G06F1/3203 ,  G06F9/30 ,  G06F9/455 ,  G06F1/324

CPC classification number: G06F1/08 ,  G06F1/3203 ,  G06F1/324 ,  G06F9/30101 ,  G06F9/45558 ,  G06F2009/45591

Abstract: A processing device includes a plurality of processing cores, a control register, associated with a first processing core of the plurality of processing cores, to store a first base clock frequency value at which the first processing core is to run, and a power management circuit to receive a base clock frequency request comprising a second base clock frequency value, store the second base clock frequency value in the control register to cause the first processing core to run at the second base clock frequency value, and expose the second base clock frequency value on a hardware interface associated with the power management circuit.