公开(公告)号：US20210318561A1

公开(公告)日：2021-10-14

申请号：US17358256

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Meer Nazmus Sakib ,  Saeed Fathololoumi ,  Harel Frish ,  John Heck ,  Eddie Bononcini ,  Reece Defrees ,  Stanley J. Dobek ,  Aliasghar Eftekhar ,  Walter Garay ,  Lingtao Liu ,  Wei Qian

IPC: G02F1/01 ,  G02B6/136 ,  G02B6/132

Abstract: A method may include: forming a base layer on a substrate; forming a waveguide assembly on the base layer, where the waveguide assembly is surrounded by a cladding layer; forming a trench opening through the cladding layer and the base layer; forming an undercut void by etching the substrate through the trench opening, where the undercut void extends under the waveguide assembly and the base layer; and filling the trench opening with a filler to seal off the undercut void. Other embodiments are described and claimed.

公开(公告)号：US10816737B2

公开(公告)日：2020-10-27

申请号：US16225248

申请日：2018-12-19

Applicant: Intel Corporation

Inventor： John Heck ,  Hari Mahalingam ,  Paul Yu ,  Kumar Satya Harinadh Potluri

IPC: G02B6/42

Abstract: In various embodiments, optical fibers may be placed into V-shaped grooves in a substrate. A lid may then be placed on top of the optical fibers to hold them accurately in place, and the lid may be attached to the substrate using a reflow solder technique. Epoxy may then be applied as a strain relief. Because the V-shaped grooves and optical waveguides are manufactured with precision on the same substrate, precise alignment between these two may be achieved. Because the epoxy is applied after reflow, the epoxy may not be exposed to reflow temperatures, which might otherwise cause the epoxy to distort during the cure process.

公开(公告)号：US10564330B2

公开(公告)日：2020-02-18

申请号：US16229751

申请日：2018-12-21

Applicant: INTEL CORPORATION

Inventor： Khaled Ahmed ,  John Heck ,  Ramon Cancel Olmo ,  Richmond Hicks ,  Olga Gorbounova

IPC: G02B5/02 ,  G02B6/42

Abstract: Disclosed herein are display and photonic devices utilizing metasurfaces. An optical device comprising an optical component and an optical transmission medium is disclosed. A waveguide couples the optical component and the optical transmission medium. A metasurface is disposed on an end of the waveguide and arranged to increase an optical coupling between the waveguide and the optical transmission medium. Additionally, a display comprising a number of light emitting elements and a metasurface for each of the light emitting elements. The metasurface arranged to eliminate screen door effect in virtual reality display systems.

公开(公告)号：US10310196B2

公开(公告)日：2019-06-04

申请号：US14917933

申请日：2013-12-03

Applicant: Intel Corporation

Inventor： David N. Hutchison ,  Haisheng Rong ,  John Heck

IPC: G02B6/12 ,  G02B6/42 ,  G02B6/122 ,  G02B6/14

Abstract: A portion of an optical waveguide extending laterally within a photonic integrated circuit (PIC) chip is at least partially freed from the substrate to allow physical displacement of a released waveguide end relative to the substrate and relative to an adjacent photonic device also fabricated in the substrate. The released waveguide end may be displaced to modulate interaction between the photonic device and an optical mode propagated by the waveguide. In embodiments where the photonic device is an optical coupler, employing for example an Echelle grating or arrayed waveguide grating (AWG), mode propagation through the coupler may be modulated via physical displacement of the released waveguide end. In one such embodiment, thermal sensitivity of an integrated optical wavelength division multiplexer (WDM) is reduced by displacing the released waveguide end relative to the coupler in a manner that counters a temperature dependence of the optical coupler.

公开(公告)号：US20180031873A1

公开(公告)日：2018-02-01

申请号：US15221436

申请日：2016-07-27

Applicant: Intel Corporation

Inventor： Woosung Kim ,  Haisheng Rong ,  John Heck

IPC: G02F1/095 ,  G02F1/09 ,  G02B6/27

CPC classification number: G02F1/0955 ,  G02B6/2746 ,  G02F1/092

Abstract: Embodiments herein relate to a photonic integrated circuit (PIC) with an on-chip optical isolator. The PIC may comprise a laser, a waveguide coupled with the laser, and a closed loop resonator coupled to the laser through the waveguide. A magneto-optical (MO) layer is over and in contact with the waveguide and the closed loop resonator. The closed loop resonator may comprise a first polarization rotator (PR) and a second PR. A light from the laser in transverse electric (TE) mode through the waveguide is rotated in the first PR to a light in transverse magnetic (TM) mode, and the light in TM mode is rotated in the second PR to light in TE mode. The isolator may further comprise a micro-heater over or along a side of the waveguide and separated from the closed loop resonator; and a feedback control loop connected to the closed loop resonator and the micro-heater.

公开(公告)号：US09778042B2

公开(公告)日：2017-10-03

申请号：US14106158

申请日：2013-12-13

Applicant: Intel Corporation

Inventor： Suraj Bramhavar ,  David N. Hutchison ,  John Heck

IPC: G01P15/13 ,  G01C19/72 ,  G01C19/56 ,  G01P15/093 ,  G01C19/5719 ,  G01D5/353 ,  G02B6/42 ,  G01P15/08

CPC classification number: G01C19/722 ,  G01C19/56 ,  G01C19/5719 ,  G01D5/35374 ,  G01P15/093 ,  G01P2015/084 ,  G02B6/4225

Abstract: Embodiments of the present disclosure are directed towards a micro-electromechanical system (MEMS) sensing apparatus, including a laser arrangement configured to generate a light beam, a first waveguide configured to receive and output the light beam, and a second waveguide aligned endface to endface with the first waveguide. The second waveguide may be configured to receive at least a portion of the light beam from the first waveguide via optical coupling through the aligned endfaces. Either the first or second waveguide may be configured to be moveable in response to an inertial change of the apparatus, wherein movement of the first or second waveguide causes a corresponding change in light intensity of the portion of the light beam, the change in light intensity indicating a measure of the inertial change. Other embodiments may be described and/or claimed.

公开(公告)号：US09500827B2

公开(公告)日：2016-11-22

申请号：US14317132

申请日：2014-06-27

Applicant: Intel Corporation

Inventor： David N. Hutchison ,  Kyu Hyun Kim ,  Haisheng Rong ,  John Heck ,  Shengbo Xu

IPC: G01J3/28 ,  G02B6/42 ,  G01J3/32 ,  G01J3/02 ,  G01J3/18

CPC classification number: G02B6/4295 ,  G01J3/0218 ,  G01J3/0237 ,  G01J3/0259 ,  G01J3/0297 ,  G01J3/1809 ,  G01J3/1895 ,  G01J3/20 ,  G01J3/32 ,  G02B6/00 ,  G02B6/12033

Abstract: Techniques and mechanisms for a monolithic photonic integrated circuit (PIC) to provide spectrometry functionality. In an embodiment, the PIC comprises a photonic device, a first waveguide and a second waveguide, wherein one of the first waveguide and the second waveguide includes a released portion which is free to move relative to a substrate of the PIC. During a metering cycle to evaluate a material under test, control logic operates an actuator to successively configure a plurality of positions of the released portion relative to the photonic device. In another embodiment, light from the first waveguide is variously diffracted by a grating of the photonic device during the metering cycle, where portions of the light are directed into the second waveguide. Different wavelengths of light diffracted into the second waveguide may be successively detected, for different positions of the released portion, to determine spectrometric measurements over a range of wavelength.

Abstract translation: 单片光子集成电路（PIC）提供光谱功能的技术和机制。 在一个实施例中，PIC包括光子器件，第一波导和第二波导，其中第一波导和第二波导中的一个包括相对于PIC的衬底自由移动的释放部分。 在用于评估被测材料的计量循环期间，控制逻辑操作致动器以相对于光子器件连续配置释放部分的多个位置。 在另一个实施例中，来自第一波导的光在计量周期期间由光子器件的光栅进行各种衍射，其中光的一部分被引导到第二波导中。 对于释放部分的不同位置，可以连续地检测衍射到第二波导中的不同波长的光，以确定波长范围上的光谱测量。

公开(公告)号：US09360601B2

公开(公告)日：2016-06-07

申请号：US14635912

申请日：2015-03-02

Applicant: Intel Corporation

Inventor： Yun-Chung Na ,  John Heck ,  Haisheng Rong

IPC: B44C1/22 ,  G02B5/18 ,  G02B6/02

CPC classification number: G02B5/1857 ,  G02B5/1842 ,  G02B5/1861 ,  G02B6/02009

Abstract: Methods of forming microelectronic structures are described. Embodiments of those methods may include forming a photomask on a (110) silicon wafer substrate, wherein the photomask comprises a periodic array of parallelogram openings, and then performing a timed wet etch on the (110) silicon wafer substrate to form a diffraction grating structure that is etched into the (110) silicon wafer substrate.

公开(公告)号：US12057386B2

公开(公告)日：2024-08-06

申请号：US17024507

申请日：2020-09-17

Applicant: Intel Corporation

Inventor： Wei Qian ,  Cung Tran ,  Sungbong Park ,  John Heck ,  Mark Isenberger ,  Seth Slavin ,  Mengyuan Huang ,  Kelly Magruder ,  Harel Frish ,  Reece Defrees ,  Zhi Li

IPC: H01L23/522 ,  H01L23/528

CPC classification number: H01L23/5223 ,  H01L23/528

Abstract: Embedded three-dimensional electrode capacitors, and methods of fabricating three-dimensional electrode capacitors, are described. In an example, an integrated circuit structure includes a first metallization layer above a substrate, the first metallization layer having a first conductive structure in a first dielectric layer, the first conductive structure having a honeycomb pattern. An insulator structure is on the first conductive structure of the first metallization layer. A second metallization layer is above the first metallization layer, the second metallization layer having a second conductive structure in a second dielectric layer, the second conductive structure on the insulator structure, and the second conductive structure having the honeycomb pattern.

公开(公告)号：US20230077633A1

公开(公告)日：2023-03-16

申请号：US17476080

申请日：2021-09-15

Applicant: Intel Corporation

Inventor： Changhua Liu ,  Pooya Tadayon ,  John Heck ,  Eric J. Moret ,  Tarek A. Ibrahim ,  Zhichao Zhang ,  Jeremy D Ecton

IPC: G02B6/42

Abstract: An electronic device comprises a photonic integrated circuit (PIC) including at least one waveguide, an emitting lens disposed on the PIC to emit light from the at least one waveguide in a direction substantially parallel to a first surface of the PIC, and an optical element disposed on the PIC and having a reflective surface configured to direct light emitted from the emitting lens in a direction away from the first surface of the PIC.