中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

29 records (took 0.02 seconds)

    Multi-axis differential strain sensor
    21.
    发明授权
    Multi-axis differential strain sensor 有权

    公开(公告)号：US12298128B2

    公开(公告)日：2025-05-13

    申请号：US18001443

    申请日：2021-06-11

    Applicant: Liquid Wire Inc.

    Inventor： Mark William Ronay ,  Trevor Antonio Rivera ,  Jorge E. Carbo, Jr. ,  Michael Adventure Hopkins

    IPC: G01B7/16

    Abstract: A flexible differential strain sensor, system, and method includes a deformable substrate having a first axis and a second axis different than the first axis and a first sensing element and a second sensing element. The first and second sensing elements are comprised of conductive gel. The first sensing element is arranged to sense strain in the deformable substrate along the first axis. The second sensing element has a first portion arranged to sense strain in the deformable substrate along the first axis and a second portion arranged to sense strain in the deformable substrate along the second axis. The second sensing element is arranged to cancel at least a portion of the stimulus sensed by the first sensing element in the along the first axis.

    FLEXIBLE THREE-DIMENSIONAL ELECTRONIC COMPONENT
    23.
    发明申请
    FLEXIBLE THREE-DIMENSIONAL ELECTRONIC COMPONENT 有权

    公开(公告)号：US20240428981A1

    公开(公告)日：2024-12-26

    申请号：US18700986

    申请日：2022-10-21

    Applicant: Liquid Wire Inc.

    Inventor： Katherine M. Nelson ,  Jesse Michael Martinez ,  Michael Adventure Hopkins

    IPC: H01F27/28

    Abstract: An electronic component (102), system. and method includes a substrate portion (106) forming a channel (104) and conductive gel (108) positioned within the channel. The conductive gel is arranged to create an electronic effect of the electronic component. The conductive gel forms a first elongate conductive trace (124) and a second elongate conductive trace (126). the first elongate conductive trace (124) forming a pattern of the electronic component that is mimicked by the second elongate conductive trace (126). The first and second elongate conductive traces have a common two-dimensional projection along a major axis (116) of the electronic component.

    CONTINUOUS INTERCONNECTS BETWEEN HETEROGENEOUS MATERIALS
    26.
    发明申请
    CONTINUOUS INTERCONNECTS BETWEEN HETEROGENEOUS MATERIALS 有权

    公开(公告)号：US20220377885A1

    公开(公告)日：2022-11-24

    申请号：US17663764

    申请日：2022-05-17

    Applicant: Liquid Wire Inc.

    Inventor： Mark William Ronay ,  Jorge E. Carbo, JR. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

    IPC: H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H05K3/42

    Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

    Continuous Interconnects Between Heterogeneous Materials
    28.
    发明申请
    Continuous Interconnects Between Heterogeneous Materials 审中-公开

    公开(公告)号：US20200381349A1

    公开(公告)日：2020-12-03

    申请号：US16885854

    申请日：2020-05-28

    Applicant: Liquid Wire Inc.

    Inventor： Mark Ronay ,  Jorge E. Carbo ,  Trevor Spiegel Antonio Rivera ,  Charles Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

    IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

    Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

Patent Agency Ranking