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    TRANSMISSION LINE
    25.
    发明申请
    TRANSMISSION LINE 审中-公开

    公开(公告)号：US20170084974A1

    公开(公告)日：2017-03-23

    申请号：US15366159

    申请日：2016-12-01

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Takahiro BABA ,  Kuniaki YOSUI ,  Nobuo IKEMOTO ,  Fumie MATSUDA

    IPC: H01P3/08 ,  H01P11/00

    CPC classification number: H01P3/08 ,  H01P3/085 ,  H01P3/088 ,  H01P11/003 ,  H05K1/02

    Abstract: A transmission line includes, in a dielectric body, a first ground conductor, and first and second signal conductors arranged in a width direction of the dielectric body. The first ground conductor includes a first signal conductor ground portion disposed closer to a first side of the dielectric body in a thickness direction than the first signal conductor, a second signal conductor ground portion disposed closer to a second side of the dielectric body in the thickness direction than the second signal conductor, and an intermediate portion that connects the first signal conductor ground portion to the second signal conductor ground portion. The intermediate portion is disposed between a first transmission line including the first signal conductor and the first signal conductor ground portion and a second transmission line including the second signal conductor and the second signal conductor ground portion.

    ELECTRONIC APPARATUS
    26.
    发明申请
    ELECTRONIC APPARATUS 审中-公开
    电子设备

    公开(公告)号：US20170033426A1

    公开(公告)日：2017-02-02

    申请号：US15290124

    申请日：2016-10-11

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Takahiro BABA ,  Nobuo IKEMOTO ,  Kosuke NISHINO ,  Jun SASAKI

    IPC: H01P3/08 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02 ,  H05K1/14

    CPC classification number: H01P3/08 ,  H01P3/026 ,  H01P3/085 ,  H05K1/0239 ,  H05K1/0242 ,  H05K1/0243 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/111 ,  H05K1/141 ,  H05K1/144 ,  H05K1/147 ,  H05K2201/0141

    Abstract: An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.

    Abstract translation: 电子设备包括安装在第一基板上并具有比第一基板小的面积的第一基板和第二基板。 第二基板在纵向方向上延伸并且具有平面或基本上平面的形状，在纵向方向上跨第二基板的所有部分具有均匀或基本均匀的宽度。 第二基板包括信号线和包括信号线的高频传输线，并且还包括电连接到信号线的输入/输出焊盘以及布置在两个输入/输出焊盘之间的辅助焊盘， 第二基板的表面。 第一衬底包括各自连接到输入/输出焊盘和辅助焊盘的焊盘。 输入/输出焊盘和辅助焊盘各自焊接在第一基板的每个焊盘上，因此第二基板被表面安装在第一基板上。

    CIRCUIT BOARD
    28.
    发明申请
    CIRCUIT BOARD 有权
    电路板

    公开(公告)号：US20150181699A1

    公开(公告)日：2015-06-25

    申请号：US14634982

    申请日：2015-03-02

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Nobuo IKEMOTO ,  Yuki WAKABAYASHI

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/0281 ,  H05K1/115 ,  H05K3/4691

    Abstract: A circuit board includes a plate-shaped dielectric body with a first and a second main surface and including a first area not to be bent and a second area to be bent such that the first main surface becomes an outer side, a first reinforcing member located in the first area nearer the first main surface in relation to a center of the second area in a thickness direction and away from the second area, and a second reinforcing member located in the first area nearer the second main surface in relation to the center of the second area and contacting with a border between the first and the second areas. The first main surface curves from an edge of the first reinforcing member closest to the second area, and the second main surface curves from an edge of the second reinforcing member on the border.

    Abstract translation: 电路板包括具有第一和第二主表面并且包括第一区域不被弯曲的板状电介质体和将第一主表面变成外侧的待弯曲的第二区域，第一加强构件位于 所述第一区域相对于所述第二区域的中心在厚度方向上相对于所述第二区域更靠近所述第一主表面;以及第二加强构件，所述第二加强构件相对于所述第二区域的中心位于所述第二主表面 第二区域并与第一和第二区域之间的边界接触。 第一主表面从最靠近第二区域的第一加强构件的边缘弯曲，并且第二主表面从边界上的第二加强构件的边缘弯曲。

    WIRELESS IC DEVICE
    29.
    发明申请
    WIRELESS IC DEVICE 有权
    无线IC器件

    公开(公告)号：US20140319224A1

    公开(公告)日：2014-10-30

    申请号：US14331337

    申请日：2014-07-15

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Nobuo IKEMOTO ,  Yuya DOKAI ,  Noboru KATO

    IPC: G06K19/07 ,  G06K19/073

    CPC classification number: G06K19/0723 ,  G06K19/073 ,  G06K19/07749 ,  G06K19/07756 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01Q1/2225 ,  H01Q1/40 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/20 ,  H04B5/0012

    Abstract: An electromagnetic coupling module includes a wireless IC chip and a functional substrate. The electromagnetic coupling module is mounted on a radiation plate, preferably using an adhesive, for example. On the upper surface of a base material of the radiation plate, two long radiation electrodes are provided. On the undersurface of the functional substrate, capacitive coupling electrodes that individually face inner ends of the radiation electrodes are provided. A matching circuit arranged to perform the impedance matching between the wireless IC chip and each of the radiation electrodes includes the capacitive coupling electrodes. As a result, it is possible to reduce the size, facilitate the design, and reduce the cost of a wireless IC device.

    Abstract translation: 电磁耦合模块包括无线IC芯片和功能基板。 电磁耦合模块例如安装在辐射板上，优选使用粘合剂。 在辐射板的基材的上表面上设置两个长的辐射电极。 在功能基板的下表面上，设置分别面对辐射电极内端的电容耦合电极。 布置成执行无线IC芯片和每个辐射电极之间的阻抗匹配的匹配电路包括电容耦合电极。 结果，可以减小无线IC器件的尺寸，便于设计和降低成本。

    WIRELESS COMMUNICATION DEVICE
    30.
    发明申请
    WIRELESS COMMUNICATION DEVICE 有权

    公开(公告)号：US20140071017A1

    公开(公告)日：2014-03-13

    申请号：US14082435

    申请日：2013-11-18

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Ikuhei KIMURA ,  Nobuo IKEMOTO

    IPC: H01Q1/38

    CPC classification number: H01Q1/38 ,  G06K19/07767 ,  G06K19/07786 ,  H01L2224/16225 ,  H01Q1/2225 ,  H01Q7/00

    Abstract: A wireless communication device includes a wireless IC chip that processes a high-frequency signal and a feeding substrate including a coil conductor, a plane conductor, and a matching circuit that is connected to the wireless IC chip and that has a predetermined resonant frequency. The coil conductor and the plane conductor are connected to the matching circuit. The wireless communication device, when used by itself, operates as a monopole antenna in which the plane conductor functions as a ground and the coil conductor functions as a radiation element. When a conductive object is in a vicinity of the plane conductor, the plane conductor is coupled to the conductive object, and the wireless communication device operates as a dipole antenna in which the plane conductor and the conductive object function as a first radiation element and the coil conductor functions as a second radiation element.

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