公开(公告)号：US20060244114A1

公开(公告)日：2006-11-02

申请号：US11116981

申请日：2005-04-28

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H01L23/02

CPC classification number: H01L25/0657 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/4985 ,  H01L24/06 ,  H01L24/48 ,  H01L24/72 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/4824 ,  H01L2224/50 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83 ,  H01L2224/90 ,  H01L2225/06517 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam are provided. An exemplary chip-scale packaged (CSP) device comprising an integrated circuit having at least one major surface, the at least one major surface having a set of contacts, is provided. The CSP device may further comprise a flex circuit attached to at least a portion of the at least one major surface of the integrated circuit. The flex circuit may further comprise a first conductive layer for connecting a first CSP contact and a second conductive layer for connecting a second CSP contact. The CSP device may further comprise a preferably pre-stressed beam for connecting at least one signal CSP contact to at least one of the set of contacts on the at least one major surface of the integrated circuit.

Abstract translation: 提供了通过接触梁将集成电路上的一组触点连接到柔性电路的系统，方法和装置。 提供了包括具有至少一个主表面的集成电路的示例性芯片级封装（CSP）器件，所述至少一个主表面具有一组触点。 CSP装置还可以包括附接到集成电路的至少一个主表面的至少一部分的柔性电路。 柔性电路还可以包括用于连接第一CSP触点和用于连接第二CSP触点的第二导电层的第一导电层。 CSP装置还可以包括优选的预应力束，用于将至少一个信号CSP触点连接到集成电路的至少一个主表面上的该组触点中的至少一个。

公开(公告)号：US20060203442A1

公开(公告)日：2006-09-14

申请号：US11077952

申请日：2005-03-11

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: G06F1/16

CPC classification number: G11C5/04 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/09445 ,  H05K2203/1572

Abstract: Memory module flex circuitry is devised to accommodate packaged integrated circuit devices (ICs) of varying heights or thicknesses. The invention may be employed to advantage in a variety of modules that employ flex circuitry including, but not limited to, fully-buffered, registered or more simple memory modules. Many such modules may replace conventionally-constructed DIMMs without change to the system in which the module is employed. Regions of the flex circuitry devised to provide one or more mounting locales for ICs are delineated, in part, from the main body of the flex circuit. The delineation may be implemented in a preferred embodiment by separating a designated IC mounting area or peninsula from the main body of the flex circuitry either with isolating areas or separations or with tabs that extend from the primary perimeter of the flex circuitry.

公开(公告)号：US20060149923A1

公开(公告)日：2006-07-06

申请号：US11007745

申请日：2004-12-08

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: G06F15/00

CPC classification number: G06F15/17375

Abstract: Provided is a microprocessor optimized for algorithmic processing for accelerating algorithm processing through a closely coupled set of parallel sub-processing elements. The device includes a primary processor, one or more subprocessors and an interconnecting buss. The buss is preferably a crossbar buss. The primary processor is preferably a pipelined CPU with additional logic to support algorithm processing. The crossbar buss allows the data memory to function as the data memory in the CPU, and provides paths to configure and initialize the algorithm subprocessors and to retrieve results from the subprocessors. The subprocessors are processing elements that execute segments of code on blocks of data. Preferably, the subprocessors are reconfigurable to optimize performance for the algorithm being executed.

Abstract translation: 提供了一种针对算法处理优化的微处理器，用于通过紧密耦合的并行子处理元件集加速算法处理。 该设备包括主处理器，一个或多个子处理器和互连总线。 母线最好是横梁总成。 主处理器优选地是具有附加逻辑以支持算法处理的流水线CPU。 交叉开关总线允许数据存储器用作CPU中的数据存储器，并提供路径来配置和初始化算法子处理器并从子处理器检索结果。 子处理器是在数据块上执行代码段的处理元素。 优选地，子处理器可重新配置以优化正在执行的算法的性能。

公开(公告)号：US20060050489A1

公开(公告)日：2006-03-09

申请号：US11255061

申请日：2005-10-19

Applicant: James Wehrly ,  Mark Wolfe ,  Paul Goodwin

Inventor： James Wehrly ,  Mark Wolfe ,  Paul Goodwin

IPC: H05K1/00

CPC classification number: H05K1/189 ,  H01L25/0652 ,  H01L25/105 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.

公开(公告)号：US20060049513A1

公开(公告)日：2006-03-09

申请号：US11193954

申请日：2005-07-29

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H01L23/34

CPC classification number: G11C5/00 ,  G11C5/143 ,  H01L23/34 ,  H01L23/36 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2224/0401

Abstract: A flex circuit populated with integrated circuits on one or both sides and in one or more fields along the flex circuitry is wrapped about an edge of a supporting substrate. In preferred embodiments, the substrate is thermally conductive material. One side of the flex circuitry has a connective facility implemented in a preferred embodiment with edge connector contacts such as those that would allow the resulting module to be inserted into an expansion socket. In a preferred embodiment, integrated circuits (preferably memory CSPs) and any accompanying circuitry or buffers are arranged on one or both sides of a flexible circuit. In some embodiments, one or more thermal sensors or other indicators are thermally coupled to the module substrate.

Abstract translation: 在柔性电路的一侧或两侧以及一个或多个场中填充有集成电路的柔性电路围绕支撑衬底的边缘缠绕。 在优选实施例中，基底是导热材料。 柔性电路的一侧具有在优选实施例中实现的连接设备，其中边缘连接器触点例如将允许所得到的模块插入到扩展插座中的连接器触点。 在优选实施例中，集成电路（优选存储器CSP）和任何伴随的电路或缓冲器布置在柔性电路的一侧或两侧。 在一些实施例中，一个或多个热传感器或其它指示器热耦合到模块基板。

公开(公告)号：US20060039010A1

公开(公告)日：2006-02-23

申请号：US11202745

申请日：2005-08-12

Applicant: Steven Reese ,  Carl Brown ,  Paul Goodwin

Inventor： Steven Reese ,  Carl Brown ,  Paul Goodwin

IPC: G01B11/24

CPC classification number: G02B21/367 ,  G06T1/0007 ,  H04N5/349 ,  H04N5/37206 ,  H04N5/3743

Abstract: An image acquisition system and method employing multi-axis integration (MAI) may incorporate both optical axis integration (OAI) and time-delay integration (TDI) techniques. Disclosed MAI systems and methods may integrate image data in the z direction as the data are acquired, projecting the image data prior to deconvolution. Lateral translation of the image plane during the scan in the z direction may allow large areas to be imaged in a single scan sequence.

公开(公告)号：US4876054A

公开(公告)日：1989-10-24

申请号：US161294

申请日：1988-02-24

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: E04G13/02

CPC classification number: E04G13/021 ,  Y10S249/02

Abstract: The present invention relates to a disposable concrete forming apparatus. The apparatus includes an elongate, tubular and rigid form having at least one inner wall surface defining an enclosure in which concrete can be poured and allowed to harden. The apparatus further includes a flexible liner of predetermined thickness which lines the inner surface to preclude formation of form lines on the hardened concrete that correspond to markings on the inner wall surface of the rigid form. The flexible liner has at least one outside wall surface for each inner wall surface and is movable between a compressed position permitting insertion of the liner into the enclosure and a normal expanded position with the outside wall surface pressing against the inner wall surface of the rigid form. As a result, no gap is present between the inner wall surface and the outer wall surface.

Abstract translation: 本发明涉及一次性混凝土成型装置。 该装置包括细长的管状和刚性形式，其具有限定外壳的至少一个内壁表面，混凝土可以在其中倾倒并允许其硬化。 该装置还包括具有预定厚度的柔性衬里，其沿着内表面排除在硬化混凝土上形成对应于刚性形式的内壁表面上的标记的成形线。 柔性衬里具有用于每个内壁表面的至少一个外壁表面，并且可在允许衬套插入外壳的压缩位置和正常扩展位置之间移动，其中外壁表面压靠刚性形式的内壁表面 。 结果，在内壁表面和外壁表面之间不存在间隙。

公开(公告)号：US08951070B1

公开(公告)日：2015-02-10

申请号：US14053028

申请日：2013-10-14

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H01R24/00 ,  H01R12/72

CPC classification number: H01R12/721 ,  H01R12/7082

Abstract: A high speed, high reliability connector that may be employed with standard Serial ATA (SATA) or Serial Attached SCSI (SAS) compliant receptacle connectors. The present invention reduces impedance discontinuity by reducing the interconnection length and cross-planar transit found in typical SATA and SAS compliant connectors.

Abstract translation: 可用于标准串行ATA（SATA）或串行连接SCSI（SAS）兼容插座连接器的高速，高可靠性连接器。 本发明通过减少在典型的SATA和SAS兼容连接器中发现的互连长度和跨平面转移来减少阻抗不连续性。

公开(公告)号：US08558154B2

公开(公告)日：2013-10-15

申请号：US13221710

申请日：2011-08-30

Applicant: Jeremy Cooper ,  Paul Goodwin ,  Stephen G. Goodson

Inventor： Jeremy Cooper ,  Paul Goodwin ,  Stephen G. Goodson

IPC: G02B27/64

CPC classification number: G02B21/16 ,  G02B21/245

Abstract: The current application is directed to autofocus subsystems within optical instruments that continuously monitor the focus of the optical instruments and adjust distances within the optical instrument along the optical axis in order to maintain a precise and stable optical-instrument focus at a particular point or surface on, within, or near a sample. Certain autofocus implementations operate asynchronously with respect to operation of other components and subsystems of the optical instrument in which they are embedded. The described autofocus subsystems employ multiple calibration curves to precisely adjust the z-position of an optical instrument.

Abstract translation: 目前的应用是针对光学仪器内的自动对焦子系统，其连续地监视光学仪器的焦点并且沿着光轴调整光学仪器内的距离，以便在特定点或表面上保持精确和稳定的光学仪器焦点 ，在样本内或附近。 某些自动对焦实现方式相对于嵌入其中的光学仪器的其他组件和子系统的操作而异步操作。 所描述的自动对焦子系统使用多个校准曲线来精确地调整光学仪器的z位置。

公开(公告)号：US07606050B2

公开(公告)日：2009-10-20

申请号：US11187269

申请日：2005-07-22

Applicant: James W. Cady ,  James Douglas Wehrly, Jr. ,  Paul Goodwin

Inventor： James W. Cady ,  James Douglas Wehrly, Jr. ,  Paul Goodwin

IPC: H05K7/00

CPC classification number: H05K1/189 ,  H05K2201/056 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: A flexible circuit is populated on one or both sides and disposed about a substrate to create a circuit module. Along one of its edges, the flex circuit is connected to a connective facility such as a multiple pin connector while the flex circuit is disposed about a thermally-conductive form that provides structure to create a module with plural layers of circuitry in a single module. In preferred embodiments, the form is metallic and, in alternative preferred embodiments, the module circuitry is disposed within a housing. Preferred embodiments may be devised that present a compact flash module within a housing that may be connected to or into a system or product through a connective facility that is preferably a male or female socket connector while the housing is configured to mechanically adapt to an application environment.

Abstract translation: 柔性电路填充在一侧或两侧并且设置在基板周围以形成电路模块。 沿着其边缘之一，柔性电路连接到诸如多针连接器的连接设备，而柔性电路围绕导热形式设置，其提供结构以在单个模块中创建具有多层电路的模块。 在优选实施例中，该形式是金属的，并且在替代优选实施例中，模块电路设置在壳体内。 可以设计出优选实施例，其在壳体内呈现紧凑型闪光模块，其可以通过连接设备连接到系统或产品，该连接设备优选地是公插座或母插座连接器，而壳体被配置为机械地适应应用环境 。