公开(公告)号：US20190287892A1

公开(公告)日：2019-09-19

申请号：US15924697

申请日：2018-03-19

Applicant: TactoTek Oy

Inventor： Jarmo SÄÄSKI ,  Mikko HEIKKINEN ,  Tero HEIKKINEN ,  Mika PAANI ,  Jan TILLONEN ,  Ronald HAAG

IPC: H01L23/522 ,  H01L23/50 ,  H01L25/065 ,  H01L23/14 ,  H05K3/46

Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.

公开(公告)号：US20190064431A1

公开(公告)日：2019-02-28

申请号：US16155956

申请日：2018-10-10

Applicant: Tactotek Oy

Inventor： Antti KERÄNEN ,  Mikko HEIKKINEN

IPC: F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/12 ,  H05K3/28

Abstract: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

公开(公告)号：US20190042030A1

公开(公告)日：2019-02-07

申请号：US16156008

申请日：2018-10-10

Applicant: TACTOTEK OY

Inventor： Jarmo SAASKI ,  Jarkko TORVINEN ,  Pasi RAAPPANA ,  Mikko HEIKKINEN

IPC: G06F3/044 ,  B29C45/14 ,  B32B27/08 ,  H05K1/03 ,  H05K1/14 ,  H05K3/28 ,  H05K3/12 ,  H05K1/02 ,  H05K1/18 ,  H05K3/36

Abstract: An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

公开(公告)号：US20180295712A1

公开(公告)日：2018-10-11

申请号：US15811889

申请日：2017-11-14

Applicant: TactoTek Oy

Inventor： Mikko HEIKKINEN ,  Jarmo Saaski

IPC: H05K1/02 ,  H05K3/12 ,  H05K3/28 ,  H05K1/11 ,  H05K3/40

Abstract: A method for manufacturing an electronic assembly and electronic assemblies are presented. The method includes obtaining a substrate film for accommodating electronics, providing at least an electrical contact pad to the substrate film, coupling an electrically conductive member to the electrical contact pad, and molding, such as injection molding, a material layer onto the substrate film to embed the elastic electrically conductive member utilizing a mold structure defining a cavity for molding. The elastic electrically conductive member is arranged to extend during the molding from the electrical contact pad through the cavity to be in contact with an element on a different side of the cavity with respect to the electrical contact pad for maintaining at least a part of the elastic electrically conductive member accessible after the molding to provide an electrical connection through the material layer to the electrical contact pad.

公开(公告)号：US20170094800A1

公开(公告)日：2017-03-30

申请号：US15279080

申请日：2016-09-28

Applicant: TactoTek Oy

Inventor： Antti KERANEN ,  Mikko HEIKKINEN ,  Pasi RAAPPANA ,  Jarmo SAASKI

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/16 ,  H05K3/46 ,  H05K3/12 ,  H05K3/28 ,  H05K3/00 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/189 ,  H05K1/0269 ,  H05K1/028 ,  H05K1/111 ,  H05K1/118 ,  H05K1/16 ,  H05K3/0044 ,  H05K3/12 ,  H05K3/28 ,  H05K3/4092 ,  H05K3/46 ,  H05K2201/0129 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/09754 ,  H05K2203/0228 ,  H05K2203/1316

Abstract: A multilayer structure includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, printed on the first side for establishing a desired predetermined circuit design, a plastic layer molded onto the first side so as to enclose the circuit between the plastic layer and the first side, and a connector in a form of a flexible flap for providing external electrical connection to the embedded circuit from the second, opposite side, the connector defined by a portion of the substrate film accommodating at least part of one or more of the printed conductive traces and cut partially loose from the surrounding substrate material to establish the flap, whose loose end is bendable away from the molded plastic layer to facilitate establishment of the electrical connection with external element, wire or connector, via the associated gap.

公开(公告)号：US20160345437A1

公开(公告)日：2016-11-24

申请号：US15158645

申请日：2016-05-19

Applicant: TactoTek Oy

Inventor： Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Jarkko TORVINEN

IPC: H05K1/18 ,  H01L33/62 ,  H01L33/52 ,  H01L33/48 ,  H01L31/0203 ,  H05K1/02 ,  H01L31/02

CPC classification number: H05K1/186 ,  H01L23/4985 ,  H01L23/5387 ,  H01L33/52 ,  H01L51/0097 ,  H01L2224/1319 ,  H01L2933/005 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/05 ,  H05K2201/09872 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1322

Abstract: A multilayer structure for an electronic device having a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said substrate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208). The invention also relates to a method for manufacturing a multilayer structure for an electronic device

Abstract translation: 一种用于电子设备的多层结构，其具有用于容纳电子设备（204）的柔性基底膜（202）。 设置在所述衬底膜（202）上的至少一个电子部件（204）; 以及设置在所述衬底膜（202）上的多个导电迹线（206），用于对包括所述至少一个电子部件（204）的电子元件进行电力供应和/或连接，其中至少一个优选地，热成型盖（210）附接到所述 在所述至少一个电子部件（204）的顶部上的所述基底膜（202），所述至少一个热成型盖（210）和容纳所述电子器件（204）的所述基底膜（202）用热塑性材料（208）包覆成型。 本发明还涉及一种用于制造电子设备的多层结构的方法

公开(公告)号：US20150257278A1

公开(公告)日：2015-09-10

申请号：US14198833

申请日：2014-03-06

Applicant: TactoTek Oy

Inventor： Paavo NISKALA ,  Pasi RAAPPANA ,  Mikko HEIKKINEN ,  Mikko SIPPARI ,  Jarkko TORVINEN

IPC: H05K3/12 ,  H05K1/11 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30

CPC classification number: H05K3/1216 ,  H05K1/0284 ,  H05K1/092 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/0108 ,  H05K2203/1105 ,  H05K2203/1316 ,  Y10T29/53174

Abstract: A method for manufacturing an electronic product, comprising providing a flexible, optionally optically substantially transparent or translucent, substrate film, printing a number of conductive traces of conductive ink on the substrate film, said traces defining a number of conductors and conductive contact areas for the contacts of at least one electronic surface-mountable component, disposing the at least one electronic surface-mountable component, such as an integrated circuit, on the substrate film so that the contacts meet the predefined contact areas when they are still wet to establish the electrical connection therebetween, and further securing, optionally overmoulding, the component. Related arrangement and electronic product are presented.

Abstract translation: 一种用于制造电子产品的方法，包括提供柔性的，可选地光学上基本上透明或半透明的基底膜，在基底膜上印刷多个导电墨水导电迹线，所述迹线限定多个导体和导电接触区域，用于 至少一个电子表面可安装部件的接触件，将至少一个电子表面安装部件（例如集成电路）布置在基板膜上，使得当它们仍然是湿的时候触点满足预定的接触区域以建立电气 连接，并且进一步固定，任选地包覆成型组件。 介绍相关安排和电子产品。

公开(公告)号：US20240373559A1

公开(公告)日：2024-11-07

申请号：US18775176

申请日：2024-07-17

Applicant: TactoTek Oy

Inventor： Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Ilpo HÄNNINEN ,  Antti KERÄNEN ,  Tomi SIMULA ,  Vinski BRÄYSY ,  Pälvi APILO ,  Pasi KORHONEN ,  Topi WUORI

IPC: H05K1/18 ,  B29C51/14 ,  B29L31/34 ,  G01P1/02 ,  H05K3/00 ,  H05K3/30

Abstract: An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.

公开(公告)号：US20240284598A1

公开(公告)日：2024-08-22

申请号：US18644647

申请日：2024-04-24

Applicant: TactoTek Oy

Inventor： Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Ilpo HÄNNINEN ,  Antti KERÄNEN ,  Tomi SIMULA ,  Vinski BRÄYSY ,  Pälvi APILO ,  Pasi KORHONEN ,  Topi WUORI

IPC: H05K1/18 ,  B29C51/14 ,  B29L31/34 ,  G01P1/02 ,  H05K3/00 ,  H05K3/30

CPC classification number: H05K1/185 ,  B29C51/14 ,  G01P1/02 ,  H05K3/0014 ,  H05K3/306 ,  B29L2031/3425 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2203/1327 ,  H05K2203/166

Abstract: An interface assembly includes a functional multilayer structure that includes a first substrate a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further comprises includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.

公开(公告)号：US20240003516A1

公开(公告)日：2024-01-04

申请号：US18339427

申请日：2023-06-22

Applicant: TactoTek Oy

Inventor： Antti KERÄNEN ,  Sami TORVINEN ,  Tero HEIKKINEN ,  Pasi KORHONEN ,  Pälvi APILO ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Paavo NISKALA ,  Ville WALLENIUS ,  Heikki TUOVINEN ,  Janne ASIKKALA ,  Taneli SALMI ,  Suvi KELA ,  Outi RUSANEN ,  Johanna JUVANI ,  Mikko SIPPARI ,  Tomi SIMULA ,  Tapio RAUTIO ,  Samuli YRJÄNÄ ,  Tero RAJANIEMI ,  Simo KOIVIKKO ,  Juha-Matti HINTIKKA ,  Hasse SINIVAARA ,  Vinski BRÄYSY ,  Olimpia MIGLIORE ,  Juha SEPPONEN

IPC: F21V7/00

CPC classification number: F21V7/00

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.