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21.发明授权公开(公告)号：US10675834B2
公开(公告)日：2020-06-09
申请号：US16193360
申请日：2018-11-16
Applicant: TactoTek Oy
Inventor： Vinski Bräysy , Anne Isohätälä , Jarmo Sääski , Tomi Simula
Abstract: A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.
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公开(公告)号：US12137523B1
公开(公告)日：2024-11-05
申请号：US18775176
申请日：2024-07-17
Applicant: TactoTek Oy
Inventor： Mikko Heikkinen , Jarmo Sääski , Ilpo Hänninen , Antti Keränen , Tomi Simula , Vinski Bräysy , Pälvi Apilo , Pasi Korhonen , Topi Wuori
Abstract: An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.
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公开(公告)号：US11906774B2
公开(公告)日：2024-02-20
申请号：US18326110
申请日：2023-05-31
Applicant: TactoTek Oy
Inventor： Antti Keränen , Tero Heikkinen , Pasi Korhonen , Pälvi Apilo , Mikko Heikkinen , Jarmo Sääski , Paavo Niskala , Ville Wallenius , Heikki Tuovinen , Janne Asikkala , Taneli Salmi , Suvi Kela , Outi Rusanen , Johanna Juvani , Mikko Sippari , Tomi Simula , Tapio Rautio , Samuli Yrjänä , Tero Rajaniemi , Simo Koivikko , Juha-Matti Hintikka , Hasse Sinivaara , Vinski Bräysy , Olimpia Migliore , Juha Sepponen
CPC classification number: G02B6/0031 , G02B6/004 , G02B6/0021 , G02B6/0036 , G02B6/0041 , G02B6/0043 , G02B6/0051 , G02B6/0055 , G02B6/0061 , G02B6/0065 , G02B6/0068 , G02B6/0073 , G02B6/0083 , G02B5/0883
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.
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24.发明授权公开(公告)号：US11530808B1
公开(公告)日：2022-12-20
申请号：US17889569
申请日：2022-08-17
Applicant: TactoTek Oy
Inventor： Vinski Bräysy , Ilpo Hänninen , Mikko Heikkinen , Pälvi Apilo , Jarmo Sääski , Tomi Simula , Topi Wuori , Giovanni Ferri , Pasi Korhonen
Abstract: An integrated functional multilayer structure, includes a flexible preferably 3D-formable and thermoplastic, substrate film; a lighting module provided upon the substrate film and preferably electrically connected to the circuit design thereon, the lighting module having a circuit board for hosting electronics; and circuitry arranged on the circuit board including at least one light source; a thermoplastic layer including one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module; wherein the circuitry on the circuit board of the lighting module including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material positioned in between, preferably at least at the periphery of the circuit board. A related method of manufacture is also presented.
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公开(公告)号：US11500142B1
公开(公告)日：2022-11-15
申请号：US17856959
申请日：2022-07-02
Applicant: TactoTek Oy
Inventor： Antti Keränen , Tero Heikkinen , Pasi Korhonen , Pälvi Apilo , Mikko Heikkinen , Jarmo Sääski , Paavo Niskala , Ville Wallenius , Heikki Tuovinen , Janne Asikkala , Taneli Salmi , Suvi Kela , Outi Rusanen , Johanna Juvani , Mikko Sippari , Tomi Simula , Tapio Rautio , Samuli Yrjänä , Tero Rajaniemi , Simo Koivikko , Juha-Matti Hintikka , Hasse Sinivaara , Vinski Bräysy , Olimpia Migliore , Juha Sepponen
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.
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Patent Agency Ranking
26.发明授权公开(公告)号：US11460185B1
公开(公告)日：2022-10-04
申请号：US17704329
申请日：2022-03-25
Applicant: TactoTek Oy
Inventor： Vinski Bräysy , Ilpo Hänninen , Mikko Heikkinen , Pälvi Apilo , Jarmo Sääski , Tomi Simula , Topi Wuori , Giovanni Ferri , Pasi Koronen
Abstract: An integrated functional multilayer structure, includes a flexible preferably 3D-formable and thermoplastic, substrate film; a lighting module provided upon the substrate film and preferably electrically connected to the circuit design thereon, the lighting module having a circuit board for hosting electronics; and circuitry arranged on the circuit board including at least one light source; a thermoplastic layer including one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module; wherein the circuitry on the circuit board of the lighting module including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material positioned in between, preferably at least at the periphery of the circuit board. A related method of manufacture is also presented.
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公开(公告)号：US11175438B1
公开(公告)日：2021-11-16
申请号：US17321740
申请日：2021-05-17
Applicant: TactoTek Oy
Inventor： Juha-Matti Hintikka , Miikka Kärnä , Heikki Tuovinen , Tuomas Nieminen , Johannes Soutukorva , Ville Wallenius , Tero Rajaniemi , Tomi Simula , Jari Lihavainen , Mikko Heikkinen , Jarmo Sääski , Hasse Sinivaara , Antti Keränen , Ilpo Hänninen
IPC: G02B5/00 , B29D11/00 , G02F1/1335 , G02F1/1362
Abstract: An optoelectronically functional multilayer structure and related methods of manufacturing an optoelectronically functional multilayer structure, such structure including an optionally thermoplastic formable substrate film, electronics comprising preferably light-emitting and/or light-sensitive elements, an optically transmissive layer, and a light-blocking layer defining a number of structural channels extending in at least a first direction.
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公开(公告)号：US20210195731A1
公开(公告)日：2021-06-24
申请号：US16724631
申请日：2019-12-23
Applicant: TACTOTEK OY
Inventor： Tapio RAUTIO , Tomi Simula , Minna Pirkonen , Jarkko Torvinen , Tuukka Junkkari , Janne Asikkala , Hasse Sinivaara
IPC: H05K1/02
Abstract: A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.
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公开(公告)号：US10645796B1
公开(公告)日：2020-05-05
申请号：US16245643
申请日：2019-01-11
Applicant: TACTOTEK OY
Inventor： Antti Keränen , Tomi Simula , Mikko Heikkinen , Jarmo Sääski , Pasi Raappana , Minna Pirkonen
Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.
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公开(公告)号：US10285261B1
公开(公告)日：2019-05-07
申请号：US16202145
申请日：2018-11-28
Applicant: TactoTek Oy
Inventor： Tomi Simula , Vinski Bräysy , Mikko Heikkinen , Juha-Matti Hintikka , Juhani Harvela , Minna Pirkonen , Pasi Raappana , Tuomas Heikkilä , Jarmo Sääski
Abstract: An electrical node including a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element arranged into the cavity, wherein the first material layer includes elastic material to reduce thermal expansion related stresses between elements adjacent thereto.
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