Method for manufacturing a multilayer structure with embedded functionalities and related multilayer structure

    公开(公告)号:US11357111B2

    公开(公告)日:2022-06-07

    申请号:US16113388

    申请日:2018-08-27

    Applicant: TactoTek Oy

    Abstract: A method for manufacturing an integrated multilayer structure includes obtaining a substrate film having first and second sides, providing at least on the first side one or more first functional features, arranging at least one layer upon at least the first side; removing, at least a portion of the substrate film so that space is released in the structure wherein a detachment-enhancing feature provided to the substrate film is configured to facilitate the removal of the at least a portion of the substrate film such that the adjacent remaining film material, if any, the arranged layer and the one or more first functional features are preserved and preferably remain substantially intact; and providing at least one second functional feature into the space released for use so that the at least one second functional feature operatively connects with at least one of the one or more first functional features.

    INTEGRATED FUNCTIONAL MULTILAYER STRUCTURE AND METHOD OF MANUFACTURE THEREFOR

    公开(公告)号:US20210195731A1

    公开(公告)日:2021-06-24

    申请号:US16724631

    申请日:2019-12-23

    Applicant: TACTOTEK OY

    Abstract: A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.

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