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公开(公告)号：US11817534B1
公开(公告)日：2023-11-14
申请号：US17856958
申请日：2022-07-02
Applicant: TactoTek Oy
Inventor： Antti Keränen , Sami Torvinen , Tero Heikkinen , Pasi Korhonen , Pälvi Apilo , Mikko Heikkinen , Jarmo Sääski , Paavo Niskala , Ville Wallenius , Heikki Tuovinen , Janne Asikkala , Taneli Salmi , Suvi Kela , Outi Rusanen , Johanna Juvani , Mikko Sippari , Tomi Simula , Tapio Rautio , Samuli Yrjänä , Tero Rajaniemi , Simo Koivikko , Juha-Matti Hintikka , Hasse Sinivaara , Vinski Bräysy , Olimpia Migliore , Juha Sepponen
IPC: H01L33/60 , H01L33/62 , H01L25/075 , H01L33/00
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/005 , H01L33/62 , H01L2933/0058 , H01L2933/0066
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.
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2.发明授权公开(公告)号：US09990455B1
公开(公告)日：2018-06-05
申请号：US15840549
申请日：2017-12-13
Applicant: TactoTek Oy
Inventor： Hasse Sinivaara , Tuomas Heikkilä , Antti Keränen
IPC: G06F17/50 , G05B19/4099
CPC classification number: G06F17/5072 , G05B19/4099 , G05B2219/45031 , G06F17/5018 , G06F17/5081 , G06F2217/02 , G06F2217/04 , G06F2217/06 , G06F2217/12
Abstract: An electronic arrangement for facilitating circuit layout design in connection with three-dimensional (3D) target designs, the arrangement including at least one communication interface for transferring data, at least one processor for processing instructions and other data, and a memory for storing the instructions and other data. The at least one processor being configured, in accordance with the stored instructions, to cause: obtaining and storing information in a data repository hosted by the memory, receiving design input characterizing 3D target design to be produced from a substrate, determining a mapping between locations of the 3D target design and the substrate, and establishing and providing digital output comprising human and/or machine readable instructions indicative of the mapping to a receiving entity, such as a manufacturing equipment, e.g. printing, electronics assembly and/or forming equipment.
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公开(公告)号：US12130005B2
公开(公告)日：2024-10-29
申请号：US18339427
申请日：2023-06-22
Applicant: TactoTek Oy
Inventor： Antti Keränen , Sami Torvinen , Tero Heikkinen , Pasi Korhonen , Pälvi Apilo , Mikko Heikkinen , Jarmo Sääski , Paavo Niskala , Ville Wallenius , Heikki Tuovinen , Janne Asikkala , Taneli Salmi , Suvi Kela , Outi Rusanen , Johanna Juvani , Mikko Sippari , Tomi Simula , Tapio Rautio , Samuli Yrjänä , Tero Rajaniemi , Simo Koivikko , Juha-Matti Hintikka , Hasse Sinivaara , Vinski Bräysy , Olimpia Migliore , Juha Sepponen
CPC classification number: F21V7/00
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.
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4.发明授权公开(公告)号：US10485094B1
公开(公告)日：2019-11-19
申请号：US16113198
申请日：2018-08-27
Applicant: TactoTek Oy
Inventor： Anne Isohätälä , Hasse Sinivaara , Heikki Tuovinen , Ville Wallenius , Vinski Bräysy , Tomi Simula , Mikko Heikkinen , Minna Pirkonen , Tuukka Junkkari , Jarmo Sääski , Janne Asikkala , Antti Keränen
Abstract: Integrated multilayer structure suitable for use in sensing applications is disclosed including at least one plastic layer, at least one film layer provided on both sides of the plastic layer. A film layer on a first side of the plastic layer includes electronics incorporating reactance sensing electronics for sensing of selected target quantities, and conversion thereof into representative electrical signals. The sensing electronics include an electrode and a connection element for connecting the electrode to control circuitry. A film layer on a second side of the plastic layer includes features including one conductive feature that is configured to shape an electromagnetic field to adapt a sensitivity or directionality the sensing response of the sensing electronics on the first side of the plastic layer.
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公开(公告)号：US11914184B2
公开(公告)日：2024-02-27
申请号：US18339467
申请日：2023-06-22
Applicant: TactoTek Oy
Inventor： Antti Keränen , Tero Heikkinen , Pasi Korhonen , Pälvi Apilo , Mikko Heikkinen , Jarmo Sääski , Paavo Niskala , Ville Wallenius , Heikki Tuovinen , Janne Asikkala , Taneli Salmi , Suvi Kela , Outi Rusanen , Johanna Juvani , Mikko Sippari , Tomi Simula , Tapio Rautio , Samuli Yrjänä , Tero Rajaniemi , Simo Koivikko , Juha-Matti Hintikka , Hasse Sinivaara , Vinski Bräysy , Olimpia Migliore , Juha Sepponen
CPC classification number: G02B6/0031 , G02B6/004 , G02B6/0021 , G02B6/0036 , G02B6/0041 , G02B6/0043 , G02B6/0051 , G02B6/0055 , G02B6/0061 , G02B6/0065 , G02B6/0068 , G02B6/0073 , G02B6/0083 , G02B5/0883
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.
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Patent Agency Ranking
公开(公告)号：US20190389106A1
公开(公告)日：2019-12-26
申请号：US16561213
申请日：2019-09-05
Applicant: TactoTek Oy
Inventor： Anne Isohätälä , Hasse Sinivaara , Mikko Heikkinen
Abstract: A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.
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公开(公告)号：US11906774B2
公开(公告)日：2024-02-20
申请号：US18326110
申请日：2023-05-31
Applicant: TactoTek Oy
Inventor： Antti Keränen , Tero Heikkinen , Pasi Korhonen , Pälvi Apilo , Mikko Heikkinen , Jarmo Sääski , Paavo Niskala , Ville Wallenius , Heikki Tuovinen , Janne Asikkala , Taneli Salmi , Suvi Kela , Outi Rusanen , Johanna Juvani , Mikko Sippari , Tomi Simula , Tapio Rautio , Samuli Yrjänä , Tero Rajaniemi , Simo Koivikko , Juha-Matti Hintikka , Hasse Sinivaara , Vinski Bräysy , Olimpia Migliore , Juha Sepponen
CPC classification number: G02B6/0031 , G02B6/004 , G02B6/0021 , G02B6/0036 , G02B6/0041 , G02B6/0043 , G02B6/0051 , G02B6/0055 , G02B6/0061 , G02B6/0065 , G02B6/0068 , G02B6/0073 , G02B6/0083 , G02B5/0883
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.
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公开(公告)号：US11500142B1
公开(公告)日：2022-11-15
申请号：US17856959
申请日：2022-07-02
Applicant: TactoTek Oy
Inventor： Antti Keränen , Tero Heikkinen , Pasi Korhonen , Pälvi Apilo , Mikko Heikkinen , Jarmo Sääski , Paavo Niskala , Ville Wallenius , Heikki Tuovinen , Janne Asikkala , Taneli Salmi , Suvi Kela , Outi Rusanen , Johanna Juvani , Mikko Sippari , Tomi Simula , Tapio Rautio , Samuli Yrjänä , Tero Rajaniemi , Simo Koivikko , Juha-Matti Hintikka , Hasse Sinivaara , Vinski Bräysy , Olimpia Migliore , Juha Sepponen
Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.
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公开(公告)号：US11175438B1
公开(公告)日：2021-11-16
申请号：US17321740
申请日：2021-05-17
Applicant: TactoTek Oy
Inventor： Juha-Matti Hintikka , Miikka Kärnä , Heikki Tuovinen , Tuomas Nieminen , Johannes Soutukorva , Ville Wallenius , Tero Rajaniemi , Tomi Simula , Jari Lihavainen , Mikko Heikkinen , Jarmo Sääski , Hasse Sinivaara , Antti Keränen , Ilpo Hänninen
IPC: G02B5/00 , B29D11/00 , G02F1/1335 , G02F1/1362
Abstract: An optoelectronically functional multilayer structure and related methods of manufacturing an optoelectronically functional multilayer structure, such structure including an optionally thermoplastic formable substrate film, electronics comprising preferably light-emitting and/or light-sensitive elements, an optically transmissive layer, and a light-blocking layer defining a number of structural channels extending in at least a first direction.
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公开(公告)号：US20210195731A1
公开(公告)日：2021-06-24
申请号：US16724631
申请日：2019-12-23
Applicant: TACTOTEK OY
Inventor： Tapio RAUTIO , Tomi Simula , Minna Pirkonen , Jarkko Torvinen , Tuukka Junkkari , Janne Asikkala , Hasse Sinivaara
IPC: H05K1/02
Abstract: A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.
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