公开(公告)号：US20180211784A1

公开(公告)日：2018-07-26

申请号：US15819804

申请日：2017-11-21

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Katsumi KOBAYASHI ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/248 ,  H01G4/38 ,  H01G4/30 ,  H01G4/232

Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, multiple pairs of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The multiple pairs of engagement arm portions extend from the electrode face portion toward the chip side surface and sandwich and hold the chip components. The mount portion extends from one of terminal second sides toward the chip components and is partially substantially vertical to the electrode face portion.

公开(公告)号：US20180197681A1

公开(公告)日：2018-07-12

申请号：US15819778

申请日：2017-11-21

Applicant: TDK Corporation

Inventor： Norihisa ANDO ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/248 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38

CPC classification number: H01G4/248 ,  H01G2/06 ,  H01G2/065 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38

Abstract: An electronic device includes a chip component and a metal terminal. The chip component has an element body where internal electrodes are laminated inside and a terminal electrode formed outside the element body and connected with end parts of the internal electrodes. The metal terminal is connected with the terminal electrode of the chip component. The metal terminal includes an electrode face portion and a mount portion. The electrode face portion is arranged correspondingly with an end surface of the terminal electrode. The mount portion is mounted on a mount surface. The electrode face portion is provided with an opening portion so that a part of the terminal electrode corresponding with at least a part of the internal electrodes is exposed to the outside.

公开(公告)号：US20180075973A1

公开(公告)日：2018-03-15

申请号：US15702047

申请日：2017-09-12

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Masahiro MORI ,  Sunao MASUDA ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/38 ,  H01G4/248 ,  H01G4/224

Abstract: An electronic device including: a first chip component, having approximately rectangular parallelepiped shape; a second chip component, having approximately rectangular parallelepiped shape; and an external terminal electrically connected to a first terminal electrode and a second terminal electrode. The external terminal includes an electrode connecting component, connected to the first terminal electrode and the second terminal electrode. The electrode connecting component includes: a first component, connected to the coupling component and faces the first terminal electrode; and a second component, extends upward from the first component and faces the first terminal electrode and the second terminal electrode. Length of the second component in a width direction is shorter than a length of the first component in a width direction. Length W2 of the second component in a width direction is shorter than lengths W3, W4 of the first chip component and the second chip component in a width direction.

公开(公告)号：US20220028610A1

公开(公告)日：2022-01-27

申请号：US17371668

申请日：2021-07-09

Applicant: TDK CORPORATION

Inventor： Kosuke YAZAWA

IPC: H01G2/10 ,  H01G13/00

Abstract: A method for producing a resin mold-type electronic component in which an electronic component main body is covered with a mold resin includes preparing a first mold resin provided with a metal terminal, having an accommodating portion for the electronic component main body, and having a joining material filling space to be filled with a joining material, accommodating the electronic component main body in the accommodating portion of the first mold resin, and joining the metal terminal and a terminal electrode of the electronic component main body by filling the joining material filling space with the joining material.

公开(公告)号：US20210375547A1

公开(公告)日：2021-12-02

申请号：US17229393

申请日：2021-04-13

Applicant: TDK CORPORATION

Inventor： Shinya SAITO ,  Kenya TAMAKI ,  Norihisa ANDO ,  Shinya ITO ,  Akihiro MASUDA ,  Kosuke YAZAWA ,  Yoshiki SATOU ,  Katsumi KOBAYASHI ,  Toshihiro IGUCHI

IPC: H01G4/224 ,  H01G4/232 ,  H01G4/38 ,  H01H85/175 ,  H01H85/08 ,  H01G2/06

Abstract: An electronic device includes chip components, a case, conductive terminals, and a fuse. The chip components each include a terminal electrode. The case includes accommodation recesses for accommodating the chip components. The conductive terminals are fixed to the case and respectively connected to the terminal electrodes of the chip components. The fuse electrically connects the chip components.

公开(公告)号：US20210043382A1

公开(公告)日：2021-02-11

申请号：US16988819

申请日：2020-08-10

Applicant: TDK CORPORATION

Inventor： Akihiro MASUDA ,  Norihisa ANDO ,  Shinya ITO ,  Kosuke YAZAWA ,  Yoshiki SATOU ,  Katsumi KOBAYASHI

IPC: H01G4/228 ,  H01G4/224

Abstract: A conductive terminal includes an inner electrode part, an opening edge electrode part, and a lateral electrode part. The inner electrode part is connectable to a terminal electrode of a chip component by being inserted along an inner wall of an accommodation recess of a case. The opening edge electrode part is formed continuously to the inner electrode part. The lateral electrode part is formed continuously to the opening edge electrode part along an outer surface of the case. The inner electrode part includes a base part, a curved part, and a continuous boundary part. The base part continues to the opening edge electrode part. The curved part is formed near a tip of the base part and protrudes away from the lateral electrode part. The continuous boundary part is formed between the base part and the curved part and continuously connects them.

公开(公告)号：US20200098521A1

公开(公告)日：2020-03-26

申请号：US16556735

申请日：2019-08-30

Applicant: TDK CORPORATION

Inventor： Shinya ITO ,  Norihisa ANDO ,  Yoshiki SATOU ,  Kosuke YAZAWA

IPC: H01G4/224 ,  H01G4/248 ,  H01G4/38

Abstract: An electronic device includes at least two chip components, a hold member with insulation, a first conductive terminal piece, a second conductive terminal piece, and an intermediate connection piece. The hold member holds the chip components side by side. The intermediate connection piece connects the terminal electrode of one of the chip components and the terminal electrode of the other chip component.

公开(公告)号：US20190304691A1

公开(公告)日：2019-10-03

申请号：US16369813

申请日：2019-03-29

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/228 ,  H01G4/12 ,  H01G4/012 ,  H01G4/30

Abstract: An electronic device assembly includes a first electronic device, a second electronic device, and a connection member. The first electronic device includes a first metal terminal configured to hold a first chip component. The second electronic device includes a second metal terminal configured to hold a second chip component. The connection member connects the first electronic device and the second electronic device.

公开(公告)号：US20190206626A1

公开(公告)日：2019-07-04

申请号：US16197870

申请日：2018-11-21

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/248 ,  H01G4/232 ,  H01G4/38 ,  H01G4/30

Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes an element body containing laminated internal electrodes and a terminal electrode formed outside the element body to connect with ends of the internal electrodes. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes an electrode facing portion, a holding portion, and a mount portion. A connection member connecting between the electrode facing portion and the end surface of the terminal electrode exists in a joint region in a predetermined range. A non-joint region is formed between an edge of the joint region and the holding portion. A non-joint gap between the electrode facing portion and the end surface of the terminal electrode becomes larger toward the holding portion in the non-joint region.

公开(公告)号：US20190080842A1

公开(公告)日：2019-03-14

申请号：US16121701

申请日：2018-09-05

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/01 ,  H01G4/232 ,  H05K3/34 ,  H01G4/30 ,  H01G4/38

Abstract: An electronic device includes a chip component and a metal terminal. The metal terminal is connected with the chip component. The metal terminal includes an electrode facing portion and a holding portion. The electrode facing portion is arranged correspondingly with an end surface of the terminal electrode of the chip component. The holding portion holds the chip component. A space region between the electrode facing portion and the end surface of the terminal electrode includes a joint region and a non-joint region. In the joint region, a connection member connects the electrode facing portion and the end surface of the terminal electrode. The non-joint region is formed without the connection member between a periphery of the joint region and the holding portion.