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公开(公告)号：US20190304690A1
公开(公告)日：2019-10-03
申请号：US16367937
申请日：2019-03-28
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The pair of holding pieces is formed on the terminal body and sandwiches the chip component. A width, a protrusion length, or a protrusion area of one of the pair of holding pieces is different from that of the other holding piece.
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公开(公告)号：US20190164694A1
公开(公告)日：2019-05-30
申请号：US16162580
申请日：2018-10-17
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: A ceramic electronic device includes a chip component, a metal terminal, and a conductive connection member. The component includes a terminal electrode surface on which a terminal electrode is formed. The metal terminal includes an opposing surface to the electrode surface. The connection member contains at least Sn and Sb and connects the terminal electrode surface and the opposing surface. The connection member includes a first part and a second part. In the first part, a distance between the terminal electrode surface and the opposing surface is a first distance, and Sb/Sn is a first value. In the second part, a distance between the terminal electrode surface and the opposing surface is a second distance being smaller than the first distance, and Sb/Sn is a second value being larger than the first value.
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公开(公告)号：US20180211783A1
公开(公告)日：2018-07-26
申请号：US15819674
申请日：2017-11-21
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Katsumi KOBAYASHI , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
CPC classification number: H01G4/248 , H01G2/06 , H01G4/008 , H01G4/12 , H01G4/232 , H01G4/30 , H01G4/38
Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, a pair of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The pair of engagement arm portions sandwich and hold the chip component. The mount portion extends from one of terminal second sides toward the chip component and is partially substantially vertical to the electrode face portion. The electrode face portion has a slit.
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公开(公告)号：US20150131202A1
公开(公告)日：2015-05-14
申请号：US14536032
申请日：2014-11-07
Applicant: TDK Corporation
Inventor： Sunao MASUDA , Katsumi Kobayashi , Akitoshi Yoshii
CPC classification number: H01G2/106 , H01G2/06 , H01G4/12 , H01G4/232 , H01G4/30 , H01G4/38 , H05K3/3426 , H05K2201/1053 , H05K2201/10537 , H05K2201/10636 , H05K2201/10946 , Y02P70/611
Abstract: The present invention is ceramic electronic component with metal terminals comprising a chip component of approximately parallelepiped shape having a pair of terminal electrodes, and a pair of metal terminal parts provided in accordance with said terminal electrodes. The terminal electrode is formed by wrapping around a part of side faces from an end face of the chip component. The metal terminal part comprises a connecting part connecting to the terminal electrode and including a connecting face extending approximately parallel to the end face, plurality of joint parts connecting to the connecting part and including a joint face extending in a different direction of the connecting face, and plurality of mounting parts connecting to the joint parts and including a mounting part upper face extending approximately parallel to any one of the side faces which is different direction of the joint face by taking predetermined spaces.
Abstract translation: 本发明是具有金属端子的陶瓷电子部件，其包括具有一对端子电极的大致平行六面体形状的芯片部件和根据所述端子电极设置的一对金属端子部。 端子电极通过从芯片部件的端面缠绕在一部分侧面上而形成。 金属端子部分包括连接到端子电极并且包括大致平行于端面延伸的连接面的连接部分，多个连接部分连接到连接部分并且包括沿连接面的不同方向延伸的接合面， 以及连接到接合部分的多个安装部件，并且包括安装部分上表面，该安装部分上表面通过采取预定的空间而大致平行于与接合面的不同方向的任何一个侧面延伸。
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公开(公告)号：US20190080841A1
公开(公告)日：2019-03-14
申请号：US16121719
申请日：2018-09-05
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Kenichi INOUE , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
CPC classification number: H01G2/065 , H01G4/01 , H01G4/12 , H01G4/232 , H01G4/248 , H01G4/30 , H01G4/38 , H05K3/341 , H05K2201/10431
Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.
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Patent Agency Ranking
公开(公告)号：US20180286584A1
公开(公告)日：2018-10-04
申请号：US15928752
申请日：2018-03-22
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Katsumi KOBAYASHI , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
CPC classification number: H01G4/1227 , H01G2/06 , H01G2/065 , H01G4/005 , H01G4/12 , H01G4/232 , H01G4/2325 , H01G4/30
Abstract: A ceramic electronic device includes a chip component and a pair of metal terminals. The component includes a rectangular-parallelepiped element body having dielectrics and internal electrodes and a pair of terminal electrodes covering end surfaces of the body and a part of side surfaces of the body. The pair of metal terminals respectively has an engagement arm portion configured to hold the component. The terminal electrode includes first and second side surfaces. The first side surface has a predetermined side-surface electrode thickness. The second side surface is disposed farther from the end surface of the body than the first side surface and has the side-surface electrode thickness which is smaller than that of the first side surface. The arm portion contacts with the component at a position that is farther from the end surface of the body than the first side surface.
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公开(公告)号：US20180182553A1
公开(公告)日：2018-06-28
申请号：US15854523
申请日：2017-12-26
Applicant: TDK CORPORATION
Inventor： Kosuke YAZAWA , Norihisa ANDO , Masahiro MORI , Sunao MASUDA , Kayou MATSUNAGA
CPC classification number: H01G4/248 , H01G4/1227 , H01G4/224 , H01G4/2325 , H01G4/30 , H01G4/38
Abstract: A ceramic electronic device includes a chip component, a pair of metal terminal portions, and a case. The metal terminal portion includes a terminal connection portion and a mount portion. The terminal connection portion faces a chip end surface and is connected with a terminal electrode. The mount portion is electrically connected with the terminal connection portion, extends toward a center substantially vertically to the chip end surface, and faces the chip component with a predetermined space. The case has a pair of case end walls sandwiching the pair of metal terminal portions from both sides and holding the chip component between the pair of metal terminal portions.
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公开(公告)号：US20170186539A1
公开(公告)日：2017-06-29
申请号：US15391312
申请日：2016-12-27
Applicant: TDK CORPORATION
Inventor： Sunao MASUDA , Katsumi KOBAYASHI , Masahiro MORI , Kayou MATSUNAGA , Norihisa ANDO
Abstract: An electronic device includes a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode and an external terminal electrically connected to the terminal electrode. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable to a mounting surface. The terminal electrode connection part includes a multilayer structure of a first metal connected to the terminal electrode, a second metal arranged outside the first metal, and a third metal arranged outside the second metal. A thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body.
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公开(公告)号：US20160351333A1
公开(公告)日：2016-12-01
申请号：US15142530
申请日：2016-04-29
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou KUSANO
CPC classification number: H01G4/40 , H01C7/02 , H01C7/021 , H01C7/18 , H01G2/14 , H01G4/232 , H01G4/258
Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a side surface on which an electrode portion of a first external electrode is disposed and a side surface of a second element body oppose each other. The electrode portion of the first external electrode and a fourth external electrode are connected to each other, and the connection conductor and a third external electrode are connected to each other.
Abstract translation: 第一金属端子包括连接到第二外部电极的电极部分的第一连接部分和从第一连接部分延伸的第一腿部部分。 第二金属端子包括连接到连接导体的导体部分的第二连接部分和从第二连接部分延伸的第二支腿部分。 多层电容器和过电流保护器件以这样的方式设置，使得设置第一外部电极的电极部分的侧表面和第二元件体的侧表面彼此相对。 第一外部电极的电极部分和第四外部电极彼此连接，并且连接导体和第三外部电极彼此连接。
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公开(公告)号：US20190304689A1
公开(公告)日：2019-10-03
申请号：US16353747
申请日：2019-03-14
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The holding pieces are formed on the terminal body. A connection member configured to connect the terminal body and the end surface of the terminal body exists in a joint region between the terminal body and the end surface of the terminal electrode. A pair of reinforcement pieces is formed on the terminal body so as not to overlap with the joint region in a direction extending from one to the other of the pair of holding pieces.
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