公开(公告)号：US20140055910A1

公开(公告)日：2014-02-27

申请号：US13973514

申请日：2013-08-22

Applicant: TDK Corporation

Inventor： Sunao MASUDA ,  Katsumi Kobayashi ,  Akitoshi Yoshii ,  Kazuyuki Hasebe ,  Takashi Komatsu ,  Kayou Kusano

IPC: H01G4/01

CPC classification number: H01G4/01 ,  H01G2/06 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38

Abstract: A ceramic electronic component comprising; including a chip component of approximately rectangular parallelepiped, a first metal terminal portion having a first flat plate portion facing a first end face, at least a pair of first fitting arm portions connected to the first flat plate portion, having a first engagement projection engaging with a first wraparound portion holding the first wraparound portion in between, and a first mounting portion connected to the first flat plate portion and extending approximately parallel to one side face, and a second metal terminal portion having a second flat plate portion facing the second end face, at least a pair of second fitting arm portions connected to the second flat plate portion, having a second engagement projection engaging with a second wraparound portion, holding the second wraparound portion in between, and a second mounting portion extending approximately parallel to one side face

Abstract translation: 一种陶瓷电子部件，包括： 包括大致长方体的芯片部件，具有面向第一端面的第一平板部的第一金属端子部，与第一平板部连接的至少一对第一嵌合臂部， 保持第一环绕部分之间的第一环绕部分和连接到第一平板部分并且大致平行于一个侧面延伸的第一安装部分和具有面向第二端面的第二平板部分的第二金属端子部分 至少一对连接到第二平板部分的第二装配臂部分，具有与第二包围部分接合的第二接合突起，将第二环绕部分保持在其间，以及大致平行于一个侧面延伸的第二安装部分

公开(公告)号：US20190304691A1

公开(公告)日：2019-10-03

申请号：US16369813

申请日：2019-03-29

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/228 ,  H01G4/12 ,  H01G4/012 ,  H01G4/30

Abstract: An electronic device assembly includes a first electronic device, a second electronic device, and a connection member. The first electronic device includes a first metal terminal configured to hold a first chip component. The second electronic device includes a second metal terminal configured to hold a second chip component. The connection member connects the first electronic device and the second electronic device.

公开(公告)号：US20190206626A1

公开(公告)日：2019-07-04

申请号：US16197870

申请日：2018-11-21

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/248 ,  H01G4/232 ,  H01G4/38 ,  H01G4/30

Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes an element body containing laminated internal electrodes and a terminal electrode formed outside the element body to connect with ends of the internal electrodes. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes an electrode facing portion, a holding portion, and a mount portion. A connection member connecting between the electrode facing portion and the end surface of the terminal electrode exists in a joint region in a predetermined range. A non-joint region is formed between an edge of the joint region and the holding portion. A non-joint gap between the electrode facing portion and the end surface of the terminal electrode becomes larger toward the holding portion in the non-joint region.

公开(公告)号：US20190080842A1

公开(公告)日：2019-03-14

申请号：US16121701

申请日：2018-09-05

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/01 ,  H01G4/232 ,  H05K3/34 ,  H01G4/30 ,  H01G4/38

Abstract: An electronic device includes a chip component and a metal terminal. The metal terminal is connected with the chip component. The metal terminal includes an electrode facing portion and a holding portion. The electrode facing portion is arranged correspondingly with an end surface of the terminal electrode of the chip component. The holding portion holds the chip component. A space region between the electrode facing portion and the end surface of the terminal electrode includes a joint region and a non-joint region. In the joint region, a connection member connects the electrode facing portion and the end surface of the terminal electrode. The non-joint region is formed without the connection member between a periphery of the joint region and the holding portion.

公开(公告)号：US20180294100A1

公开(公告)日：2018-10-11

申请号：US15938561

申请日：2018-03-28

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/248 ,  H01G4/30 ,  H01G4/008 ,  H01G4/12

Abstract: An electronic device includes a chip component and an external terminal. The chip component includes a terminal electrode formed on an end surface of a ceramic element body containing an internal electrode. The external terminal includes a first end electrically connected with the terminal electrode and a second end disposed opposite to the first end and connected with a mounting surface. The external terminal includes a first metal and a second metal different from the first metal. The first metal and the second metal are alternately exposed on a surface of the external terminal.

公开(公告)号：US20160343504A1

公开(公告)日：2016-11-24

申请号：US15142580

申请日：2016-04-29

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou KUSANO

IPC: H01G2/16 ,  H01G4/232 ,  H01G4/005 ,  H01G2/14 ,  H01G4/30

CPC classification number: H01G2/16 ,  H01G2/065 ,  H01G2/14 ,  H01G4/232 ,  H01G4/30 ,  H01G4/40 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10181 ,  H05K2201/10515 ,  H05K2201/10522 ,  Y02P70/611

Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a first principal surface and a third side surface oppose each other. An electrode portion of a first external electrode and an electrode portion of a fourth external electrode are connected to each other.

Abstract translation: 第一金属端子包括连接到第二外部电极的电极部分的第一连接部分和从第一连接部分延伸的第一腿部部分。 第二金属端子包括连接到连接导体的导体部分的第二连接部分和从第二连接部分延伸的第二支腿部分。 多层电容器和过电流保护装置以使第一主面和第三侧面彼此相对的方式设置。 第一外部电极的电极部分和第四外部电极的电极部分彼此连接。