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    Printable device wafers with sacrificial layers
    21.
    发明授权
    Printable device wafers with sacrificial layers 有权

    公开(公告)号：US11469259B2

    公开(公告)日：2022-10-11

    申请号：US17167945

    申请日：2021-02-04

    Applicant: X Display Company Technology Limited

    Inventor： Christopher Bower ,  Etienne Menard ,  Matthew Meitl ,  Joseph Carr

    IPC: H01L29/04 ,  H01L27/12 ,  H01L21/84 ,  H01L21/3065 ,  H01L21/3205 ,  H01L21/768 ,  H01L29/786

    Abstract: Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. The semiconductor active layer and the sacrificial layer may be selectively etched in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. The capping layer and the first portion of the semiconductor active layer may be selectively etched to thereby expose the sacrificial layer. The sacrificial layer may be selectively removed from between the first portion of the semiconductor active layer and the handling substrate to thereby define a suspended integrated circuit chip encapsulated by the capping layer.

    Electrically parallel fused LEDs
    22.
    发明授权
    Electrically parallel fused LEDs 有权

    公开(公告)号：US10917953B2

    公开(公告)日：2021-02-09

    申请号：US15704630

    申请日：2017-09-14

    Applicant: X Display Company Technology Limited

    Inventor： Matthew Meitl ,  Ronald S. Cok ,  Christopher Bower

    IPC: H05B33/08 ,  H05B45/50 ,  H01L27/15 ,  G09G3/34 ,  H01L21/66 ,  H01L33/62 ,  H01L27/02 ,  H01L23/52

    Abstract: An LED component comprises a plurality of fused light-emitting diodes (LEDs) (e.g., micro-transfer printable or micro-transfer printed LEDs). Each fused LED comprises an LED with first and second LED electrical connections for providing power to the LED and a fuse with first and second fuse electrical connections. The first LED electrical connection is electrically connected to the first electrode. The first fuse electrical connection is electrically connected to the second LED electrical connection and the second fuse electrical connection is electrically connected to the second electrode. A fused LED source wafer comprises an LED wafer having a patterned sacrificial layer forming an array of sacrificial portions separated by anchors and a plurality of fused LED components, each fused LED component disposed entirely on or over a corresponding sacrificial portion. A light-emission system comprises a system substrate and a plurality of fused LED components disposed on or over the system substrate.

    Devices with a single metal layer
    24.
    发明授权
    Devices with a single metal layer 有权

    公开(公告)号：US11374086B2

    公开(公告)日：2022-06-28

    申请号：US17405323

    申请日：2021-08-18

    Applicant: X Display Company Technology Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  Carl Prevatte ,  Ronald S. Cok

    IPC: H01L27/32 ,  H01L27/15 ,  H01L27/146 ,  H01L25/075 ,  H01L33/62

    Abstract: A single metal layer device, such as a display or sensor, comprises a substrate and a patterned metal layer. The patterned metal layer forms a two-dimensional array of spatially separated column line segments that each extend only partially across the display substrate in a column direction and forms a one-dimensional array of row lines extending across the display substrate in a row direction different from the column direction. The row lines and column line segments are electrically separate in the patterned metal layer. Spatially separated electrical jumpers are disposed on the display substrate and electrically connect pairs of column line segments adjacent in the column direction. Each electrical jumper has an independent jumper substrate independent of and separate from the display substrate. In certain embodiments, spatially separated light-emitting pixel circuits are disposed on a display substrate and are electrically connected to at least one row line and one column line.

    Chiplets with connection posts
    25.
    发明授权
    Chiplets with connection posts 有权

    公开(公告)号：US11276657B2

    公开(公告)日：2022-03-15

    申请号：US16543015

    申请日：2019-08-16

    Applicant: X Display Company Technology Limited

    Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

    IPC: H01L23/00 ,  H05K3/34 ,  H05K1/11 ,  H05K3/30

    Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

    LED structure with polarized light emission
    26.
    发明授权
    LED structure with polarized light emission 有权

    公开(公告)号：US11137641B2

    公开(公告)日：2021-10-05

    申请号：US15617726

    申请日：2017-06-08

    Applicant: X Display Company Technology Limited

    Inventor： Ronald S. Cok ,  Christopher Bower ,  Matthew Meitl

    IPC: G02F1/13357 ,  G02F1/1335

    Abstract: A light-emitting diode (LED) structure includes an LED substrate having a first side and a second side opposing the first side. One or more light-emitting diodes are disposed on the first side and arranged to emit light through the LED substrate. In certain embodiments, a wire-grid polarizer is disposed on the second side and arranged to polarize light emitted from the one or more light-emitting diodes. A plurality of different colored LEDs or an LED with one or more color-conversion materials can be provided on the LED substrate to provide white light. A spatially distributed plurality of the LED structures can be provided in a backlight for a liquid crystal display. A polarization-preserving transmissive diffuser can diffuse light emitted from the LED toward the liquid crystal layer and a polarization-preserving reflective diffuser can diffuse light emitted from the LED away from the liquid crystal layer.

    Micro-transfer-printable flip-chip structures and methods
    28.
    发明授权
    Micro-transfer-printable flip-chip structures and methods 有权

    公开(公告)号：US10964583B2

    公开(公告)日：2021-03-30

    申请号：US16544737

    申请日：2019-08-19

    Applicant: X Display Company Technology Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  António José Marques Trindade ,  Ronald S. Cok ,  Brook Raymond ,  Carl Prevatte

    IPC: H01L21/683 ,  H01L23/00 ,  H01L33/00 ,  H01L33/38 ,  H01L33/62

    Abstract: In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.

    Micro-transfer printable electronic component
    29.
    发明授权
    Micro-transfer printable electronic component 有权

    公开(公告)号：US10930623B2

    公开(公告)日：2021-02-23

    申请号：US16181263

    申请日：2018-11-05

    Applicant: X Display Company Technology Limited

    Inventor： Ronald S. Cok ,  Christopher Bower ,  Matthew Meitl ,  Carl Prevatte, Jr.

    IPC: H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L25/075 ,  H01L25/16 ,  H01L33/62

    Abstract: A micro-transfer printable electronic component includes one or more electronic components, such as integrated circuits or LEDs. Each electronic component has device electrical contacts for providing electrical power to the electronic component and a post side. A plurality of electrical conductors includes at least one electrical conductor electrically connected to each of the device electrical contacts. One or more electrically conductive connection posts protrude beyond the post side. Each connection post is electrically connected to at least one of the electrical conductors. Additional connection posts can form electrical jumpers that electrically connect electrical conductors on a destination substrate to which the printable electronic component is micro-transfer printed. The printable electronic component can be a full-color pixel in a display.

    Printable component structure with electrical contact
    30.
    发明授权
    Printable component structure with electrical contact 有权

    公开(公告)号：US10777521B2

    公开(公告)日：2020-09-15

    申请号：US14823917

    申请日：2015-08-11

    Applicant: X Display Company Technology Limited

    Inventor： Matthew Meitl ,  Christopher Bower ,  Ronald S. Cok

    IPC: H01L23/00 ,  H05K1/11 ,  H05K3/34 ,  H05K3/30

    Abstract: A printable component structure includes a chiplet having a semiconductor structure with a top side and a bottom side, one or more top electrical contacts on the top side of the semiconductor structure, and one or more bottom electrical contacts on the bottom side of the semiconductor structure. One or more electrically conductive spikes are in electrical contact with the one or more top electrical contacts. Each spike protrudes from the top side of the semiconductor structure or a layer in contact with the top side of the semiconductor structure.

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