Abstract:
A method for protecting a material of a microstructure comprising the material and a noble metal layer against undesired galvanic etching during manufacture, the method comprises forming on the structure a sacrificial metal layer having a lower redox potential than the material, the sacrificial metal layer being electrically connected to the noble metal layer.
Abstract:
A method for protecting a material of a microstructure comprising said material and a noble metal layer against undesired galvanic etching during manufacture comprises forming on the structure a sacrificial metal layer having a lower redox potential than said material, the sacrificial metal layer being electrically connected to said noble metal layer.
Abstract:
A method of providing a MEMS device, such as an AFM probe, having a three-sided pyramidal protrusion is made using a multitude of MEMS method steps. To allow the reliable and speedy manufacture of such a MEMS device having a three-sided protrusion on a massive scale, wherein the protrusion has a relatively small half-cone angle and a single apex, a mold is used. The mold includes a sacrificial layer on top of a base substrate. The method of providing the MEMS device includes:
providing an area at the first side of the mold which area comprises a pit with a layer of protrusion material, patterning the layer of protrusion material to the desired shape, and isotropically etching the sacrificial layer of the mold with an isotropic etchant capable of etching the sacrificial layer so as to separate the MEMS device from at least the base substrate of the mold.
Abstract:
The present invention relates to a cantilever or membrane comprising a body and an elongated beam attached to the body. The elongated beam includes a first layer comprising a first material, a second layer comprising a second material having an elastic modulus different to that of the first material, a third layer comprising a third material having an elastic modulus different to that of the first material, where the first layer is sandwiched between the second layer and the third layer.
Abstract:
A method of manufacturing a plurality of through-holes in a layer of first material, for example for the manufacturing of a probe comprising a tip containing a channel. To manufacture the through-holes in a batch process, a layer of first material is deposited on a wafer comprising a plurality of pits a second layer is provided on the layer of first material, and the second layer is provided with a plurality of holes at central locations of the pits; using the second layer as a shadow mask when depositing a third layer at an angle, covering a part of the first material with said third material at the central locations, and etching the exposed parts of the first layer using the third layer as a protective layer.
Abstract:
A process for manufacturing an interaction system of a microelectromechanical type for a storage medium, the interaction system provided with a supporting element and an interaction element carried by the supporting element, envisages the steps of: providing a wafer of semiconductor material having a substrate with a first type of conductivity and a top surface; forming a first interaction region having a second type of conductivity, opposite to the first type of conductivity, in a surface portion of the substrate in the proximity of the top surface; and carrying out an electrochemical etch of the substrate starting from the top surface, the etching being selective with respect to the second type of conductivity, so as to remove the surface portion of the substrate and separate the first interaction region from the substrate, thus forming the supporting element.
Abstract:
Disclosed is a method for manufacturing a microcantilever having a predetermined thickness that includes forming a liquid synthetic resin for cantilevers to a thickness corresponding to the thickness of the microcantilever on an upper surface of a base block having an adhesive base and a non-adhesive base, and curing the liquid synthetic resin for cantilevers via a boundary between the adhesive base and the non-adhesive base, wherein the adhesive base has stronger adhesivity to the cured synthetic resin for cantilevers than the non-adhesive base.
Abstract:
Methods for fabricating ultra-sharp nanoprobes can include the steps of providing a wafer, and patterning a silicon layer on the wafer with a plurality of geometric structures. The geometric structures can be patterned using electron-beam lithography or photolithography, and can have circular, triangular or other geometric shapes when viewed in top plan. The methods can further include the step of depositing a non-uniform cladding on the geometric structures using plasma enhanced chemical vapor deposition (PECVD) techniques, and then wet-etching the wafer. The non-uniform nature of the cladding can result in more complete etching in the areas where the cladding has lower density and incomplete etching in the areas of higher density of the non-uniform cladding. The different etching rates in the proximity of at least adjacent two geometric structures can result in the formation of ultra-sharp nanoprobes.
Abstract:
To provide nanotweezers and a nanomanipulator which allow great miniaturization of the component and are capable of gripping various types of nano-substances such as insulators, semiconductors and conductors and of gripping nano-substances of various shapes. Electrostatic nanotweezers 2 are characterized in that the nanotweezers 2 are comprised of a plurality of nanotubes whose base end portions are fastened to a holder 6 so that the nanotubes protrude from the holder 6, coating films which insulate and cover the surfaces of the nanotubes, and lead wires 10, 10 which are connected to two of the nanotubes 8, 9; and the tip ends of the two nanotubes are freely opened and closed by means of an electrostatic attractive force generated by applying a voltage across these lead wires. Furthermore, by way of forming a piezo-electric film 32 on the surface of the nanotube 9, and the tip ends of the nanotubes are freely opened and closed by expanding and contracting the piezo-electric film, thus allowing any desired nano-substances to be handled regardless of whether the nano-substances are insulators, semiconductors or conductors. Furthermore, if by way of designing three nanotubes so as to be freely opened and closed by an electrostatic system, nano-substances of various shapes such as spherical, rod-form, etc. can be handled. Moreover, a nanomanipulator that is constructed by combining the nanotweezers with a three-dimensional driving mechanism facilitates the gripping, moving and releasing of nano-substances.
Abstract:
To provide nanotweezers and a nanomanipulator which allow great miniaturization of the component and are capable of gripping various types of nano-substances such as insulators, semiconductors and conductors and of gripping nano-substances of various shapes. Electrostatic nanotweezers 2 are characterized in that the nanotweezers 2 are comprised of a plurality of nanotubes whose base end portions are fastened to a holder 6 so that the nanotubes protrude from the holder 6, coating films which insulate and cover the surfaces of the nanotubes, and lead wires 10, 10 which are connected to two of the nanotubes 8, 9; and the tip ends of the two nanotubes are freely opened and closed by means of an electrostatic attractive force generated by applying a voltage across these lead wires. Furthermore, by way of forming a piezo-electric film 32 on the surface of the nanotube 9, and the tip ends of the nanotubes are freely opened and closed by expanding and contracting the piezo-electric film, thus allowing any desired nano-substances to be handled regardless of whether the nano-substances are insulators, semiconductors or conductors. Furthermore, if by way of designing three nanotubes so as to be freely opened and closed by an electrostatic system, nano-substances of various shapes such as spherical, rod-form, etc. can be handled. Moreover, a nanomanipulator that is constructed by combining the nanotweezers with a three-dimensional driving mechanism facilitates the gripping, moving and releasing of nano-substances.